Von Ardenne Anlagentechnik Gmbh

Von Ardenne Gmbh

Von Ardenne Anlagentechnik Gmgh

Von Ardenne Anlagentechnic Gmbh

Goetz Teschner

Hans-Juergen Heinrich

Enno Mirring

Falk Milde

Johannes Struempfel

Goetz Grosser

Thorsten Sander

Andreas Heisig

Ulf Seyfert

Sven Haehne

Cornell Weidelt

Joern Brueckner

Frank Meissner

Hans-Jürgen Heinrich

Harald Grune

A method is provided for coating a substrate with the aid of a magnetron cathode and two electrodes which are alternately impinged upon by a positive potential and a negative potential. Also disclosed is an assembly for coating a substrate, comprising a vacuum chamber, a magnetron cathode, two electrodes, and a voltage source. A negative potential is generated at a level that is no greater than the level of the cathode potential, thus preventing the electrode that is to be cleaned from being stripped to a greater extent than the same was coated in the previous half-wave. The magnetron cathode and the electrodes are connected to the voltage source via switching elements without being galvanically such that a negative and a positive voltage generated from the voltage source can be alternatively applied to the electrodes, the level of said voltage being no greater than the cathode voltage.

Redundant anode sputtering method and assembly

In a method in which two anodes are operated alternately opposite each other as plasma discharge anodes and as cathodes for self-cleaning, and the cathodes of the plasma discharge are recurrently briefly reversed in polarity, and an arrangement comprising a cathode and a first and a second anode supplied with voltage by an H-bridge circuit, pole reversal of cathode voltage is effected by a pulse current supply, at least one anode is maintained at positive potential at all times and the other anode intermittently at negative potential during an etching time, and the H-bridge circuit is operationally connected to the pulse current supply, such that at least one anode is at positive potential at all times.

Method and arrangement for redundant anode sputtering having a dual anode arrangement

A support device for a magnetron arrangement with a rotating target includes a housing with a drive shaft mounted to rotate in the housing. An end of the drive shaft accessible from outside of the housing connects to the rotating target and another end lies within the housing for introduction of a torque. An electric motor with a stator and a rotor is arranged within the housing to generate a torque.

Supporting device for a magnetron assembly with a rotatable target

To achieve an improved end block, in which heating by induction eddy currents, which may occur during AC sputtering, for example, is significantly reduced relative to known end blocks, an end block for a magnetron configuration having a rotating target comprises an end block housing having an attachment surface for attaching the end block on a support apparatus, a pivot bearing for rotatable mounting of the rotating target, and at least one current conduction apparatus which conducts current through the end block housing in operation of the end block. The end block housing is implemented so that each current path in the end block housing which encloses the current conduction apparatus has an interruption at least one point.

Endblock for a magnetron device with a rotatable target

A supply end block to supply a sputter cathode with a coolant and electrical voltage, includes a housing with a coolant connection and a current connection as well as a support shaft mounted to rotate, on which a target tube is fastened. The coolant connection and current connection are brought together directly at a feed site so that the coolant is brought to the potential of the applied electric voltage on entering the housing of the end block. Optimal cooling of the current feed is achieved, and optimal potential equalization of the coolant simultaneously occurs.

Supply end block for rotary magnetron

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Dresden, Germany

Goetz Teschner