Materials Solutions Limited

Aviza Technology Limited

Trikon Technologies Limited

Siemens Aktiengesellschaft

Trikon Holdings Limited

Gordon R Green

Robert Kenneth Trowell

Gary Proudfoot

Christopher David George

Anthony William Barrass

Paulo Edurado Lima

Robert William Teagle

A method is for additive layer manufacturing an article from a material which can be rendered solid locally by the application of a focused beam of laser radiation. The method includes providing at least two laser beams, providing a scanner for each laser beam for scanning each laser beam over an entire planar field, providing a support moveable step wise to support material within the field, scanning the laser beams simultaneously but separated over the field to render solid the desired portions of material contained in the field to perform a manufacturing cycle and stepping the support after each cycle. At least one scanner is tilted with respect to the common planar field, and the method further includes the step of tilting the focal plane of the laser beam from the said at least one scanner.

Methods for additive-layer manufacturing of an article

A method of forming an article includes forming a layer of a mixture of at least two distinct metal powders selected such that when combined they are chemically in the proportions of a superalloy containing a gamma prime phase, and fusing the powders locally without diffusion to define the shape of a part of the article such that the materials of the distinct metal powders remain substantially chemically segregated forming regions of different chemical composition. The method further includes repeating the forming and fusing until the derived article is formed, and heat treating the finished article such that at least one of the distinct separate materials diffuses to form a gamma prime phase containing superalloy with the other.

Heat treatments of ALM formed metal mixes to form super alloys

Apparatus is for additive layer manufacturing of an article from a material which can be rendered solid locally by application of a focused beam of laser radiation at a planar focal plane. The apparatus includes at least two laser beams, respective scanners for each laser beam for scanning the respective laser beams over a planar field, and a support movable stepwise to allow successive manufacturing layer cycles and for supporting material within the field. The entire planar field is common to each scanner and at least one scanner is tilted with respect to the planar field, and the at least one scanner is provided with a lens arranged to generate a focal plane tilted with respect to that scanner.

Apparatus for additive layer manufacturing of an article

The invention relates to a method of verifying a scan speed in a laser scanning system. The method includes modulating the laser of the system to form a periodically modulated feature from which the actual scan speed can be read or deduced.

Laser scan speed calibration

This invention relates to a broad beam ion deposition apparatus () including an ion source (), a target (), a tillable substrate table () and an auxiliary port (). The target () is in the form of a carousel which carries a number of targets and the ion source () is configured to produce a substantially rectangular section beam ().

Ion deposition apparatus having rotatable carousel for supporting a plurality of targets

This invention relates to an Ion gun () which comprises of plasma generator () driven from an RF source (), a plasma or source chamber (), having an outlet (), across which is mounted an accelerator grid (). The accelerator grid () comprises four individual grids. The first grid (), which is closest to the outlet (), is maintained at a positive voltage by a DC source (), the second grid () is maintained strongly negative by DC source (). The third grid () is maintained at a negative voltage, which is much lower than that of the second grid (), by DC source () and the fourth grid is grounded. Means of mounting these grids are also described.

Ion source including separate support systems for accelerator grids

1. A powder bed additive layer manufacturing system including a linear traversing re-coater and a build plate characterised in that the build plate is mounted for rotation, relative to the re-coater or movement about an axis.

Rotating build plate

This invention relates to magnetic assemblies and, in particular, to assemblies which are useful for inducing magnetic fields within vacuum chambers. Thus a magnetic assembly, generally indicated atincludes the rectangular magnetically soft corecarrying windingswhich together form the main planar electromagnet, generally indicated atand immediately adjacent the edges of the magnetare placed auxiliary coilsCoilsare each formed from windingswound around oblate coresand it would be noted that they project upwardly above the upper surface of the planar magnetPole piecesare attached to the ends of the planar magnetand these two project above the upper surface of the planar magnetThe assembly is completed by mounting brackets

Magnet assemblies

This invention relates to a shutter for use in physical vapour deposition apparatus having a chamber. The shutter, generally indicated at, is located in a side housingof the vacuum chamber, whilst sputtering is taking place. Once the substrateis treated, the substrate is removed from the chamber and the shutter is brought in to an operative position above a wafer pedestal or supportThe shutter is mounted on an armusing a fixing boss, the arm and the boss being magnetically coupled.

Shutter

A sputter apparatus ( ) includes a chamber ( ) housing a target ( ), a work piece support ( ) and a process area ( ) between the target and the support. The apparatus further includes an inlet ( ) for process gas and a pumping outlet ( ) from the process area. The inlet substantially surrounds the support and the apparatus includes a pumping outlet separate from the inlet. The inlet is shielded from the process area.

Plasma processing apparatus

This invention relates to an apparatus for depositing a layer of material on to a workpiece. The apparatus includes chamber a sputter target a wafer support wafer transport aperture and a wafer transport mechanism The last delivers the wafers along a transport path An annular shield is disposed between the support and the target and lies in the wafer transport path Pins are provided to lift the annular shield out of the transport path

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S. Glos, United Kingdom

Gordon R Green