Ferro Corporation

Gordon J Roberts

Aziz S Shaikh

Dana Lynn Hankey

Srinivasan Sridharan

Kevin W Allison

Edward Stadnicar, Jr

Clifford G Ruderer

Robert D Gardner

Thomas J Vlach

Hasan B Emlemdi

David James Leandri

S K Muralidhar

John J Maloney

Robert P Blonski

James H Heasley

Ivan H Joyce

Robert C Stroup

William D Faust

Tack J Whang

Dineen M Hopp Kolkowski

Gautam Sarkar

Subramanian Vasudevan

Sivasubraman K Muralidhar

Dineen M Hopp

The present invention provides high temperature sealing glass compositions for use in producing mechanically and chemically durable electrically insulating hermetic glass seals between materials such as zirconia, alumina, fosterite, steatite, carbon steels, stainless steels, and superalloys. High temperature sealing glass compositions according to the present invention include a glass component and optional vehicles. The glass component includes one or more glass frits containing in weight percent from about 17% to about 56% BaO+SrO, from about 18% to about 60% SiO.sub.2, from about 6% to about 36% B.sub.2 O.sub.3, from about 2% to about 32% Al.sub.2 O.sub.3, from about 0% to about 25% CaO plus MgO, from about 0% to about 20% Y.sub.2 O.sub.3, from about 0% to about 7% ZrO.sub.2, from about 0% to about 3% alkali oxides, from about 0% to about 5% Co.sub.3 O.sub.4, from about 0% to about 5% NiO, and from about 0% to about 3% MoO.sub.3. Upon firing, high temperature sealing glass compositions of the present invention produce mechanically and chemically durable hermetic glass seals which exhibit electrical resistance of greater than about 30 megaohms when measured at room temperature.

High temperature sealing glass

The present invention provides lead and cadmium free glass enamel compositions. In one embodiment of the invention, glass frits include from about 0.1 percent by weight to about 15 percent by weight Nb.sub.2 O.sub.5, less than about 3 percent by weight alkali metal oxides, less than about 3 percent by weight ZnO, less than about 1 percent by weight B.sub.2 O.sub.3, and precursors from which Bi.sub.2 SiO.sub.5 can be crystallized upon firing, said precursors including Bi.sub.2 O.sub.3 and SiO.sub.2. Glass frits according to the present invention preferably further include up to about 25 percent by weight of coloring oxides, such as CeO.sub.2, Co.sub.3 O.sub.4, In.sub.2 O.sub.3, SnO, Cr.sub.2 O.sub.3, CuO, Fe.sub.2 O.sub.3, MnO.sub.2, MoO.sub.3, NiO, and V.sub.2 O.sub.5. By incorporating various amounts of coloring oxides into the compositions, the degree of crystallization and the rate at which crystallization occurs upon firing of the compositions can be controlled. Compositions according to the present invention form enamels upon firing which exhibit excellent resistance to acids, water, and alkalis as compared to enamels formed from prior art lead and cadmium free glass enamel compositions.

Glass enamel for automotive applications

The present invention provides a new and improved coating composition for use in forming a dielectric layer upon a section of metal upon firing. The coating composition includes a glass composition, said glass composition comprising in weight percent a combined weight of BaO and SrO of from about 15% to about 75%, from about 5% to about 35% B.sub.2 O.sub.3, from about 10% to about 40% SiO.sub.2, up to about 10% Al.sub.2 O.sub.3, up to about 7% Co.sub.3 O.sub.4, up to about 20% ZnO, up to about 20% TiO.sub.2, up to about 7% P.sub.2 O.sub.5, up to about 7% CuO, up to about 7% Fe.sub.2 O.sub.3, up to about 7% NiO, a combined weight of SnO, MoO.sub.3, WO.sub.3, Sb.sub.2 O.sub.5, of up to about 20%, up to about 20% Bi.sub.2 O.sub.3, a combined weight of up to about 20% Nb.sub.2 O.sub.5, La.sub.2 O.sub.3, Y.sub.2 O.sub.3 and CeO.sub.2, up to about 5% ZrO.sub.2, up to about 20% CaO, up to about 5% MgO, up to about 2% As.sub.2 O.sub.3 and a combined weight of up to about 3% Li.sub.2 O, Na.sub.2 O and K.sub.2 O.

Porcelain enamel composition for electronic applications

The present invention provides a new and improved thick film paste for use as an acid resistant overglaze. In one preferred embodiment such paste includes a glass composition comprising in weight percent from about 30% to about 60% PbO, from about 5% to about 20% ZnO, from about 2% to about 20% B.sub.2 O.sub.3, from about 4% to about 12% Al.sub.2 O.sub.3, from about 5% to about 18% SiO.sub.2, up to about 8% ZrO.sub.2, up to about 8% TiO.sub.2 and from about 9% to about 21% Nb.sub.2 O.sub.5.

Thick film having acid resistance

This invention relates to a lead-free glass enamel for glass beverage containers and a method of decorating glass beverage containers using such glass enamel. The method includes the steps of: i) providing a glass beverage container; ii) providing a decorative lead-free glass enamel comprising a glass frit, the glass frit comprising in weight percent from 17% to 28% SiO.sub.2, from 12% to 30% B.sub.2 O.sub.3, up to 3% Al.sub.2 O.sub.3, up to 13% Na.sub.2 O, up to 13% K.sub.2 O, up to 14% TiO.sub.2, from 5% to 30% ZnO, up to 14% ZrO.sub.2, up to 6% CeO, up to 6% Y.sub.2 O.sub.3, from 1% to 8% La.sub.2 O.sub.3, up to 1% MgO, up to 5% CaO, up to 10% SrO, up to 16% BaO, from 0.5% to 5% fluoride, a maximum of 5% each of WO.sub.3, P.sub.2 O.sub.5, Bi.sub.2 O.sub.3, Sb.sub.2 O.sub.3 and MoO.sub.3, with the provisions that the sum of the levels of plus Na.sub.2 O plus K.sub.2 O is in the range of 6% to 13%, that the sum of the levels of MgO plus CaO plus SrO plus BaO is in the range of 1% to 16%, and that the sum of the levels of ZrO.sub.2 plus TiO.sub.2 plus La.sub.2 O.sub.3 plus CeO.sub.2 plus Y.sub.2 O.sub.3 is in the range of 7% to 25%; iii) applying the glass enamel to at least a portion of the surface of the glass beverage container; and iv) firing the glass beverage container at a temperature of from about 560.degree. C. to about 640.degree. C. so as to produce a resilient decorative coating on the surface of the beverage container.

Lead-free glass enamels for decorating glass beverage containers and

The present invention provides new and improved dielectric materials. In one preferred embodiment such novel dielectric material is formed by firing a composition including a glass composition comprising in weight percent from about 22% to about 45% ZnO, from about 4% to about 22% MgO, from about 1% to about 16% Al.sub.2 O.sub.3, from about 20% to about 49% SiO.sub.2, from about 2% to about 11% BaO, up to about 10% ZrO.sub.2, from about 0.05% to about 1.1% Fe.sub.2 O.sub.3 and from about 0.05% to about 0.95% PbO.

Dielectric materials

The present invention provides a method of adherently depositing a thick film composition on an aluminum nitride substrate comprising the steps of providing an aluminum nitride substrate, providing a thick film composition, and applying the thick film composition on the aluminum nitride substrate. The thick film composition includes a glass frit binder, a conductive metallic material and a lithium-containing adhesion promoting compound.

Method of bonding a conductor composition including a lithium compound

This invention relates to a lead-free glass coating made by firing a lead-free glass composition comprising in weight percent from about 35% to about 77% of bismuth oxide, from about 10% to about 33% of boron oxide, and from about 10% to about 32% of zinc oxide at a temperature sufficient to fuse and cure the glass composition. The invention also relates to lead-free glazes and enamels that exhibit excellent acid resistance, possess low coefficients of linear or thermal expansion, and moderate maturation temperatures.

Bismuth-containing lead-free glass enamels and glazes of low silica

This invention relates to a lead-free glass coating made by firing a lead-free glass enamel composition comprising a glass frit having by weight from about 20% to about 40% zinc oxide, from about 20% to about 32% boron oxide, and from about 10% to about 30% silicon dioxide, from about 0% to about 12% titanium dioxide, from about 4% to about 12% sodium oxide, from about 0% to about 10% potassium oxide, from about 0% to about 12% zirconia, up to about 4% alumina, up to about 5% lithium and up to about 5% fluorine. The lead-free glass coating exhibits excellent adhesion and improved acid resistance.

Lead-free glass coatings

A thick film paste composition adapted to be bonded onto an aluminum nitride substrate is provided which comprises (a) an electrical property regulating component present in an amount sufficient to control the electrical properties of said paste; (b) a lead free or low lead glass composition capable of bonding said electrical property regulating component to the surface of an aluminum nitride substrate.

Thick film paste compositions for use with an aluminum nitride substrate

A low dielectric, low temperature fired glass ceramic produced by firing at about 800.degree.-900.degree. C. a mixture comprising at least one glass consisting of, by weight percent, 0 to 50% B.sub.2 O.sub.3, 35 to 65% CaO, and 10 to 65% SiO.sub.2, and selected from the glasses of CaO-B.sub.2 O.sub.3 -SiO.sub.2 glass system. The glass ceramic is light weight, exhibits a dielectric constant of less than about 7.9, has adequate mechanical strength and thermal conductivity, and is compatible with precious metal conductors. The glass ceramic is useful in the manufacture of integrated circuits and any other electronic or mechanical components where a glass ceramic exhibiting this particular combination of characteristics is suitable.

Low dielectric, low temperature fired glass ceramics

A low dielectric, low temperature fired glass ceramic produced by firing at about 800.degree.-950.degree. C. a mixture comprising at least one glass consisting of, by weight percent, 0 to 50% B.sub.2 O.sub.3, 35 to 65% CaO, and 10 to 65% SiO.sub.2 l , and selected from the glasses of CaO-B.sub.2 O.sub.3 -SiO.sub.2 glass system. The glass ceramic is light weight, exhibits a dielectric constant of less than about 5.2, has adequate mechanical strength and thermal conductivity, and is compatible with precious metal conductors. The glass ceramic is useful in the manufacture of integrated circuits and any other electronic or mechanical components where a glass ceramic exhibiting this particular combination of characteristics is suitable.

The present invention provides a new and useful composition and method of using the same for producing an enamel finish on a formed section of glass. The composition partially crystallizes upon heating, thereby helping to prevent the forming and handling equipment from sticking and/or adhering to the composition during the forming operation. The composition includes a crystallizable glass frit and seed powder. The crystallized glass frit includes precursors from which Zn.sub.2 SiO.sub.4 can be crystallized upon firing of the composition. The seed powder causes at least a portion of the precursors to crystallize upon firing such that during firing at least a portion of the crystallizable glass frit yields crystallized Zn.sub.2 SiO.sub.4 formed by the precursors. Preferably, the precursors contain 30-75 wt %/5-20 wt % SiO.sub.2, and the seed powder contains crystalline Zn.sub.2 SiO.sub.4.

Partially crystallizing enamel containing Zn.sub.2 SiO.sub.4 to be used

A method of bonding a dielectric material to a substrate comprising the steps of:

Growing community of inventors

Parma, OH, United States of America

Gordon J Roberts