Avago Technologies General IP (singapore) Pte. Ltd.

Avago Technologies Ecbu IP (singapore) Pte. Ltd.

Gopinath Maasi

Thiam Siew Gary Tay

Soo Kiang Ho

Peng Siang Seet

Premkumar Jeromerajan

Thiam Siew Tay

Gary Tay

Tay Thiam Siew Gary

Gary Tay Thiam Siew

An opto-isolator with a correction circuit is disclosed. The correction circuit is configured to make adjustments for degradation of the light source of the opto-isolator. The correction circuit may comprise a photodetector for detecting degradation of the light source of the opto-isolator. When the light source degrades below a predetermined level, the correction circuit may be configured to make adjustments.

Opto-isolator with correction circuit

An optoelectronic device is disclosed. The optoelectronic device may be employed as a single or multi-channel opto-coupler that electrically isolates one circuit from another circuit. The opto-coupler may include one or more folded leads that establish an enhanced isolation gap. The enhanced isolation gap may include an interruption in the insulation of the opto-coupler between the light source and the light detector. In addition, this interruption may further include a efficiency enhancer, or lens, to direct light emitted from the light source. Accordingly, the creepage distance and operational voltages of the opto-coupler can be increased while maintaining high efficiency levels.

Face-to-face opto-coupler device and method of manufacture

An optocoupler having an optical transmitter die, an optical receiver die, a light guide, a limiting element and a body is disclosed. The light guide is confined to upper portion of the body by using the limiting element. In one embodiment, the limiting element is a dielectric tape. In yet another embodiment, the limiting element is a pre-molded plastic attached to the lead frame via non-conductive epoxy. The use of the limiting element yields light guides having consistent shape.

Optocoupler

An optocoupler with a light guide defining element is presented. The light guide defining element has at least one cavity configured to define the shape of the light guide formed by a transparent encapsulant encapsulating the optical transmitter and receiver dies. The transparent encapsulant in liquid form may be injected into the cavity prior to a curing process to harden the encapsulant into a light guide with a predetermined shape. The cavity of the light guide element may be defined by a reflective surface having micro-optics formed thereon. A multichannel optocoupler with multiple transmitter and/or receiver dies having such light guide defining element is also presented. The light guide defining element may have a single cavity enveloping all the optical transmitter or receiver dies, or a multiple cavities by having a pair of transmitter and receiver dies inside each cavity.

Optocoupler with light guide defining element

A semiconductor device and methods of manufacturing the same are disclosed. Specifically, methods and devices for manufacturing optocouplers are disclosed. Even more specifically, methods and devices that deposit one or more encapsulant materials on optocouplers are disclosed. The encapsulant material may include silicone and the devices used to deposit the silicone may be configured to simultaneously deposit the silicone on different sides of the optocoupler, thereby reducing manufacturing steps and time.

Simultaneous silicone dispension on coupler

An optocoupler with optical transmitter and receiver dies attached to a single conductive pad is presented. One of the optical transmitter and receiver dies may be attached directly to the conductive pad, while the other one of the optical transmitter and receiver dies may be attached to the conductive pad by means of three layers of materials comprising an isolation layer sandwiched between two attachment layers. A multi-channel optocoupler with multiple transmitter and/or receiver dies is also presented, in which one of the optical transmitter and receiver dies may be attached directly to the conductive pad. The other optical transmitter or receiver dies may be attached to the conductive pad by means of three layers of materials comprising an isolation layer sandwiched between two attachment layers.

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Singapore, Singapore

Gopinath Maasi