Rohm Co., Ltd.

Rohn Co., Ltd.

Goro Nakatani

Mizuho Okada

Nobuhisa Yamashita

Yasuhiro Fuwa

Kazutaka Shibata

Junichi Hikita

Toma Fujita

Shigeyuki Ueda

Katsumi Sameshima

Nobuhisa Kumamoto

Masahiro Sakuragi

Koichi Niino

Akira Fujita

Hitoshi Tamura

Hiroo Mochida

Masatoshi Nakanishi

Yoshihiro Tada

Tatsuya Sakamoto

Kazuya Nakakubo

Nobukazu Kise

Provided is a thermal print head including: a substrate having a convex part thereon; a wiring layer over the convex part; a heat storage layer over the wiring layer; a heating resistive part that is formed over the heat storage layer and is arranged along a main scanning direction; a first electrode in contact with the heating resistive part on one side in a sub-scanning direction; a second electrode in contact with the heating resistive part on another side in the sub-scanning direction; and a connection wiring formed in an opening that passes through the heating resistive part and the heat storage layer and reaches the wiring layer, in which the first electrode is electrically connected to the wiring layer via the connection wiring.

Thermal print head, manufacturing method of the same, and thermal printer

The present disclosure provides a thermal print head. The thermal print head includes a substrate, having a main surface facing one side in a thickness direction; a resistor layer, including a plurality of heat generating portions arranged in a main scanning direction and supported by the substrate; and a wiring layer, forming a power path to the plurality of heat generating portions and supported by the substrate. The substrate includes a convex portion protruding from the main surface and extending along the main scanning direction. The convex portion includes: a flat first surface on which each of the plurality of heat generating portions is disposed; and a first curved convex surface connected to the first surface.

Thermal print head, thermal printer and methods fabricating thereof

The present disclosure provides a thermal print head. The thermal print head includes a substrate having a main surface and a convex portion and including a semiconductor material; a resistor layer including a plurality of heat generating portions located on the convex portion; and a wiring layer conducted to the plurality of heat generating portions and formed to contact the resistor layer. The convex portion has a top surface, a first inclined surface and a second inclined surface. The first inclined surface and the second inclined surface are disposed between the main surface and the top surface, separated from each other in a sub-scanning direction, and tilted with respect to the main surface. A first tilted angle of the first inclined surface with respect to the main surface and a second tilted angle of the second inclined surface with respect to the main surface are greater than 55 degrees.

Thermal print head and manufacturing method thereof

The present disclosure provides a method for manufacturing a thermal print head. The method includes: forming an electrode layer on a substrate; and forming a resistor layer including a plurality of heat generating portions connected to the electrode layer. The electrode layer includes a plurality of individual electrodes including a plurality of first striped portions extending in a secondary scan direction and spaced apart in a main scan direction, and a common electrode including a plurality of second striped portions extending in the secondary scan direction. The forming of the resistor layer includes: a coating process of applying a resistor paste in a stripe that overlaps the first striped portions and the second striped portions; a firing process of firing the resistor paste to form a resistor film; and a removal process of removing a removal region in the resistor paste or the resistor film.

Manufacturing method of thermal print head

The present disclosure provides a thermal print head for achieving fine printing. A thermal print head of the disclosure includes: a substrate, having a substrate main surface and a substrate back surface facing opposite sides in a z direction; a resistor layer, disposed on a side of the substrate main surface and including a plurality of heat generating portions arranged in a main scan direction to generate heat by energization; a wiring layer, disposed on the side of the substrate main surface and including a conduction path for electrically conducting the plurality of heat generating portions; a metal layer, interposed between the substrate and the wiring layer with the resistor layer; and an insulating layer, interposed between the metal layer and the wiring layer with the resistor layer. The conduction path includes the metal layer. The metal layer includes tantalum (Ta).

Thermal print head

The present disclosure provides a thermal print head and a method manufacturing thereof and a thermal printer including the thermal print head, which are capable of suppressing low manufacturing efficiency and enhancing wear-resistance against a recording medium. The thermal print head includes: a substrate, having a main surface facing a thickness direction; a resistance layer, including multiple heating portions arranged in a main scan direction and formed on the main surface; a wiring layer, formed on the resistance layer and connected to the heating portions; and a protection layer, covering a part of the main surface, the heating portions and the wiring layer.

Thermal print head, manufacturing method of thermal print head, and thermal printer

A thermal printhead includes a substrate having an obverse surface, a projection formed on the obverse surface and extending in a primary scanning direction, a plurality of heating elements arranged in the primary scanning direction on the top of the projection, a groove dented from the top of the projection and extending in the primary scanning direction, and a heat storage member filling at least an opening of the groove.

Thermal printhead

A thermal print head includes a substrate; a protrusion formed on an obverse surface of the substrate and extending in a main scanning direction; heat generating parts disposed on a top surface of the protrusion and arranged along the main scanning direction; and columnar heat storage members embedded in the protrusion and disposed in a given area having a width in a sub-scanning direction and being elongated in the main scanning direction. Each of the columnar heat storage members is elongated in a thickness direction of the substrate and has an upper end and a lower end, with the upper end being disposed at the same level of the top surface of the protrusion.

Thermal print head and method of manufacturing the same

A thermal printhead includes a substrate, a protrusion formed on an obverse surface of the substrate and extending in a main scanning direction, a heat storage layer formed on a top surface of the protrusion, and a plurality of heat-generating parts arranged along the main scanning direction on the heat storage layer. The substrate and the protrusion are integrally formed from a single-crystal semiconductor.

Thermal printhead and method of manufacturing the same

A MEMS sensor according to the present invention includes a base substrate including a displaceably supported movable portion and a lid substrate covering the movable portion and functioning as a magnetic sensor that detects magnetism by making use of the Hall effect.

MEMS sensor, method for manufacturing the same, and MEMS package including the same

A capacitance type MEMS sensor has a first electrode portion and a second electrode portion facing each other. The sensor includes a semiconductor substrate having a recess dug in a thickness direction of the semiconductor substrate, the recess having sidewalls, one of which serves as the first electrode portion. The sensor further includes a diaphragm serving as the second electrode portion, the diaphragm arranged within the recess to face the first electrode portion in a posture extending along a depth direction of the recess, the diaphragm having a lower edge spaced apart from the bottom surface of the recess, and is made of the same material as the semiconductor substrate. The sensor further includes an insulating film arranged to join the diaphragm to the semiconductor substrate.

Capacitance type MEMS sensor

A probe card includes a board or silicon substrate; a plurality of probes (terminals) at a first surface of the board, the respective probes having a first extending portion extending along the first surface of the board; a plurality of through-holes formed in correspondence to the respective probes and penetrating between the first and second surfaces of the board; through electrodes embedded in the respective through-holes and conductively connected to the probes in the respective through-holes; and a wiring at the second surface of the board conductively connected to the through electrodes, the wiring having a second extending portion extending along the second surface of the board, wherein the first extending portion and the second extending portion extend in different directions from each other, and a space is formed across the entire width of the first extending portion between the first extending portion and the first surface of the board.

Probe card

A capacitive pressure sensor includes a semiconductor substrate, a first insulating portion configured to define a sensor region, a reference pressure chamber configured to divide a lower portion of the sensor region in a direction, a second insulating portion configured to divide a surface portion of the sensor region above the reference pressure chamber in the direction, and a trench configured to divide the sensor region in the direction. The sensor region is divided into at least three semiconductor parts by the reference pressure chamber, the second insulating portion, and the trench.

Capacitive pressure sensor, manufacturing method thereof, and pressure sensor package

A capacitive pressure sensor includes: a semiconductor substrate having a reference pressure chamber formed therein; a diaphragm which is formed in a front surface of the semiconductor substrate and has a ring-like peripheral through hole penetrating between the front surface of the semiconductor substrate and the reference pressure chamber and defining an upper electrode and a plurality of central through holes; a peripheral insulating layer which fills the peripheral through hole and electrically isolates the upper electrode from other portions of the semiconductor substrate; and a central insulating layer which fills the central through holes.

Capacitive pressure sensor and method of manufacturing the same

A capacitance type gyro sensor includes a semiconductor substrate, a first electrode integrally including a first base portion and first comb tooth portions and a second electrode integrally including a second base portion and second comb tooth portions, formed by processing the surface portion of the semiconductor substrate. The first electrode has first drive portions that extend from opposed portions opposed to the respective second comb tooth portions on the first base portion toward the respective second comb tooth portions. The second electrode has second drive portions formed on the tip end portions of the respective second comb tooth portions opposed to the respective first drive portions. The first drive portions and the second drive portions engage with each other at an interval like comb teeth.

Growing community of inventors

Kyoto, Japan

Goro Nakatani