Motorola Corporation

Texas Instruments Corporation

Wisconsin Alumni Research Foundation

Gong Chen

Franco Cerrina

Robert D Colclasure

Wayne M Paulson

Shane R Palmer

Whitson G Waldo, Iii

Robert Dwayne Colclasure, Jr

A semiconductor wafer ( ) includes a first semiconductor die ( ) having a first alignment mark ( ) disposed in an alignment region ( ) to align the first semiconductor die on the wafer. A second semiconductor die ( ) has a second alignment mark ( ) disposed in the alignment region such that the second alignment mark overlaps the first alignment mark. The area occupied by the overlapping alignment marks is shared between the first and second semiconductor dice to reduce the area and the cost of each die.

Semiconductor device and alignment method

A semiconductor wafer (,) includes a first semiconductor die (,) having a first alignment mark (,) disposed in an alignment region (,) to align the first semiconductor die on the wafer. A second semiconductor die (,) has a second alignment mark (,) disposed in the alignment region such that the second alignment mark overlaps the first alignment mark. The area occupied by the overlapping alignment marks is shared between the first and second semiconductor dice to reduce the area and the cost of each die.

Alignment method for semiconductor device

A multi-level registration control system for a photolithography process includes a photolithography device that prints first, second and third layers on a wafer. A first overlay mark defines overlay errors in a first direction between the first and third layer. The first overlay mark also defines overlay errors between the second and third layers. An overlay measurement device measures the overlay errors and generates an overlay signal. A feedback controller is connected to the overlay measurement device and the photolithography device. The feedback controller receives the overlay error signal and generates and transmits an alignment correction signal to the photolithography device. The first overlay mark is a box-in-box overlay mark or a frame-in-frame overlay mark. By providing a single overlay mark to align three layers, the multi-layer overlay control system reduces scribe grid area and saves useful silicone surface area.

Multi-layer registration control for photolithography processes

A method for alignment in photolithographic processes includes providing a target (31) comprising features having a characteristic spatial period (P). An optical image of the target is captured, and components (33) of the image lacking the characteristic spatial period (P) are filtered out. The filtered image is integrated in the direction of the characteristic period (P) thereby creating an alignment signal (40). The alignment signal (40) is a symmetric signal which correlates to the symmetric target (31). A linear centroid (41) of the alignment signal is located, and corresponds to the precise linear center of the target (31). Consequently, the linear location of an object (10) upon which the target (31) is printed, can be accurately located. The process is performed in two perpendicular dimensions (x,y) so that the object (10) can be precisely located and positioned in two dimensions (x,y).

Method for alignment in photolithographic processes

An optical lithography system (10) for exposing a layer (12) of radiation sensitive material on a semiconductor wafer (16) is provided. System (10) comprises a source of polarized radiant energy (18), a mask (20) and a lens (22). Radiant energy from a light source (28) is polarized in a predetermined orientation by polarization filter (30). Polarized radiant energy passes through mask (20) and exposes layer (12) in a predetermined pattern. Actuating member (32) may rotate polarization filter (30) to provide more than one orientation for the polarized radiant energy during a single exposure.

System and method for semiconductor processing using polarized radiant

A laser using a distributed phase shift structure is disclosed. The active medium is formed in the shape of a stripe having first and second surfaces and two ends. The stripe includes a large central portion and two end portions with the central portion being of different widths than the two end portions. A laser device which utilizes the active medium of the present invention further includes at least one P-guide layer and at least one N-guide layer, both having a higher bandgap energy than the active medium. The P-guide layer and the N-guide layer are located on opposing surfaces of the active medium. A current which is injected through the N-guide layer, the P-guide layer and the active medium induces single mode, narrow linewidth coherent light to issue from the active medium.

Growing community of inventors

Madison, WI, United States of America

Gong Chen