Skhynix Inc.

Go Hyun Lee

Sung Lae Oh

Chang Man Son

Sung Wook Jung

Soo Nam Jung

Jin Ho Kim

Kwang Ho Baek

Jae Taek Kim

Hye Yeong Jung

Chang Hyuk Lee

Jae Yong Cha

Byung Sub Nam

A semiconductor device includes a plurality of first slits disposed at a boundary region of contiguous memory blocks isolating the memory blocks from each other, and disposed to be spaced apart from each other by a predetermined distance in a first direction; at least one word line disposed between the first slits disposed in a square shape; at least one drain selection line disposed over the word line; and a plurality of isolation patterns disposed to isolate each segment of the at least one drain selection line into units of a block. The at least one word line is integrated into a single structure.

Semiconductor devices

The semiconductor device includes a substrate having a cell area and a via area; a transistor and a logic interconnection disposed over the substrate; a lower insulating layer covering the transistor and the logic interconnection; a lower conductive layer on the lower insulating layer in the cell area; a support pattern disposed on the lower insulating layer in the via area; a lower via plug having a side surface in contact with the support pattern and a bottom surface in contact with the logic interconnection; a word line stack disposed on the lower conductive layer in the cell area; an dielectric layer stack disposed on the support pattern in the via area; a vertical channel pillar penetrating the word line stack to be connected to the lower conductive layer; and an upper via plug penetrating the dielectric layer stack to be vertically aligned with the lower via plug.

Three-dimensional semiconductor device having a support pattern in contact with a side surface of a contact plug

A semiconductor device having a three-dimensional (3D) structure is disclosed. The semiconductor device includes a first chip configured to include a peripheral circuit, and a second chip stacked on the first chip that is configured to include a first memory cell array and a second memory cell array. A plurality of transfer circuits are configured to connect a plurality of row lines of the first memory cell array and a plurality of row lines of the second memory cell array to respective global row lines is divided between the first chip and the second chip.

Semiconductor device

A semiconductor device is disclosed. The semiconductor device includes a first slit, at least one word line, and a second slit. The first slit is disposed at a boundary between contiguous memory blocks to isolate the memory blocks from each other, and includes a first outer slit and a second outer slit, the second outer slit is spaced apart in a first direction from the first outer slit by a predetermined distance. The word line is disposed, between the first and second outer slits, including a center region having a first end and a second end, and an edge region located at the first end and a second end of the center region, and the second slit is disposed at the center region that isolate area of the word line in the center region on either side of the second slit, wherein the word line is continuous in the edge regions.

A semiconductor device having a three-dimensional (3D) structure is disclosed. The semiconductor device includes a first chip configured to include a logic circuit, and a second chip stacked on the first chip and configured to include a memory cell array. At least one transfer circuit for connecting a row line of the memory cell array to a global row line is distributed to each of the first chip and the second chip.

A semiconductor memory device may include a string including at least one drain select transistor, a plurality of first memory cells, a first connection element, a plurality of second memory cells, a second connection element, a plurality of third memory cells, and at least one source select transistor, wherein the at least one drain select transistor, the plurality of first memory cells, the plurality of second memory cells, the plurality of third memory cells, and the at least one source select transistor connected serially via the first connection element and the second connection element.

Three dimensional semiconductor memory device

A flash memory device is disclosed. The flash memory device includes: a cell array region; an X-decoder region arranged adjacent to the cell array region in a first direction; a discharge transistor region disposed between the cell array region and the X-decoder region; a first metal line formed to pass through the X-decoder region, the discharge transistor region, and the cell array region, and arranged to extend in the first direction; and a second metal line including a first line patterns arranged parallel to the first metal line between the first metal lines, and a second line pattern interconnecting both ends of the first line patterns and extending in a second direction crossing the first direction.

Flash memory device

A three-dimensional (3D) non-volatile semiconductor memory device including a U-shaped channel structure is disclosed. The 3D non-volatile semiconductor memory device includes a pipe gate, an upper pipe channel disposed in the pipe gate at a first depth, a first lower pipe channel disposed in the pipe gate at a second depth different from the first depth, and neighboring the upper pipe channel in a first direction, and a second lower pipe channel disposed in the pipe gate at the second depth, and neighboring the upper pipe channel in a second direction perpendicular to the first direction, wherein the upper pipe channel and the lower pipe channels have the same length.

Three-dimensional (3D) non-volatile memory device

Provided are a semiconductor device. The semiconductor device includes a memory block including a drain select line, word lines, and a source select line, which are spaced apart from one another and stacked in a direction perpendicular to a semiconductor substrate; and a peripheral circuit including a switching device connected to a bit line, which is disposed under a vertical channel layer vertically passing through the drain select line, the word lines, and the source select line.

A semiconductor device may include first conductive patterns coupled to a common source and selection lines of a memory block formed at a substrate, second conductive patterns configured to form a bit line coupled to the memory block, and third conductive patterns configured to transmit a block selection signal to couple local lines of the memory block to global lines. The first to third conductive patterns are arranged in different layers over the memory block.

Semiconductor apparatus

A semiconductor memory apparatus includes a boundary circuit unit positioned between a low voltage page buffer and a high voltage page buffer and having circuits configured to electrically couple the low voltage page buffer and the high voltage page buffer. The boundary circuit unit includes: a first boundary circuit unit having first and second transistors configured to receive data of a corresponding memory cell area through a signal transmission line selected from a plurality of signal transmission lines extended and arranged along a first direction for each column; a second boundary circuit unit disposed adjacent in the first direction from the first boundary circuit unit and having the plurality of signal transmission lines extended and arranged thereon; and an active region where the first transistor is formed and an active region where the second transistor is formed are isolated from each other.

Growing community of inventors

Gyeonggi-do, South Korea

Go Hyun Lee