Sony Corporation

Sony Semiconductor Solutions Corporation

Rohm Co., Ltd.

Sony Group Corporation

Go Asayama

Noriyuki Fukushima

Yoshinori Muramatsu

Yoshikazu Nitta

Kiyotaka Amano

Yusuke Minagawa

Toru Akishita

Hiroshi Suzuki

Tatsuro Shimizu

Teiichi Shiga

Shigeki Teramoto

Rei Takamori

Tatsuya Ninomiya

Takahiro Akahane

Kazutaka Tachibana

Hirotake Yamamoto

Nobuhiro Kihara

Masanori Onodera

Ken Koseki

Takeo Arai

Masanori Kasai

Anup K Sharma

Hiroaki Ebihara

Akihito Saito

Kenichi Shigenami

Hirokazu Seki

Kazunori Yamamoto

Masato Nishinouchi

Yuki Urano

Masakazu Baba

Kouji Mabuchi

Nobuo Kohmura

Kento Nishizawa

Kiyoharu Momosaki

A solid-state imaging device includes: a pixel unit in which pixels are arranged in a matrix pattern; and a pixel signal read-out unit including an AD conversion unit performing analog-to-digital (AD) conversion of a pixel signal read out from the pixel unit, wherein each pixel included in the pixel unit includes division pixels divided into regions in which photosensitivity levels or electric charge accumulating amounts are different from one another, the pixel signal reading unit includes a normal read-out mode and a multiple read-out mode, and includes a function of changing a configuration of a frame in accordance with a change of the read-out mode, and wherein the AD conversion unit acquires a pixel signal of one pixel by adding the division pixel signals while performing AD conversion for the division pixel signals.

Solid-state imaging device and camera system

The present technology is to provide an image sensor capable of enhancing the security of biometric information and lowering the risk of information leakage. An image sensorincludes: a biometric information acquisition unitthat acquires biometric information; a storage unitthat stores reference information to be compared with the biometric information; and a biometric authentication unitthat performs biometric authentication by comparing the biometric information with the reference information. The image sensorfurther includes an encryption processing unitthat encrypts biometric authentication information that authenticates a living organism.

Image sensor with inside biometric authentication and storage

A structure for measuring a distance on the basis of the principle of triangulation is simplified. A distance measuring module includes a diffractive optical element, an imaging element, and a distance measuring unit. The diffractive optical element emits a predetermined number of line light beams. The imaging element images the line light beams with which the subject is irradiated. The measuring unit measures a distance from the subject by using triangulation on the basis of the imaged line light beams. Thus, by imaging the line light beams emitted via the diffractive optical element, the distance from the subject is measured with a simple structure.

Distance measuring module

An image sensor includes a pixel array including multiple pixels. A lens is provided on an optical path of incident light to the image sensor. An actuator includes a coil, and supports positioning of the lens according to a driving signal applied to the coil. A position detection coil is arranged such that it magnetically couples with the coil of the actuator. An actuator driver supplies a pulse-shaped driving signal to the coil of the actuator driver. A position detection circuit generates a position detection signal that indicates the position of the lens based on an induced electromotive force that occurs in the position detection coil according to the driving signal, and feeds back the position detection signal to the actuator driver.

Actuator driver

A size reduction of an image pickup module by using resin molding, including a reduction in height, area, or the like thereof is achieved in an actual product. Provided is a module, including a substrate; a semiconductor component in which a first surface of a semiconductor device manufactured by chip-size packaging is provided and fixed along a plate-shaped translucent member, and a second surface of the semiconductor device is fixed with the second surface caused to face the substrate; a frame portion made of resin and formed on the substrate to surround the semiconductor component; and an interposition member which is made of resin and with which a gap between the semiconductor component and the substrate is filled. The interposition member is connected and fixed to the frame portion to be integrated therewith.

Solid-state image pickup apparatus, method of manufacturing solid-state image pickup apparatus, and electronic apparatus

A DA converter includes a first DA conversion section for obtaining an analog output signal in accordance with a digital input signal value, and a second DA conversion section for obtaining an analog gain control output signal in accordance with a digital gain control input signal value. In the DA converter, the gain control of the analog output signal generated by the first DA conversion section is performed on the basis of the gain control output signal generated by the second DA conversion section.

DA converter, AD converter, and semiconductor device

A camera module of the disclosure includes: an imaging unit that includes a plurality of pixels, acquires a first detection value in one of the pixels in a second term out of a first term, the second term, a third term, and a fourth term that are set in order, acquires a second detection value in the relevant one of the pixels in the fourth term, and obtains a pixel value of the relevant one of the pixels on the basis of a difference between the first and second detection values; a lens unit including a lens and an actuator that drives the lens; and a driver unit that generates a drive signal and drives the actuator using the drive signal, in which the drive signal makes a transition in each of the first and third terms.

Camera module and electronic apparatus

A semiconductor device includes a first substrate that has a sensing portion that detects predetermined information, a second substrate that has a first processing portion that processes data supplied thereto from the sensing portion, and a third substrate having a second processing portion that processes data supplied thereto either from the first substrate or from the second substrate.

Semiconductor device and sensing system

An apparatus and a method that can efficiently generate a wide dynamic range image to which each piece of pixel information of a high sensitivity pixel and a low sensitivity pixel is applied are realized. High sensitivity pixel information obtained by adding pixel values of a plurality of high sensitivity pixels and low sensitivity pixel information obtained by adding pixel values of a plurality of low sensitivity pixels are output as output pixel signals from pixels of different sensitivities from a pixel unit, these pixel information are combined in a pixel information combining unit, an output pixel value is determined, and an output image of a wide dynamic range is output. In the pixel information combining unit, a weight for the high sensitivity pixel information or the low sensitivity pixel information is changed according to brightness of a subject, weight addition of the high sensitivity pixel information and the low sensitivity pixel information is performed, a pixel value of an output image is determined, and the pixel value is output.

Image processing apparatus, imaging apparatus, image processing method, and program

Growing community of inventors

Kanagawa, Japan

Go Asayama