Kla Tencor Corporation

Kla Corporation

Kla-tencor Technologies Corporation

Grace Hsiu-Ling Chen

Lisheng Gao

Jing Zhang

David W Shortt

Kenong Wu

Kris Bhaskar

Jamie Michael Sullivan

Qiang Q Zhang

Rainer Knippelmeyer

Gary Janik

Alan D Brodie

Tao-Yi Fu

Robert M Danen

Gabor D Toth

Keith B Wells

Daniel L Cavan

Wenjian Cai

Rex Runyon

Doug Keith Masnaghetti

Steve Yifeng Cui

Mikhail Haurylau

Dieter Wilk

David Trease

Kuljit Virk

Meier Yitzhak Brender

Rohit Bothra

Steve Short

Suwipin Martono

Shobhit Verma

Abdurrahman Sezginer

Shing Lee

Christopher Sears

Ashok V Kulkarni

Hong Xiao

Richard Wallingford

Brian Duffy

Scott Allen Young

Wayne McMillan

Lawrence Muray

Mark Shi Wang

Junqing Huang

John Gerling

Shiow-Hwei Hwang

Laurent Karsenti

Jeremy Nesbitt

Evan R Mapoles

Qibiao Chen

Huan Jin

Greg Kirk

Ping Gu

John Rouse

Martin Gruebele

Amir Bar

Xianzhao Peng

Nick Petrone

Nan Bai

An inspection is disclosed. The system may include an illumination source configured to illuminate a sample. The sample may include a multi-layer stack including a plurality of layers formed of a first material and at least a second material. The first material may include a light transmissive material and the second material may include light reflective material. A top layer within the stack may include absorptive markers configured to selectively bind to the top layer. The absorptive markers may be configured block light transmission through layers positioned below the top layer. The top layer may include photoluminescent markers configured to selectively bind to the light reflective material to enhance a feature of interest on the sample. The system may include detectors configured to detect photoluminescent emission emitted by the photoluminescent markers and optical elements may be configured to direct the photoluminescent emission to the detectors.

System and method for reducing sample noise using selective markers

A method is disclosed. The method may include generating a first optical image of a sample with a first inspection sub-system. The first optical image may be generated when a first set of photoluminescent markers are emitting photoluminescent illumination at a first time interval. The method may include generating additional optical images with an additional inspection sub-system. The additional optical images may be generated when additional photoluminescent markers are emitting photoluminescent illumination at additional time intervals. The method may include generating an accumulated optical image based on the first optical image and the additional optical images. The method may include determining a location of the photoluminescent markers based on the accumulated optical image. The method may include determining a pattern of the sample based on the determined location of the photoluminescent markers.

Multi-element super resolution optical inspection system

A system is disclosed. In one embodiment, the system includes a scanning electron microscopy sub-system including an electron source configured to generate an electron beam and an electron-optical assembly including one or more electron-optical elements configured to direct the electron beam to the specimen. In another embodiment, the system includes one or more grounding paths coupled to the specimen, the one or more grounding paths configured to generate one or more transmission signals based on one or more received electron beam-induced transmission currents. In another embodiment, the system includes a controller configured to: generate control signals configured to cause the scanning electron microscopy sub-system to scan the portion of the electron beam across a portion of the specimen; receive the transmission signals via the one or more grounding paths; and generate transmission current images based on the transmission signals.

Defect inspection and review using transmissive current image of charged particle beam system

Multi-beam e-beam columns and inspection systems that use such multi-beam e-beam columns are disclosed. A multi-beam e-beam column configured in accordance with the present disclosure may include an electron source and a multi-lens array configured to produce a plurality of beamlets utilizing electrons provided by the electron source. The multi-lens array may be further configured to shift a focus of at least one particular beamlet of the plurality of beamlets such that the focus of the at least one particular beamlet is different from a focus of at least one other beamlet of the plurality of beamlets.

Field curvature correction for multi-beam inspection systems

A scanning electron microscopy system with improved image beam stability is disclosed. The system includes an electron beam source configured to generate an electron beam and a set of electron-optical elements to direct at least a portion of the electron beam onto a portion of the sample. The system includes an emittance analyzer assembly. The system includes a splitter element configured to direct at least a portion secondary electrons and/or backscattered electrons emitted by a surface of the sample to the emittance analyzer assembly. The emittance analyzer assembly is configured to image at least one of the secondary electrons and/or the backscattered electrons.

Method and system for charged particle microscopy with improved image beam stabilization and interrogation

Methods and systems for generating a high resolution image for a specimen from one or more low resolution images of the specimen are provided. One system includes one or more computer subsystems configured for acquiring one or more low resolution images of a specimen. The system also includes one or more components executed by the one or more computer subsystems. The one or more components include a model that includes one or more first layers configured for generating a representation of the one or more low resolution images. The model also includes one or more second layers configured for generating a high resolution image of the specimen from the representation of the one or more low resolution images.

Generating high resolution images from low resolution images for semiconductor applications

The present disclosure is directed to a system for inspecting a sample with multiple wavelengths of illumination simultaneously via parallel imaging paths. The system may include at least a first detector or set of detectors configured to detect illumination reflected, scattered, or radiated along a first imaging path from a selected portion of the sample in response to the first wavelength of illumination and a second detector or set of detectors configured to concurrently detect illumination reflected, scattered, or radiated along a second imaging path from the selected portion of the sample (i.e. the same location on the sample) in response to the second wavelength of illumination, where the second imaging path may at least partially share illumination and/or detection optics with an autofocus channel.

Inspection system including parallel imaging paths with multiple and selectable spectral bands

An inspection system includes an illumination sub-system, a collection sub-system, and a controller. The illumination sub-system includes an illumination source configured to generate a beam of illumination and a set of illumination optics to direct the beam of illumination to a sample. The collection sub-system includes a set of collection optics to collect illumination emanating from the sample and a detector configured to receive the collected illumination from the sample. The controller is configured to acquire a test image of the sample, reconstruct the test image to enhance the resolution of the test image, and detect one or more defects on the sample based on the reconstructed test image.

Systems and methods for defect detection using image reconstruction

Methods and systems for generating simulated output for a specimen are provided. One method includes acquiring information for a specimen with one or more computer systems. The information includes at least one of an actual optical image of the specimen, an actual electron beam image of the specimen, and design data for the specimen. The method also includes inputting the information for the specimen into a learning based model. The learning based model is included in one or more components executed by the one or more computer systems. The learning based model is configured for mapping a triangular relationship between optical images, electron beam images, and design data, and the learning based model applies the triangular relationship to the input to thereby generate simulated images for the specimen.

Generating simulated output for a specimen

Hybrid inspectors are provided. One system includes computer subsystem(s) configured for receiving optical based output and electron beam based output generated for a specimen. The computer subsystem(s) include one or more virtual systems configured for performing one or more functions using at least some of the optical based output and the electron beam based output generated for the specimen. The system also includes one or more components executed by the computer subsystem(s), which include one or more models configured for performing one or more simulations for the specimen. The computer subsystem(s) are configured for detecting defects on the specimen based on at least two of the optical based output, the electron beam based output, results of the one or more functions, and results of the one or more simulations.

Hybrid inspectors

Methods and systems for detecting defects on a wafer using defect-specific and multi-channel information are provided. One method includes acquiring information for a target on a wafer. The target includes a pattern of interest (POI) formed on the wafer and a known defect of interest (DOI) occurring proximate to or in the POI. The method also includes detecting the known DOI in target candidates by identifying potential DOI locations based on images of the target candidates acquired by a first channel of an inspection system and applying one or more detection parameters to images of the potential DOI locations acquired by a second channel of the inspection system. Therefore, the image(s) used for locating potential DOI locations and the image(s) used for detecting defects can be different.

Detecting defects on a wafer using defect-specific and multi-channel information

An inspection system with selectable apodization includes a selectably configurable apodization device disposed along an optical pathway of an optical system. The apodization device includes one or more apodization elements operatively coupled to one or more actuation stages. The one or more actuation stages are configured to selectably actuate the one or more apodization elements along one or more directions. The inspection system includes a control system communicatively coupled to the one or more actuation stages. The control system is configured to selectably control an actuation state of at the one or more apodization elements so as to apply a selected apodization profile formed with the one or more apodization elements.

System and method for apodization in a semiconductor device inspection system

Methods and systems for filtering scratches from wafer inspection results are provided. One method includes generating a defect candidate map that includes image data for potential defect candidates as a function of position on the wafer and removing noise from the defect candidate map to generate a filtered defect candidate map. The method also includes determining one or more characteristics of the potential defect candidates based on portions of the filtered defect candidate map corresponding to the potential defect candidates. In addition, the method includes determining if each of the potential defect candidates are scratches based on the one or more characteristics determined for each of the potential defect candidates and separating the potential defect candidates determined to be the scratches from other defects in inspection results for the wafer.

Scratch filter for wafer inspection

Growing community of inventors

Los Gatos, CA, United States of America

Grace Hsiu-Ling Chen