Applied Materials, Inc.

Govinda Raj

Kadthala Ramaya Narendrnath

Robert Hirahara

Simon Yavelberg

Wendell Glenn Boyd, Jr

Bopanna Ichettira Vasantha

Ashish Bhatnagar

Stanley Wu

Lin Zhang

Ramprakash Sankarakrishnan

Umesh M Kelkar

Matthew James Busche

Goichi Yoshidome

Cariappa Achappa Baduvamanda

Vilen K Nestorov

Hanish Kumar

Hamid Mohiuddin

Ian Widlow

Tom K Cho

Cheng-Hsiung Matt Tsai

Manjunatha P Koppa

Sudhir R Gondhalekar

Ramesh Gopalan

Hanish Kumar Panavalappil Kumarankutty

Charles G Potter

Jim Zhongyi He

Wendell Glen Boyd, Jr

Daniel Martin

Monika Agarwal

Ross Marshall

Gary U Keppers

Bopanna Ichettria Vasantha

Ravikumara Kodinaganhalli

Francisco Rodarte

Aravind Dugganna Naik

Bopanna Vasanth

Prashanth Rao

Bopanna Ichettria

Robert T Hirahara

Examples disclosed herein relate to a method and apparatus for inspecting lamp dimensions. The method includes determining an actual measurement of a lamp. The lamp is configured to heat a substrate in a substrate processing apparatus. A window is generated, the window having a width and a height. The window is based upon a target measurement of the lamp. The method further includes generating a deviation based upon a difference between an image of the actual measurement and the window. The deviation is compared to a first threshold. The lamp is rejected if the deviation is outside the first threshold.

Apparatus and method for inspecting lamps

A component, a method of manufacturing a component, and a method of cleaning a component is provided. The component includes a gas flow system within the component, wherein the gas flow system fluidly couples one or more inlet holes and one or more outlet holes. The manufacturing of the component results in an arc shaped groove and a circumferential groove created in the body of the ring. The component undergoes one or more cleaning operations, including rinsing, baking, or purging operations. The cleaning operations remove debris or particles in or on the component, where the debris or particles can be caused during manufacturing of the component, or during use of the component in a semiconductor processing system.

Component, method of manufacturing the component, and method of cleaning the component

Embodiments disclosed herein include a substrate support having a sensor assembly, and processing chamber having the same. In one embodiment, a substrate support has a puck. The puck has a workpiece support surface and a gas hole exiting the workpiece support surface. A sensor assembly is disposed in the gas hole and configured to detect a metric indicative of a deflection of a workpiece disposed on the workpiece support surface, wherein the sensor assembly is configured to provide the benefit of allowing gas to flow past the sensor assembly when positioned in the gas hole.

Substrate support with real time force and film stress control

A chamber component for a processing chamber is disclosed herein. In one embodiment, a chamber component for a processing chamber includes a component part body having unitary monolithic construction. The component part body has a textured surface. The textured surface includes a plurality of independent engineered macro features integrally formed with the component part body. The engineered macro features include a macro feature body extending from the textured surface.

3D printed chamber components configured for lower film stress and lower operating temperature

Methods of forming a metallic-ceramic brazed joint are disclosed herein. The method of forming the brazed joint includes deoxidizing the surface of metallic components, assembling the joint, heating the joint to fuse the joint components, and cooling the joint. In certain embodiments, the brazed joint includes a conformal layer. In further embodiments, the brazed joint has features in order to reduce stress concentrations within the joint.

Brazed joint and semiconductor processing chamber component having the same

An edge ring and process for fabricating an edge ring are disclosed herein. In one embodiment, an edge ring includes an annular body and a plurality of thermal breaks disposed within the annular body. The thermal breaks are disposed perpendicular to a center line of the annular body of the edge ring.

Edge ring for a substrate processing chamber

A heater for a semiconductor processing chamber is disclosed that includes a ceramic body, and a resistive heating element embedded in the ceramic body, the resistive heating element disposed in a heater coil having an inner central sector and an outer central sector, the inner central sector having a plurality of first peaks and the outer central sector having a plurality of second peaks, wherein the number of first peaks is less than about fifty-six, and the number of second peaks is less than about eighty.

Heated substrate support

Methods for chucking and de-chucking a substrate from an electrostatic chucking (ESC) substrate support to reduce scratches of the non-active surface of a substrate include simultaneously increasing a voltage applied to a chucking electrode embedded in the ESC substrate support and a backside gas pressure in a backside volume disposed between the substrate and the substrate support to chuck the substrate and reversing the process to de-chuck the substrate.

Substrate chucking and dechucking methods

Disclosed herein is a method of measuring the chucking force of an electrostatic chuck. The method comprises placing a sensor wafer onto the electrostatic chuck, wherein the sensor wafer comprises a plurality of pressure sensors, and applying a chucking voltage to the electrostatic chuck. The method further comprises measuring the chucking force with the plurality of pressure sensors to determine a first chucking force profile of the electrostatic chuck, and processing a plurality of wafers on the electrostatic chuck. The method further comprises placing the sensor wafer onto the electrostatic chuck, and applying the chucking voltage to the electrostatic chuck. The method further comprises measuring the chucking force with the plurality of pressure sensors to determine a second chucking force profile of the electrostatic chuck.

Method and apparatus for direct measurement of chucking force on an electrostatic chuck

Embodiments disclosed herein include a substrate support having a sensor assembly, and processing chamber having the same. In one embodiment, a substrate support has a puck. The puck has a workpiece support surface and a gas hole exiting the workpiece support surface. A sensor assembly is disposed in the gas hole and configured to detect a metric indicative of a deflection of a workpiece disposed on the workpiece support surface, wherein the sensor assembly is configured to allow gas to flow past the sensor assembly when positioned in the gas hole.

Techniques are disclosed for methods and apparatuses for reducing particle contamination formation in a high temperature processing chamber with a cooled gas feed block. The cooled gas feed has a body. The body has a main center portion having a top surface and a bottom surface. The body also has a flange extending outward from the bottom surface of the main center portion. A gas channel is disposed through the body. The gas channel has an inlet formed in the top surface of the main center portion and an outlet formed in the bottom surface of the main center portion. The body also has a center coolant channel. The center coolant channel has a first portion having an inlet formed in the top surface of the main center portion, and a second portion coupled to the first portion, the second portion having an outlet formed a sidewall of the flange.

Cooled gas feed block with baffle and nozzle for HDP-CVD

Embodiments disclosed herein include a faceplate having a sensor assembly, a processing chamber having the same, and a method for monitoring a substrate in a processing chamber. In one embodiment, a faceplate is configured to introduce processing gases into a plasma processing chamber. The faceplate has one or more holes. A sensor assembly is disposed in the one or more holes. The sensor assembly has a sensor and a controller.

Substrate distance monitoring

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Bengaluru, India

Govinda Raj