Ngk Insulators, Inc.

North American Philips Corporation

Go Suzuki

Norikazu Niimi

Tadashi Otagiri

Kazuo Michishita

Tsutomu Kondo

Jagannathan Ravi

Masahiro Shirai

Yuhji Umeda

Yuji Umeda

Toshiki Goto

Minoru Ohara

Gerard Van Bockstal

Kouji Shirasu

Kazuo Michisita

The high pressure discharge lamp comprises a ceramic discharge tube containing an ionizable luminescent material and a starting gas filled in the inner space thereof, a clogging member having through-holes and at least a portion of which being fixed on the inner side of the end portion of the ceramic discharge tube, an electric conductor having an electrode system inserted in the through-holes of the clogging member, and a sealing material layer. Preferably, the sealing material layer 16A is made of a metallizing layer. In addition, the high pressure discharge-lamp comprises the ceramic discharge tube, the clogging member, the electric conductor inserted in the through-holes of the clogging member, and a metallizing layer for sealing provided so as to join to the clogging member and the electric conductor.

High pressure discharge lamp with an improved sealing system and method

A high pressure discharge lamp including: (1) a ceramic discharge tube having an interior space filled with an ionizable light-emitting material and a starting gas, the ceramic discharge tube including a main body and at least one end portion connected to an end of the main body, a corner being formed between an inner surface of the main body and an inner surface of the at least one end portion; (2) a sealing member at least partially fixed inside the at least one end portion, a through-hole being formed through the sealing member; and (3) a current conductor inserted through the through-hole of the sealing member, wherein a storing recess for storing said ionizable light-emitting material as a liquid phase therein is formed at a surface of the sealing member on a side of the interior space.

High pressure discharge lamps with sealing members

A high pressure discharge lamp having a thick film resistor comprising a plurality of resistive elements. A first resistive element is included in a starting circuit for the lamp and a second resistive element is in series with the arc tube during lamp operation for flicker elimination. The integral thick film resistor facilitates mounting and connection of the resistor elements within the lamp envelope. Favorably, the resistor substrate has a surface emissivity of greater than about 0.5, and preferably greater than about 0.9, to provide sufficient radiation cooling within an evacuated outer lamp envelope to prevent resistor failure while keeping the size of the resistor small enough for use as a component in an HID lamp. Additionally, a suitable coating of low vapor pressure thickness covers the solder connecting the metallic resistor terminals to the substrate to prevent evaporation of the solder and its deposition on the inner surface of the outer lamp envelope.

Thick film resistor for use in a vacuum and a high pressure discharge

In a ceramic joined body wherein a first metalizing layer formed on a surface of an aluminum nitride member on which semiconductor elements are installed and a second metalizing layer formed on a surface of an insulation substrate fireable at low temperatures are joined with each other via a solder used at high temperatures, an intermediate layer including a predetermined metal component and a predetermined glass component is arranged between the insulation substrate and the second metalizing layer. The glass component is melted into the insulation substrate during the firing operation, and thus a sufficient connection strength between the insulation substrate and the aluminum nitride member can be obtained. Moreover, the metal component and the glass component function to make the thermal expansion coefficient an intermediate value between the insulation substrate and the first metalizing layer, and thus heat stress generated during the brazing operation can be eliminated.

Ceramic joined body

In a multilayered ceramic substrate having a ceramic substrate fireable in low temperatures and a metal member for input/output brazed to the ceramic substrate, an intermediate layer including a ceramic component is arranged between the ceramic substrate and the metal member in such a manner that thermal coefficients .alpha..sub.1, .alpha..sub.2 and .alpha..sub.3 between a room temperature and near a brazing temperature of the metal member, the ceramic component in the intermediate layer and the ceramic layer, respectively, maintains a relation of .alpha..sub.1 &gt;.alpha..sub.2 &gt;.alpha..sub.3. Moreover, the ceramic substrate fireable in low temperatures is constructed by first ceramic layer having a flexural strength more than 25 kg/mm.sup.2 and a second ceramic layer having a dielectric constant less than 7. In these constructions, the multilayered ceramic substrate having a sufficient adhesion strength between the metal member and the ceramic substrate and a good reliability can be obtained, while advantages of the ceramic substrate fireable in low temperatures can be maintained.

Multilayered ceramic substrate fireable in low temperature

A ceramic green sheet comprises a green sheet as a core and a surface layer formed thereon. Such ceramic green sheets are laminated for use in IC package, printed circuit board or the like.

Ceramic green sheets

Ceramic substrates and method of manufacturing the same

A ceramic multi-layer printed circuit board is manufactured by forming a wiring pattern layer on a ceramic substrate through copper plating and forming an insulating layer thereon and then repeating the steps for forming both layers.

Ceramic multi-layer printed circuit boards

A ceramic structural body having electronic components thereon comprises a ceramic package of a ceramic layer having substantially uniform thickness. The package comprises a ceramic element of dish-shaped or box-shaped configuration including a base portion, a sidewall portion extending from the base portion substantially at right angles thereto and a flange portion extending from the free end of the sidewall portion substantially at right angles thereto. The ceramic package is formed by press-forming a ceramic green sheet having substantially uniform thickness. A plurality of metal layers are provided on the surface of desired portions of the ceramic element.

Ceramic structural body and a method of manufacturing the same

A ceramic body having a metallized layer which comprises a ceramic substrate and a metallized layer fired on the substrate to be integrated or further comprises a conductive layer consisting of a noble metal or noble metal alloy to be joined onto the metallized layer, the composition of the metallized layer being one or more of a silicide of transition metals belonging to Groups V and VI of periodic table; one or more of a boride of lanthanum and a boride of transition metals belonging to Groups IV, V and VI of periodic table; or a high melting point metal or alloy unmelted at a firing temperature of the ceramic substrate and containing, based on 100 parts by weight of the metal or alloy, 0.5-25 parts by weight of niobium, 0.5-10 parts by weight of yttrium, 0.5-10 parts by weight of tantalum, 0.5-25 parts by weight of mixture of niobium and yttrium, 0.5-25 parts by weight of mixture of yttrium and tantalum, 0.5-25 parts by weight of mixture of niobium and tantalum, 0.5-25 parts by weight of mixture of niobium, yttrium and tantalum, 0.05-3 parts by weight of nickel, 0.5-4 parts by weight of chromium or 0.05-3 parts by weight of mixture of nickel and chromium, which is a useful material for various electronic and electric apparatuses.

Ceramic body having a metallized layer

Method of manufacturing a ceramic structural body

A method of working ceramic green sheet is disclosed. The ceramic green sheet is worked by pushing a spacer having at its edge a given profile to the surface of the sheet and then forcing a cylindrical knife heated at a given temperature and provided with an edge having a form substantially equal to the profile of the spacer along the periphery of the spacer to the surface of the sheet.

Method of working ceramic green sheet

A method of manufacturing connection-type ceramic packages for integrated circuits is disclosed. A plurality of green ceramic sheets are prepared and punched to form notches in each sheet and recesses defining cavities for accommodating an integrated circuit element therein at predetermined positions in given sheets. A plurality of lead array patterns each corresponding to terminal areas of the element are printed on each surface of the sheets with a metallizing ink. The printed sheets are laminated one upon another while aligning with the aid of the notches under hot pressed condition to form a laminated body. The laminated body is longitudinally cut into a plurality of green ceramic strips while providing transverse snap lines for obtaining individual ceramic package units. A pattern corresponding to the lead array pattern is printed on both sides of each of the strips with a metallizing ink. The printed strip is sintered to ceramic strip, which is then subjected to a usual plating treatment. Thereafter, lead members are attached to the plated ceramic strip to form connection-type ceramic packages capable of being divided into individual ceramic package units.

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Nagoya, Japan

Go Suzuki