Mitsubishi Electric Corporation

Goro Yasutomi

Yukimasa Hayashida

Ryutaro Date

Kazuhiro Morishita

Shigeru Hasegawa

Ryo Tsuda

Isao Umezaki

A semiconductor chip () is connected to a metal pattern (). A shear drop surface () of an electrode () is bonded to the metal pattern (). A burr () is formed at an end portion of the burr surface () of the electrode (). A crushing amount of the end portion of the burr surface () is equal to or less than 10 μm.

Methods for manufacturing a semiconductor device

A base plate, and a plurality of unit structures formed on the base plate are provided. Each of the unit structures including an insulating substrate fixed on the base plate, a metal pattern formed on the insulating substrate, a semiconductor element electrically connected to the metal pattern, and a main electrode having an upper end portion exposed to the outside and a lower end portion connected to a peripheral portion of the metal pattern closest to an outer edge of the base plate.

Semiconductor device

It is an object of the present invention to provide a semiconductor module that reduces an excessive stress on a sealed object due to the expansion and contraction of a sealing gel to thus improve the reliability. A semiconductor module according to the present invention includes: a semiconductor element bonded to a metal pattern on an insulating substrate contained in a case; a sealing gel sealing the insulating substrate and the semiconductor element within the case; and a sealing-gel-expansion suppressing plate disposed in the upper portion of the sealing gel to be at least partially in contact with the sealing gel. The sealing-gel-expansion suppressing plate includes a surface facing the sealing gel and inclined to the upper surface of the sealing gel.

Semiconductor module

An electrode () is joined to a wiring substrate (). A nut box () is inserted in the bent portion () of the electrode () so that the nut () is positioned in alignment with the opening () of the electrode (). A case () covers the wiring substrate (). The nut box () and the case () are members separate from each other. The nut box () is fixed in the electrode () so as not to come off from the bent portion).

It is an object of the present invention to provide an easily assemblable semiconductor device including a cover that covers a top of a case and is reliably fixed to the case defining an outline of the semiconductor device. A semiconductor device according to the present invention includes: a case defining an outline of the semiconductor device; a cover covering a top of the case; and a fastener mechanically fixing the cover to the case, a through-hole is formed in the cover, the case includes a projection inserted into the through-hole, and the fastener is attachable to the projection inserted into the through-hole of the cover from the outside of the cover and locks the projection upon the attachment to prevent the projection from falling off the through-hole.

Growing community of inventors

Fukuoka, Japan

Goro Yasutomi