Innogration (suzhou) Co., Ltd.

Gordon Chiang Ma

Chu Ming Shih

A power device without a package structure in a radio frequency power amplifier module and an assembly method for a radio frequency power amplifier module are provided. The radio frequency power amplification module includes the power device, a heat dissipating plate and a printed circuit board. The power device includes a carrier flange, a plurality of electronic elements and bond-wires, and the electronic elements are adhered to the carrier flange, the power device and the printed circuit board are fixed on the heat dissipating plate, the electronic elements of the power device are connected with each other through the bond-wires, and the electronic elements are directly connected to the printed circuit board through the bond-wires. The electronic elements include at least one passive device, a decoupling capacitor is disposed on the printed circuit board, and the decoupling capacitor is connected to the passive device through the bond-wires.

Unpacked structure for power device of radio frequency power amplification module and assembly method therefor

An electronic component mounting structure, manufacturing method and an electronic component product are provided. The electronic component mounting structure comprises a printed circuit board, a metal flange, and a plurality of electronic components provided on the metal flange; a groove is provided on the printed circuit board, a metal layer is coated on a wall of the groove, the metal flange is restricted to the metal layer on the wall and is fixed in the groove, the one or more electronic components are connected to each other through a plurality of wires based on a circuit requirement, an input electrode and an output electrode are provided on the printed circuit board in a portion adjacent to the metal flange, and the input electrode and the output electrode are connected to the one or more electronic components mounted on the metal flange through wires respectively.

Electronic component mounting structure, manufacturing method and electronic component product

An unpacked structure for a power device of radio frequency power amplification module and assembly method therefor. The radio frequency power amplification module includes the power device, a heat dissipating plate and a printed circuit board, wherein the power device is embedded into the printed circuit board; the heat dissipating plate is arranged below the power device and the printed circuit board; the power device includes a carrier flange, a plurality of electronic elements and a plurality of lead wires; the electronic elements are directly welded on the carrier flange according to a design requirement; the power device and the printed circuit board are welded and fixed on the heat dissipating plate; and the electronic elements on the power device are connected with one another through the lead wires and directly connected with the printed circuit board through the lead wires.

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Jiangsu, China

Gordon Chiang Ma