Agilent Technologies, Inc.

Avago Technologies Fiber IP (Singapore) Pte. Ltd

Goncalo Agra Amorim

Daniel John Keeble

Christopher John Ord

David John Kenneth Meadowcroft

Hugh De Lacy

An optical package that includes a component for supporting a printed circuit board. The optical package comprises a housing containing a printed circuit board having a connecting edge for connecting to external components; an optical component supported by the printed circuit board; an optical connector for coupling the optical component to an optical fiber; and a support supporting the connecting edge.

Optical package

The assembly of a packaged opto-electronic module of a type that comprises an optical subassembly coupled to an LC housing integrally formed within the housing of the module typically results in the optical subassembly being disposed in a location having a gap between a heat sink region of the module and the optical subassembly.

Module apparatus and method of alignment

An optical device module for housing optical transmitters and receivers. Preferably, the module is designed to enable optical devices to be easily inserted into and removed from modular equipment racks. The module comprises a case for housing an optical device and a plastic panel having an aperture for receiving an optical connector, in which the plastic panel has been coated with a metal coating and is connected to the case so that the optical device is substantially enclosed.

Optical device module

A device and method for alignment of an optical fiber with an output facet of a laser diode that are to be co-located on a mount, to obtain a substantially optimum coupling efficiency. The device is particularly applicable to assemblies to be used in a submarine.

Optical fiber alignment device and method

A through-panel apparatus includes a device with at least one through-panel receptacle and at least one component removably mounted to the device by inserting the component through the receptacle. Both the device and component have between them electrical and/or optical connections that are made when the component is mounted to the device, and broken when the component is demounted from the device. To break the connections requires the application of an extraction force in a direction opposite to that of insertion of the device through the receptacle. The component has a sprung mechanism that is biased against the device when an insertion force is applied to the component along the direction of insertion during mounting of the component to the device. The biasing of the sprung mechanism provides a spring bias force that contributes to the required extraction force to aid extraction of the component from the receptacle.

Through-panel mounted component

The present invention concerns an electro-optical module assembly, which is capable of being plugged into and removed from a DWDM system. The assembly comprises an electro-optical module with horizontal grooves and vertical slots which when inserted into protrusions disposed on the module mounting device, allow for a &ldquo;drop and slot&rdquo; type insertion of the module. The present invention also integrates EMI shielding within the electro-optical module assembly.

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Ipswich, United Kingdom

Goncalo Agra Amorim