Alien Technology Corporation

Ruizhang Technology Limited Company

Glenn Wilhelm Gengel

Mark Alfred Hadley

Gordon S W Craig

Paul Stephen Drzaic

Roger Green Stewart

Jeffrey Jay Jacobsen

Thomas Lloyd Credelle

Kenneth David Schatz

William Hill Joseph

John Stephen Smith

Tom Pounds

Scott John Herrmann

Randolph W Eisenhardt

Susan Swindlehurst

Ali A Tootoonchi

Eric Snyder

Eric Kanemoto

Scott Hermann

Lily Liong

Aly Tootoochi

Anno Hermanns

Torn Pounds

Randy Eisenhardt

A Radio Frequency Identification (RFID) tag. The RFID tag comprises a flexible substrate and an integrated circuit embedded within the flexible substrate. The top surface of the integrated circuit is coplanar with the flexible substrate. At least one conductive element is formed on the flexible substrate. The conductive element is electrically connected to the integrated circuit. The conductive element serves as an antenna for the RFID tag.

RFID tags and processes for producing RFID tags

Methods and apparatuses for an electronic assembly. The electronic assembly has a first object created and separated from a host substrate. The first object has a first electrical circuitry therein. A carrier substrate is coupled to the first object wherein the first object is being recessed below a surface of the carrier substrate. The carrier substrate further includes a first carrier connection pad and a second carrier connection pad that interconnect with the first object using metal connectors. A receiving substrate, which is substantially planar, including a second electrical circuitry, a first receiving connection pad, and a second receiving connection pad that interconnect with the second electrical circuitry using the metal connectors. The carrier substrate is coupled to the receiving substrate using the connection pads mentioned.

Methods of making a radio frequency identification (RFID) tags

An electronic assembly. The assembly includes a substrate, a plurality of recessed regions, and a plurality of functional blocks. Each functional block is deposited in one of the recessed regions. A substantial amount of the plurality of functional blocks is recessed below a top surface of the substrate. Substantial amount is defined by any one of less than 10% of said functional blocks protrudes above the top surface of the substrate; less than 1% of the functional blocks protrudes above the top surface of the substrate; more than 90% of the functional blocks are recessed below the top surface of the substrate; or more than 99% of the functional blocks are recessed below the top surface of the substrate.

Assembly comprising functional block deposited therein

Methods of making a radio frequency identification (RFID) tag. A flexible strap is provided by disposing a plurality of RFID chips on a first web of flexible material and removing the flexible strap from the first web and attaching the flexible strap to an antenna on a flexible substrate.

Method of making a radio frequency identification (RFID) tag

Methods and apparatuses for an electronic assembly. The method comprises depositing a functional block into a recessed region, forming dielectric layer selectively over at least one of a selected portion of the functional block and a selected portion of the first substrate; and forming one or more electrical interconnections to the functional block. The recessed region is formed on a first substrate. The depositing of the functional block occurs on a continuous web line and using a Fluidic Self Assembly process. The functional block has a width-depth aspect ratio that substantially matches a width-depth aspect ratio of said recessed region which is one of equal to or less than 10.5:1, and equal to or less than 7.5:1.

Strap assembly comprising functional block deposited therein and method of making same

Apparatuses and methods for forming displays are claimed. One embodiment of the invention relates to depositing a plurality of blocks onto a substrate and is coupled to a flexible layer having interconnect deposited thereon. Another embodiment of the invention relates to forming a display along a length of a flexible layer wherein a slurry containing a plurality of elements with circuit elements thereon washes over the flexible layer and slides into recessed regions or holes found in the flexible layer. Interconnect is then deposited thereon. In another embodiment, interconnect is placed on the flexible layer followed by a slurry containing a plurality of elements.

Web process interconnect in electronic assemblies

Electronic devices with small functional elements supported on a carrier

Methods for making electronic devices with small functional elements supported on a carrier are presented. One method of making an electronic assembly is by first providing the following: a web of flexible material having a plurality of recesses, where each of the recesses containing an RFID chip, a flexible substrate having antennas, straps from the web by a web process, where each of the straps includes at least one RFID chip and a portion of the flexible material. The electronic assembly is formed by attaching the straps to the antennas so that each of the straps is coupled to one of the antennas and the density of the RFID chips on the web is higher than a density of the antennas on the flexible substrate. Other methods of making electronic devices with small functional elements supported on a carrier are disclosed.

Methods for making electronic devices with small functional elements supported on a carriers

An apparatus incorporating small-feature size and large-feature-size components. The apparatus comprise a strap including a substrate with an integrated circuit contained therein. The integrated circuit coupling to a first conductor disposed on the substrate. The first conductor is made of a thermosetting or a thermoplastic material including conductive fillers. A large-scale component having a second conductor is electrically coupled to the first conductor to electrically couple the large-scale component to the integrated circuit. The large-scale component includes a second substrate.

Apparatus incorporating small-feature-size and large-feature-size components and method for making same

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Hollister, CA, United States of America

Glenn Wilhelm Gengel