Kla Tencor Corporation

Govind Thattaisundaram

Ashok V Kulkarni

Mohan Mahadevan

Ajay Gupta

Jason Kirkwood

Songnian Rong

Kenong Wu

Eugene Shifrin

Chien-Huei (Adam) Chen

Chien-Huei Adam Chen

Ernesto Escorcia

Various embodiments for determining parameters for wafer inspection and/or metrology are provided.

Data perturbation for wafer inspection or metrology setup using a model of a difference

Methods and systems for determining inspection scenarios without input from a user are presented. Inspection scenarios include at least one acquisition mode, defect detection parameter values, and classification parameter values. In one example, a number of defect events are determined by a hot inspection of a wafer surface. The defect events are classified and attributes associated with each defect event are identified. The defect events are labeled with this information. Based on the identified attributes and classification, inspection scenarios are determined. The inspection scenarios are solutions in a mathematical space formed by the identified attributes. In some examples, a plurality of inspection scenarios are determined and a desired inspection scenario is selected from the plurality based on the number of defects of interest and the number of nuisance events captured by the selected inspection scenario.

Automated inspection scenario generation

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Santa Clara, CA, United States of America

Govind Thattaisundaram