Skhynix Inc.

Go-Hyun Lee

Chang-Man Son

Sung-Lae Oh

Jin-Ho Kim

Jae-Taek Kim

Jun-Youp Kim

Young-Ock Hong

Jin Ho Kim

Sung Wook Jung

Ji Hui Baek

A semiconductor memory device includes a circuit chip including a first substrate, peripheral circuit elements which are defined on the first substrate and a first dielectric layer which covers the peripheral circuit elements, and having first pads which are coupled to the peripheral circuit elements, on one surface thereof; a memory chip including a second substrate which is disposed on a base dielectric layer, a memory cell array which is defined on the second substrate and a second dielectric layer which covers the memory cell array, and having second pads which are coupled with the first pads, on one surface thereof which is bonded with the one surface of the circuit chip; a contact passing through the base dielectric layer and the second dielectric layer; and one or more dummy contacts passing through the base dielectric layer and the second dielectric layer, and disposed around the contact.

Semiconductor memory device

A semiconductor memory device mc des a substrate defined with cell regions and a contact region between the cell regions; a dielectric structure formed over the contact region; a memory block having cell parts which are respectively formed over the cell regions, a coupling part which is formed over the contact region and couples the cell parts, and a through part which accommodates the dielectric structure; a peripheral circuit formed over the substrate under the memory block; bottom wiring lines disposed between the memory block and the peripheral circuit, and electrically coupled with the peripheral circuit; top wiring lines disposed over the memory block; and contact plugs passing through the dielectric structure and coupling the bottom wiring lines and the top wiring lines.

Semiconductor memory device including 3-dimensional structure and method for manufacturing the same

A semiconductor memory device includes a peripheral circuit region including a first substrate, a peripheral circuit element disposed at least partially over the first substrate, a first dielectric layer covering the peripheral circuit element and a bottom wiring line disposed in the first dielectric layer and electrically coupled to the peripheral circuit element; a cell region including a second substrate disposed over the first dielectric layer, a memory cell array disposed over the second substrate; a second dielectric layer covering the memory cell array; a contact coupled to the bottom wiring line by passing through the second dielectric layer and the first dielectric layer in a first direction perpendicular to a top surface of the second substrate; and at least one dummy contact disposed adjacent to the contact in the second dielectric layer.

A semiconductor memory device includes a substrate defined with cell regions and a contact region between the cell regions; a dielectric structure formed over the contact region; a memory block having cell parts which are respectively formed over the cell regions, a coupling part which is formed over the contact region and couples the cell parts, and a through part which accommodates the dielectric structure; a peripheral circuit formed over the substrate under the memory block; bottom wiring lines disposed between the memory block and the peripheral circuit, and electrically coupled with the peripheral circuit; top wiring lines disposed over the memory block; and contact plugs passing through the dielectric structure and coupling the bottom wiring lines and the top wiring lines.

A nonvolatile memory device includes a pipe gate electrode layer formed over a substrate; a plurality of conductive layers stacked over the pipe gate electrode layer; source lines formed over an uppermost one of the conductive layers; first slits passing through the pipe gate electrode layer at positions overlapping with the source lines, and dividing the pipe gate electrode layer into a plurality of pipe gate electrodes, and second slits passing through the conductive layers at positions different from the first slits, and dividing the conductive layers into a plurality of memory blocks.

Nonvolatile memory device and method for manufacturing the same

A nonvolatile memory device may include a plurality of memory blocks each including a drain select line, word lines and a source select line, and a pass transistor stage including a plurality of pass transistors formed in series in an active region and suitable for transferring word line voltages to a memory block selected among the memory blocks, in response to a block select signal, wherein the pass transistors each share a drain with a first adjacent pass transistor at one side while sharing a source with a second adjacent pass transistor at the other, and wherein a pair of pass transistors which share the source transfer word line driving signal form drains thereof to a pair of word lines which are included in different memory blocks among the memory blocks, through the source.

Nonvolatile memory device

A memory in accordance with an embodiment of the present invention may include a first page buffer, a second page buffer arranged adjacent to the first page buffer in a first direction, a global pad arranged between the first page buffer and the second page buffer, and a first bit line selection unit arranged adjacent to the first page buffer and the second page buffer in a second direction substantially perpendicular to the first direction, wherein a first bit line pad is formed at a center of the a first bit line selection unit.

Growing community of inventors

Gyeonggi-do, South Korea

Go-Hyun Lee