Emc Corporation

Emc IP Holding Company LLC

Gordon O Barr

Jin Liang

Nader G Dariavach

Paul T Callahan

Francis William French

Bruce Gray

Ted Choinski

James J Paladino

Example embodiments of the present invention relate to a method, a system, and a computer program product for controlling conditions of an input air stream. The method includes detecting air quality conditions as environmental input variables of an input air stream and determining whether to take corrective action on the air quality conditions of the input air stream according to the environmental input variables. An output variable then may be controlled to affect the air quality conditions of the input air stream.

Method and system for air contamination analysis for free air cooled data centers

A magneto-caloric cooling system includes an energy absorption area configured to be positioned proximate a thermal energy producing device. At least one energy dissipation area is configured to be positioned proximate a thermal energy dissipation device. A thermal energy transfer device is configured to be cycled between the energy absorption area and the energy dissipation area. A magnetic field generation device is configured to produce a magnetic field proximate the energy dissipation area.

Magneto-caloric cooling system

A compliant pin comprises a base portion at a proximal end of the compliant pin, a tip portion at a distal end of the compliant pin, and a medial portion between the base portion and the tip portion. The medial portion includes a first arm and a second arm, and the tip portion includes first and second extensions extending from the first and second arms, respectively, the first and second extensions defining a slit therebetween.

Compliant pin, electrical assembly including the compliant pin and method of manufacturing the compliant pin

A multi-channel contaminant sensor includes a first contamination test platform including an exposed first base metal portion that react in a first manner when exposed to one or more airborne contaminates. A second contamination test platform includes an exposed second base metal portion that reacts in a second manner when exposed to the one or more airborne contaminants.

Multi-channel contaminant measurement system

A method of reducing whisker growths includes identifying a solder connection to be treated. The solder connection may contain one or more whisker growths. A heat source is applied at a defined temperature to the solder connection for a defined period of time sufficient to melt at least a portion of the one or more whisker growths. The heat source is removed from the solder connection prior to the melting of the solder connection.

Method for reducing whisker growth

An improved rework nozzle includes an open housing which when lowered onto the surface of a board forms a closed cavity. The housing includes venting means which expend air that is input to the cavity, thereby using flow through concepts to maintain a uniform temperature in the cavity. The housing also positioning mechanisms for both aligning a the housing and a captive integrated circuit to a desired footprint on the circuit board, and for limiting movement of the integrated circuit during rework.

Controlled height and flow rework nozzle

The invention is directed to techniques for inspecting a circuit board having a surface that includes at least one circuit board component. The apparatus includes a base, and a set of reflective members that includes at least one reflective member. Each reflective member of the set of reflective members is (i) supported by the base and (ii) movable relative to the base to enable that reflective member to move to an angle that reflects light from a respective portion of a circuit board component (e.g., a solder region between the component and the circuit board) in a direction away from the surface of the circuit board when the base rests on the surface of the circuit board. Since the base can rest on the surface of the circuit board, a technician does not need to hold the apparatus.

Method and apparatus for inspecting a circuit board

A nozzle applies fluid (e.g., heated gas) to a solder region of a circuit board component having a set of fluid-delivery edges and a set of fluid-escape edges. The nozzle includes a top member to connect with a fluid source, and a set of fluid-delivery side members coupled to the top member. Each fluid-delivery side member extends from the top member and around a respective fluid-delivery edge of the circuit board component when the circuit board component engages with the nozzle. Each fluid-delivery side member defines (i) at least a portion of a fluid-delivery channel that extends from a vicinity adjacent the top member toward the solder region of the circuit board component when the circuit board component engages with the nozzle, and (ii) a barrier that substantially prevents fluid from escaping from the solder region along the respective fluid-delivery edge for that fluid-delivery side member.

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Fall River, MA, United States of America

Gordon O Barr