Schneider Electric It Corporation

Gorm Gamborg

Carsten Nommensen Tingskov

Kristian Silberbauer

Preben Bonde

A method for controlling an uninterruptible power supply (UPS) having a polyphase power input and an input power circuit coupled to the polyphase power input includes determining to reduce a load on a first phase of the polyphase power input, and in response thereto, controlling the input power circuit to reduce a first input current drawn from the first phase by a first amount and increase a second input current drawn from a second phase of the polyphase power input by a second amount. The UPS may determine to reduce the load on the first phase in response to a request from a smart grid to reduce the load on the first phase or in response to a local determination to reduce the load on the first phase.

Line balancing UPS

A method for fabricating a straight fin heat sink () of the type having a base () and a plurality of fins () extending from the base is disclosed. Each fm () of the plurality of fins of the heat sink is spaced from one another a predetermined distance and lies along a plane generally parallel to planes of the other fins of the plurality of fins. The method includes: providing a die () configured to produce a heat sink () having a base () and a plurality of fins () attached to be base in a radial fashion about the base from at least one side of the base; extruding a blank of material through the die () to produce the heat sink (); and compressing the plurality of fins () with a compression tool () so that the plurality of fins () extend from the base along planes generally parallel to each other.

Method of fabricating a heat sink

A heat dissipation device for a heat-generating component includes at least one helically-shaped air tube having a length. The at least one air tube is thermally coupled to the heat-generating component to dissipate heat from the heat-generating component. Other embodiments of the heat dissipation device and methods for dissipating heat from a heat-generating component are further disclosed.

Heat dissipation device

One aspect of the disclosure is directed to a heat sink assembly for dissipating heat from an electronic component. The heat sink assembly includes a heat sink having a base and at least one fin extending from the base. The at least one fin has an opening formed therein that is configured to receive a fastener. The heat sink assembly also includes a clip. The clip has a first portion configured to receive the fastener and at least one second portion flexibly coupled to the first portion. The at least one second portion is configured to secure the heat sink to the electronic component proximate to the base in response to a force being applied to the first portion by the fastener.

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Kolding, Denmark

Gorm Gamborg