Honeywell International Inc.

Alliedsignal Inc.

Oak-mitsui Inc.

Gordon C Smith

Thomas F McCarthy

David B Schwind

Scott Moore Zimmerman

John A Andresakis

Edward C Skorupski

Michael A Petti

Michael Petti

Novel polyindanebisphenols or PIBPs for the preparation of new and improved thermosetting polymers having the general formula ofare provided. Also disclosed are thermoplastic or thermoset compositions prepared using the novel compounds of the invention, as well as methods of making and using the same. When copolymerized or reactive with other commercial resins such as, e.g., epoxy compounds, PIBP based polymers are characterized by high glass transition temperature ('Tg'), low dielectric constant, low moisture absorption, low coefficient of expansion, low cost, and can be processed on equipment typically used for the production of epoxy based laminates.

Preparation of polyindanebisphenols and polymers derived therefrom

Disclosed is a metal-clad laminate product having a carrier film, a aqueous soluble release or parting layer deposited onto the carrier film and which can be mechanically separated from the carrier film, and an ultra thin metal layer deposited onto the parting layer. Also disclosed is a method for making the metal-clad laminate product.

Very ultra thin conductor layers for printed wiring boards

A capacitor, which has a pair of conductive foils each having a dielectric layer on its surface, wherein the dielectric layers are attached to one another. In one process for its production, a capacitor is formed by applying a first dielectric layer onto a surface of a first conductive foil; applying a second dielectric layer onto a surface of a second conductive foil; and then attaching the first and second dielectric layers to one another. The resulting capacitor exhibits excellent void resistance.

Formation of an embedded capacitor plane using a thin dielectric

A method for making a metal-clad laminate product including: providing a carrier film; depositing directly onto the carrier film a release agent layer, the release agent layer comprising an aqueous soluble polymer; forming a conductive metal layer on the release agent layer, the metal layer having a thickness of less than about 10,000 Angstroms; bonding the metal layer to a circuit board laminate layer; and removing the carrier film from the metal layer by peeling the carrier layer from the release agent layer.

Very ultra thin conductor-layers for printed wiring boards

A metal-clad laminate product including a carrier film, a release agent layer, a semi-transparent metal layer and a photo dielectric layer deposited on the conductive metal layer and a method for using the metal-clad laminate product to form an interlayer via by exposing at least a portion of an circuit board intermediate prepared from the metal-clad laminate product to light through the semi-transparent metal layer for a period of time sufficient to form an exposed or an unexposed photo dielectric portion and thereafter removing the exposed or unexposed portion of the photo dielectric layer and a corresponding portion of the semi-transparent metal layer overlying the exposed or unexposed portion of the photo dielectric layer to form an interlayer via.

Method of manufacturing an interlayer via and a laminate precursor useful for same

Novel polyindanebisphenols or PIBPs for the preparation of new and improved thermosetting polymers having the general formula of ##STR1## are provided. Also disclosed are thermoplastic or thermoset compositions prepared using the novel compounds of the invention, as well as methods of making and using the same. When copolymerized or reactive with other commercial resins such as, e.g., epoxy compounds, PIBP based polymers are characterized by high glass transition temperature ('Tg'), low dielectric constant, low moisture absorption, low coefficient of expansion, low cost, and can be processed on equipment typically used for the production of epoxy based laminates.

Growing community of inventors

Arlington Heights, IL, United States of America

Gordon C Smith