Sun Microsystems, Inc.

Graham Bestwick

Paul Jeffrey Garnett

Jay Kevin Osborn

Nigel D Ritson

Helenaur Wilson

Various embodiments of a heat sink assembly are disclosed. In one embodiment, the heat sink assembly includes a processor mounted onto a circuit board; a heat sink located in thermal contact with the processor at the side of the processor opposite circuit board; and an electromagnetic shielding member located between the circuit board and the heat sink. The electromagnetic shielding member is releasably attached to the circuit board. Additionally, or in the alternative, the heat sink is biased toward the processor by a load spring and the electromagnetic shielding member is configured to provide a spring force between the circuit board and the heat sink, counter directional to the bias from the load spring.

Support and grounding structure

A housing is provided for a modular computer system. The housing comprises a face through which a first removable computer system module is receivable at a module receiving location. The housing also comprises a barrier movable between a first position wherein the barrier is operable to obstruct a flow of air through the module receiving location and a second position in which the computer system module is received in the module receiving location.

Computer system cooling

An electromagnetic (EM) shielding assembly includes an electrically conductive shielding portion and one or more electrically conductive protrusions for engaging with respective conductive apertures in a circuit board. The electrically conductive protrusions can be in electrical communication with the EM shielding portion. The protrusions can enable the EM shielding assembly to be attached to a circuit board in a computer system while also providing an electrical connection to logical ground. Further components, for example a heat sink that may be in electrical communication with the EM shielding portion, may thereby also be connected to logical ground.

Grounding mechanism retention feature

An electronics assembly, for example a computer, comprises an enclosure, and a heat-generating component located within the enclosure. A duct extends from the region of an aperture in a wall of the enclosure to the component and a fan is located within the duct to cause a flow of air from outside the enclosure directly to the heat-generating component.

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Newbury, United Kingdom

Graham Bestwick