Denka Company Limited

Denki Kagaku Kogyo Kabushiki Kaisha

Gosuke Nakajima

Hiroyuki Kurimura

Hayato Miyazaki

Tomoya Tsukui

Makiko Sasaki

Kazuhiro Oshima

Yoshitsugu Goto

Yoshiyuki Kobayashi

Tomoyuki Kanai

Takako Hoshino

Isamu Ichikawa

Shinya Serizawa

Kenji Tanaka

Tomoaki Tanaka

Shigeru Tanaka

Masanobu Kutsumi

Yasunori Hayashi

An object of the present invention is to provide a composition comprising components of (1) to (3): (1) a polymerizable monomer comprising components of (1-1) to (1-3): (1-1) a tricyclic monofunctional (meth)acrylate in which the tricyclic ring is alicyclic, (1-2) a tricyclic bifunctional (meth)acrylate in which the tricyclic ring is alicyclic, and (1-3) a bifunctional (meth)acrylate having a bisphenol structure; (2) a polymerization initiator; and (3) a reducing, and wherein (1) the polymerizable monomer comprises 40 to 75% by mass of (1-1) the tricyclic monofunctional (meth)acrylate, 10 to 40% by mass of (1-2) the tricyclic bifunctional (meth)acrylate, and 15 to 40% by mass of the (1-3) the bifunctional (meth)acrylate having the bisphenol structure.

Composition

Provided is an adhesive composition having high adhesiveness to polyamides. An adhesive composition for bonding adherends comprising a polyamide, comprising the following components (1) to (4): (meth)acrylates (1), excluding the component (2), comprising the following ingredients (1-1), (1-2), and (1-3): a (meth)acrylate (1-1), excluding an ingredient (1-3), having an aromatic group; a (meth)acrylate (1-2) having a hydroxy group; and a (meth)acrylate (1-3) represented by general formula (A); an acidic phosphate compound (2); a polymerization initiator (3); and a reducing agent (4) comprising a transition metal salt. 

Adhesive composition

An adhesive sheet for laser dicing is provided that is capable of, in laser dicing by irradiation with laser light through the adhesive sheet, suppressing laser light scattering in the adhesive sheet while allowing easy chip division by expanding the adhesive sheet and enables inhibition of dust attachment during chip division for chip production in high yields. The present invention provides an adhesive sheet for laser dicing, including a substrate film having a back layer containing a friction reducing agent and an antistatic agent on one surface and having an adhesive layer on another surface, wherein the back layer has a surface with arithmetic mean roughness Ra of 0.1 &#x3bc;m or less, the sheet has a tensile modulus of elasticity at 23&#xb0; C. from 50 to 200 MPa, and the sheet has a parallel transmittance of 85% or more in a wavelength range from 400 to 1400 nm.

Adhesive sheet for laser dicing and method for manufacturing semiconductor device

A heat-resistant adhesive sheet for semiconductor testing, used in a performance test while semiconductor chips are heated includes: a base material; and an adhesive layer provided on the base material, the base material having a thermal shrinkage of lower than 1% when being heated at 150 degrees Celsius for 30 minutes and a linear expansion coefficient of equal to or lower than 5.0&#xd7;10at 60 to 150 degrees Celsius, and the adhesive layer containing a (meth)acrylic acid ester copolymer, a photopolymerizable compound, a polyfunctional isocyanate curing agent, and photoinitiator. The adhesive layer contains 5 to 200 parts by mass of the photopolymerizable compound, 0.5 to 20 parts by mass of the polyfunctional isocyanate curing agent, and 0.1 to 20 parts by mass of the photoinitiator, with respect to 100 parts by mass of the(meth)acrylic acid ester copolymer. The adhesive layer is free of tackifying resin.

Heat-resistant adhesive sheet for semiconductor testing

An adhesive sheet is provided that is capable of inhibiting scraping up of an adhesive in the dicing step, does not cause chip detachment during dicing processing, facilitates picking up, and does not readily develop adhesive transfer. According to the present invention, an adhesive sheet is provided that comprises a substrate film and an adhesive layer laminated on the film, wherein the adhesive layer contains 100 parts by mass of a (meth)acrylate copolymer, from 5 to 250 parts by mass of a photopolymerizable compound, from 20 to 160 parts by mass of a softener, from 0.1 to 30 parts by mass of a curing agent, and from 0.1 to 20 parts by mass of a photopolymerization initiator, and the photopolymerizable compound has a weight average molecular weight from 40,000 to 220,000.

Adhesive sheet and method of manufacturing electronic component

A heat resistant adhesive sheet is provided that does not easily develop deformation of an adhesive sheet due to heating. Such an adhesive sheet made by laminating an adhesive layer to a substrate is provided, characterized in that the substrate is heat shrinkable and the adhesive layer contains a (meth)acrylate copolymer, a photopolymerizable compound, a polyfunctional isocyanate curing agent, and a photopolymerization initiator and does not substantially contain a tackifying resin. This adhesive sheet is not deformed even when heated. Since the adhesive does not substantially contain a tackifying resin, softening of the adhesive layer does not occur even when the sheet is heated.

Heat-resistant adhesive sheet for semiconductor inspection and semiconductor inspection method

Provided is a method of manufacturing a translucent rigid substrate laminate to improve a positional precision. Further, a translucent rigid substrate bonding apparatus contributing to improvement of the positional precision while increasing production efficiency of a plate-shaped product is provided. In the method of manufacturing the translucent rigid substrate laminate and the translucent rigid substrate bonding apparatus according to the present invention, when translucent rigid substrates are bonded in a predetermined positional relationship by interposing a photo-curable fixing agent therebetween, the entire fixing agent interposed and spreading between both translucent rigid substrates is cured everytime the translucent rigid substrates are bonded.

Method of manufacturing translucent rigid substrate laminate and translucent rigid substrate bonding apparatus

Provided is a method for manufacturing a translucent rigid substrate laminate which can improve a thickness precision while decreasing the risk of fractures. In the method for manufacturing a translucent rigid substrate laminate according to the present invention, translucent rigid substrates are placed opposite to each other such that bonding surfaces thereof are parallel to each other, both rigid substrates are brought toward each other while being kept parallel, the both rigid substrates are preliminarily bonded using a photo-curable fixing agent, the bonded translucent rigid substrates are roll-pressed, and the fixing agent is then cured.

Method of manufacturing translucent rigid substrate laminate

Disclosed are a probe inspecting method for confirming the state of a probe for inspecting electric characteristics of an object to be inspected; and a curable resin composition for use in the method. The method is applied to repeat inspections and comprises the steps of bringing a cured resin of a curable resin composition into contact with a probe for inspecting electric characteristics of an object to be inspected, transferring a probe mark of the probe to the cured resin, confirming the state of the probe based on the transferred probe mark, and, after the transfer of the probe mark of the probe, heating the cured resin to a temperature at or above the glass transition temperature of the cured resin to erase the probe mark of the probe.

Probe inspecting method and curable resin composition

Provided is a method of manufacturing a translucent rigid substrate laminate to improve a positional precision while increasing production efficiency. Further, a translucent rigid substrate bonding apparatus contributing to improvement of the positional precision while increasing production efficiency of a plate-shaped product is provided. In the method of manufacturing the translucent rigid substrate laminate and the translucent rigid substrate bonding apparatus according to the present invention, when translucent rigid substrates are bonded in a predetermined positional relationship by interposing a photo-curable fixing agent therebetween, only the fixing agent present on an outer boundary portion of both translucent rigid substrates is cured for provisional fastening.

Growing community of inventors

Shibukawa, Japan

Gosuke Nakajima