Fci, Inc.

Gnitaboure Yabre

Yves Stricot

Gert Droesbeke

Nicolas Hermeline

Printed circuit board assembly including an optical subassembly having a carrying face for carrying at least one optoelectronic component in a such way that light emitted from/directed to is transmitted through the optical subassembly; a printed circuit board having a supporting area for supporting the optical subassembly; wherein the printed circuit board supporting area includes a hole lodging at least one part of the optoelectronic component and wherein at least one part of the carrying face is fixed by flip-chip bonding to at least one part of the supporting area.

Printed circuit board assembly and a method for manufacturing the printed circuit board assembly

An alignment pin for an optical communication system comprises: a first portion () extending along a direction in a receiving hole of a printed circuit board, a second portion () extending along this direction in a receiving through hole of an optical coupling device, a third portion () extending along this direction in a receiving hole of an external optical component. The pin comprises an abutting surface () placed in contact with a parallel complementary surface () of the optical coupling device.

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Mainvilliers, France

Gnitaboure Yabre