Georgia Tech Research Corporation

Gokce Gurun

F Levent Degertekin

Mustafa Karaman

Jennifer O Hasler

Michael Hochman

Jaime Zahorian

A CMUT on CMOS imaging chip is disclosed. The imaging chip can use direct connection, CMOS architecture to minimize both internal and external connection complexity. Intelligent power management can enable the chip to be used for various imaging applications with strict power constraints, including forward-looking intra-vascular ultrasound imaging. The chip can use digital logic to control transmit and receive events to minimize power consumption and maximize image resolution. The chip can be integrated into a probe, or catheter, and requires minimal external connections. The chip can comprise integrated temperature control to prevent overheating.

Compact, energy-efficient ultrasound imaging probes using CMUT arrays with integrated electronics

Capacitive micromachined ultrasonic transducer ('CMUT') devices and fabrication methods are provided. The CMUT devices can include integrated circuit devices utilizing direct connections to various CMOS electronic components. The use of integrated connections can reduce overall package size and improve functionality for use in ultrasonic imaging applications. CMUT devices can also be manufactured on multiple silicon chip layers with each layer connected utilizing through silicon vias (TSVs). External power connections can be provided if high biasing voltages are required. Forward and side looking CMUT arrays can be manufactured for use in a variety of ultrasound technologies.

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Smyrna, GA, United States of America

Gokce Gurun