Skyworks Solutions, Inc.

Sige Semiconductor, Inc.

Research in Motion Corporation

Other

Nortel Networks Corporation

Microsemi Corporation

Grant Darcy Poulin

Edward John Wemyss Whittaker

David Richard Pehlke

Craig Joseph Christmas

Paul T DiCarlo

Gordon Glen Rabjohn

Apostolos Samelis

Alan J A Trainor

William John Domino

Bharatjeet Singh Gill

Alan Trainor

Samir Hammadi

Peter Ledel Gammel

Gregory Edward Babcock

Dominique Michel Yves Brunel

Gong Bin Tang

John Jackson Nisbet

Michael John Ball

Alasdair Bruce

Neal J Tuffy

Honeycomb cavity waveguides are disclosed. In certain embodiments, a mobile device includes an antenna and a front-end system. The front-end system includes a radio frequency circuit that outputs a radio frequency signal, and a plurality of honeycomb cavity waveguides arranged in an array. The plurality of honeycomb cavity waveguides includes a first honeycomb cavity waveguide that guides the radio frequency signal to the antenna.

Honeycomb cavity waveguide

Apparatus and methods for diplexing by antenna structure are provided. In certain embodiments, a mobile device includes a front end system and an antenna structure. The front end system includes a first signal conditioning circuit configured to condition a first radio frequency signal of a first frequency, and a second signal conditioning circuit configured to condition a second radio frequency signal of a second frequency that is lower than the first frequency. The antenna structure is configured to diplex the first radio frequency signal and the second radio frequency signal, and includes a first antenna configured to handle the first radio frequency signal and a second antenna electromagnetically coupled to the first antenna and configured to handle the second radio frequency signal.

Apparatus and methods for diplexing by antenna structure

Reconfigurable patch antenna systems are provided herein. In certain embodiments, a mobile device includes a patch antenna configured to handle a radio frequency signal at a signal feed. The patch antenna includes a plurality of antenna segments. The front-end system further includes a plurality of switches each configured to control connection of a respective one of the first plurality of antenna segments to the first signal feed, and a control circuit configured to control the plurality of switches to provide a frequency adjustment to the patch antenna.

Patch antenna with reconfigurable size for frequency control

Apparatus and methods for wirelessly communicating using antennas are disclosed. In certain embodiments, an antenna system includes a first radio frequency signal conditioning circuit configured to condition a first radio frequency signal of a first frequency, a plurality of second radio frequency signal conditioning circuits configured to condition a plurality of second radio frequency signals of a second frequency that is greater than the first frequency, a plurality of switches operable in a first mode and a second mode, and an antenna array of including a plurality of antenna elements interconnect by the plurality of switches. The antenna array is operable to handle the first radio frequency signal in the first mode, and to handle the plurality of second radio frequency signals in the second mode.

Frequency range two antenna array with switches for joining antennas for frequency range one communications

A power amplifier module including an input configured to receive an input radio frequency signal, the input radio-frequency signal including a series of data symbols, an output configured to provide an output radio-frequency signal, a power amplifier having a signal input to receive the input radio-frequency signal and a power supply input to receive a supply voltage, the power amplifier configured to amplify the input radio-frequency signal to provide the output radio-frequency signal, and a controller to receive an indication of a peak output power level of an upcoming data symbol in the series of data symbols, to adjust at least the supply voltage provided to the power amplifier based on the peak output power level of the upcoming data symbol, and to configure the power amplifier module to maintain a substantially constant gain over the series of data symbols.

ISO-gain implementation for a WiFi symbol-power-tracking architecture

A method of forming a flip-chip integrated circuit die that includes a front side including active circuitry formed therein and a plurality of bond pads in electrical communication with the active circuitry, at least two through-wafer vias in electrical communication with the active circuitry and extending at least partially though the die and having portions at a rear side of the die, and a bond wire external to the die and electrically coupling the portions of the at least two through-wafer vias to one another at the rear side of the die.

Backside metalization with through-wafer-via processing to allow use of high Q bond wire inductances

A power amplifier module that includes a power amplifier having a plurality of amplifier gain stages, a memory device including a plurality of memory locations, and a controller to receive a control signal having at least one of a first state and a second state. The plurality of memory locations includes at least one first memory location to store a first set of configuration parameters for operation in a first mode, and at least one second memory location to store a second set of configuration parameters for operation in a second mode. The controller configures the power amplifier module in the first mode based on the first set of configuration parameters responsive to receiving the control signal having the first state and configures the power amplifier module in the second mode based on the second set of configuration parameters responsive to receiving the control signal having the second state.

Multi-mode power amplifier

A flip-chip integrated circuit die includes a front side including active circuitry formed therein and a plurality of bond pads in electrical communication with the active circuitry, at least two through-wafer vias extending at least partially though the die and having portions at a rear side of the die, and a bond wire external to the die and electrically coupling the portions of the at least two through-wafer vias at the rear side of the die.

Backside metalization with through-wafer-via processing to allow use of high q bondwire inductances

A temperature compensation circuit comprises a temperature coefficient circuit that generates a temperature coefficient that is temperature dependent and a compensation circuit that generates a compensation signal based on an indication of temperature of an amplifier and the temperature coefficient, and based on the compensation signal, a gain of the amplifier is adjusted to improve amplifier linearity during data bursts.

Temperature compensated power amplifier gain

Apparatus and methods for power amplifiers that can operate under a wide range of supply voltages are disclosed herein. In certain implementations, a method of adjusting a parameter of a power amplifier is provided. The method includes detecting a value of a supply voltage provided to the power amplifier. The method further includes selecting a first value from a plurality of values for a first parameter of the power amplifier based on the detected value of the supply voltage. The method further includes adjusting the first parameter of the power amplifier to the first value.

Apparatus and methods for multi-supply voltage power amplifiers

Disclosed are systems and methods related to reducing intermodulation products in an RF output signal by matching an impedance of the power amplifier to an impedance of the antenna and concurrently blocking signals having a second fundamental frequency received by the antenna when the antenna is transmitting to inhibit intermodulation products of the first and second fundamental frequencies from re-radiating from the antenna. The matching and blocking are performed concurrently by a single circuit with combined matching and blocking functionality.

Combined output matching network and filter for power amplifier with concurrent functionality

Apparatus and methods for orienting power amplifiers are disclosed herein. In certain implementations, a method of determining the physical orientation of power amplifiers laid out on a printed circuit board (PCB) is provided. The method includes determining an amount of emissions radiated by a first power amplifier die that is positioned in a first orientation on the PCB. The method further includes determining an amount of emissions radiated by a second power amplifier die that is positioned in a second orientation on the PCB. The method further includes determining a third orientation of the second power amplifier die different than the second orientation, such that when the second power amplifier die is in the third orientation, the amount of emissions radiated by the first power amplifier die and the amount of emissions radiated by the second power amplifier die are distributed in different directions.

Methods for reducing radiated emissions from power amplifiers

A system improve amplifier efficiency of operation relative to that of an amplifier with fixed biasing is operating channel dependent. A control circuit determines a bias current for an amplifying transistor of an amplifier circuit based at least in part on an operating channel. The amplifying transistor operates in a multi-channel system, where the bias current for the amplifying transistor operating at channels at an edge of a channel band is different from the bias current for the amplifying transistor operating at channels nearer a center of the channel band.

Growing community of inventors

Carp, Canada

Grant Darcy Poulin