Honeywell International Inc.

Glenn Sklar

James Piascik

Joseph Mintzer, Iii

Joseph Mintzer

Nicola Amatangelo

An electroplating device includes a conduit extending from a first end to a second end. The conduit is configured to house an object for electroplating. A first set of apertures is formed on a surface of the conduit. Each of the first set of apertures has a first size. A second set of apertures is formed on the surface of the conduit adjacent the first set of apertures. Each of the second set of apertures has a second size. The first set of apertures are configured to be in alignment with a first continuous section of the object and transfer fluid to the first continuous section of the object at a first rate. The second set of apertures are configured to be in alignment with a second continuous section of the object and transfer fluid to the second continuous section of the object at a second rate.

Electroplating shield device and methods of fabricating the same

An electroplating system includes a tank functioning as an anode, wherein the tank is configured in a horizontal orientation having a length greater than its height, a component part disposed within the tank and functioning as a cathode, an electrical connection, coupled to the anode and cathode, for providing an electric current, and a supply line for delivering an electrolytic fluid to within the tank.

Electroplating systems and methods for wear-resistant coatings

Systems and methods for automated electroplating are disclosed. An electroplating system includes a first chamber configured to receive one or more parts. The first chamber includes a vessel extending from a first end to a second end, a first cap proximate to the first end a first cathode contact coupled to the first end, a second cathode contact coupled to the second end, and a plurality of anodes formed on an inner surface of the vessel. The electroplating system further includes at least one reservoir and a first conduit and a second conduit each coupled between the at least one reservoir and the first chamber. The first conduit may be configured to transfer fluid from the first reservoir to the first chamber and the second conduit may be configured to transfer fluid from the first chamber to the at least one reservoir.

Systems and methods for enclosed electroplating chambers

Systems for masking and sealing a component for surface treatment. A system includes a pair of fixture plates disposed on opposite ends of the component from each other. One or more inner sleeves are inserted into the component to mask and seal at least a portion of the component. An outer sleeve extends between the fixture plates to seal outside of the component. A pair of fixture rods extend between the first and second fixture plates and couple the first and second fixture plates together. The system is configured to effect surface treatment of an exposed area of the component, at least a portion of the exposed area defined by and disposed adjacent to the one or more inner sleeves.

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Randolph, NJ, United States of America

Glenn Sklar