Western Digital Technologies, Inc.

Hitachi Global Storage Technologies Netherlands B.v.

International Business Machines Corporation

Hgst Netherlands, B.v.

Sandisk Technologies Inc.

Glenn Paul Gee

Darrick Taylor Smith

Hicham Moulay Sougrati

David Patrick Druist

Damaris Davis

David John Seagle

Sharon C Agtina

Anthony M Bagus

Teodosio B Quilapquilap, Jr

John P Herber

Ferdinand Hendriks

Edward Kihyen Lee

Huey-Ming Tzeng

Yuhsuke Matsumoto

Mark Anthony Church

Thomas Dudley Boone, Jr

Diane L Brown

Kenichi Murata

Mark Moravec

Adisak Tokaew

Tony Jing Zhang

Paul Arthur Goddu

Xavier Charles Lelong

Unal Murat Guruz

Manoj Chopra

Alain M L Desouches

Michael Ranes

Edward H Lee

Peter Paolo Dilla

A high density slider clamp fixture is disclosed for accurately positioning a large number of head sliders for metrology testing. The slider clamp fixture may include a single piece, monolithic structure comprising a large number of slider nests, aligned in rows and columns in the slider fixture. Each slider nest includes a reference datum surface machined to precisely align with all other reference datum surfaces in a row of the monolithic structure. Each slider nest further includes a flexure clamp for independent clamping of each slider in the row against the reference datum surfaces.

Method of making a high density slider clamp fixture

A lapping mount tool and a process for lapping a row of head sliders involves affixing the row to a lapping mount tool fixture, actuating each of multiple first actuation pins to set each head slider for lapping to a respective element target stripe height, and simultaneously lapping accordingly. The process may further involve actuating each of multiple second actuation pins to set each head slider for lapping to a respective target wedge angle, and simultaneously lapping accordingly. Each target wedge angle may be achieved by applying a respective angular force to a compliant elastomer adhered to the fixture and to the row, where such angular forces may be applied through at least two flexures interconnecting a rotatable first structural member and a second structural member of the lapping mount tool, wherein the flexures virtually intersect at and define an axis of rotation about which the angular forces are applied.

Within-row stripe height and wedge angle control for magnetic recording read-write heads

A lapping tool assembly includes a mount tool and an interposer structure interposed between actuators and the mount tool, where the interposer includes interposer pins reactively coupled with the actuators such that each interposer pin is configured to receive a translational force from a corresponding actuator and to transmit the force to a corresponding actuation pin of the mount tool. The interposer may include a zero z-axis shift flexure system, and/or a z-axis decoupling flexure system, and/or alignment features, for accurately transmitting the actuation forces to the mount tool, while inhibiting affecting other portions of the mount tool.

Actuator tilt interposer for within-row lapping mount tool for magnetic recording read-write heads

High density slider clamp fixture

Disclosed herein is a magnetic storage device that comprises a suspension arm co-movably fixed to a carriage arm. The suspension arm comprises a slider attachment side and at least one first electrical contact pad on the slider attachment side. The suspension arm also comprises a slider co-movably fixed to the suspension arm. The slider comprises a suspension attachment side, a non-head side facing the suspension arm and intersecting the suspension attachment side at a first slider edge of the slider, a head side facing away from the suspension arm, and at least one electrical contact component on the suspension attachment side up to the first slider edge. At least one solder weldment is directly coupled to the at least one first electrical contact pad and the at least one electrical contact component. Additionally, a read-write head is coupled to the head side of the slider.

Slider and suspension arm interconnection for magnetic storage device

A process for lapping a row of head sliders involves fixing the row to a lapping tool fixture, actuating each of multiple force pins to set each head slider for lapping to a respective target wedge angle, and simultaneously lapping accordingly. Each target wedge angle may be achieved by applying a respective torque to a compliant elastomer between each force pin and corresponding head slider, to transfer a pressure gradient corresponding to the torque to the corresponding head slider. Such torques may be applied through at least two wedge angle flexures interconnecting a rotatable box structure and a fixed back wall of a lapping tool, wherein the flexures virtually intersect at and define an axis of rotation about which the torques are applied. The process may further involve actuating each force pin to set each head slider for lapping to a respective reader target stripe height, and simultaneously lapping accordingly.

Within-row wedge angle control for magnetic recording read-write heads

A process for manufacturing a magnetic tape head module involves depositing over a wafer substrate electrical traces from respective electrical lapping guides (ELGs) to an area at an end of a tape head module also formed over the substrate, fabricating a closure adjacent to the tape head module where the closure terminates outside of the area at the end of the tape head module, and electrically connecting the electrical traces to an external circuit using a wire-bonding procedure, thereby electrically connecting each ELG to the external circuit. A plurality of electrical connection pads may be deposited at the area at the end of the tape head module, and each electrical trace electrically connected to one of the pads, where electrically connecting the traces to the external circuit includes wire-bonding the pads to the circuit.

Wire bonding electrical lapping guides for tape head module

Embodiments described herein generally relate to connecting electronic lapping guides (ELGs) to a lapping controller to prevent the effects of current crowding while reducing connections to the ELGs in single pad lapping. Devices and systems can include a row of sliders including a magnetoresistive (MR) element, a plurality of high resistance ELGs connected to both the wafer and to at least one bonding pad and at least two peripheral grounding vias connected to the wafer. Methods and systems include a wafer comprising a plurality of sliders wherein each slider is connected to a lapping controller and the delivery of current to the ELGs is sequential to groups of sliders such that only one group of ELGs is being measured at any time.

Correcting current crowding in row bar and vias for single pad bonding

Embodiments described herein generally relate to connecting Electronic Lapping Guides (ELG) to a lapping controller to reduce resistance from current crowding while reducing connections to the ELG. A device and a system can include a wafer with peripheral grounding vias having a radius of at least 10 &#x3bc;m, a plurality of sliders with a magnetoresistive (MR) elements; a plurality of ELG electrically coupled to the lapping controller through a combination of the wafer and grounding pads and a bonding pad electrically coupled to the ELG. The ELG or the bonding pad can be positioned in the kerf or the device region of a row. If the ELG and the bonding pad are positioned in separate regions, a noble metal should be used to connect. Further, the number of grounding pads can be reduced by using grounding vias at specific intervals and specific sizes.

Wafer grounding design for single pad lapping

Methods of lapping rows of recording heads are described after an air bearing surface (ABS) damascene process is performed. The ABS damascene process uses a selective etching process to form voids in the row of recording heads where conductive material forms a feature in the recording head, such as a wrap around shield. The conductive material is then deposited on the ABS of the row to fill the voids, and the row is lapped. According to methods provided herein, the resistance of one or more lapping guides in the row of recording heads is monitored to determine when the conductive material is removed by the lapping process. When the monitored resistance indicates that the conductive material is removed, the lapping process is stopped. The resistance across one or more lapping guides may also be used to control the lapping process to uniformly lap the conductive material from the ABS.

Controlled lapping for an ABS damascene process

A soluble abrasive is used to lap workpieces to overcome the problem of embedding and retaining abrasive particles in the workpieces. The soluble abrasives are dissolved from the workpiece even if they become embedded in the workpiece. For example, the abrasives may be dissolved with water and comprise ionic salts. The soluble abrasive has a hardness that is equal to or slightly greater than the hardness of the metal being lapped.

System, method and apparatus for lapping workpieces with soluble abrasives

A slider lapping texture for implementation in a lapping environment. The slider lapping texture includes a lapping texture structure for utilization in a lapping process performed on a slider. The structure also includes a first surface having a base elevation. The structure further includes a second surface at an elevation higher than the base elevation. The second surface is for lapping the slider. The structure additionally includes an opening for expelling residue associated with a lapping process. The slider lapping texture is configured to generate an attractive force when the slider is motioned thereupon in a substantially unidirectional manner.

Lapping plate texture for increased control over actual lapping force

An apparatus and method of lapping of rows of magnetic recording heads uses multiple fluid-filled ports with variable pressure against a flexible adhesive tape to secure to and support the row. The tape provides the necessary tangential restraining force to drag the workpiece along a lapping plate. The multiple ports beneath the tape provide the necessary normal force to press the workpiece against the lapping plate to allow lapping to occur. The amount of material removal from the row is varied by adjusting the pressure in the ports such that higher pressure is applied to those heads with higher stripe height, and lower pressure is applied to recording heads with lower stripe height. To set or adjust the port pressures, measurements of the read sensor resistance are taken to calculate the stripe height. The stripe height is roughly proportional to the reciprocal of resistance.

Multi-chambered, compliant apparatus for restraining workpiece and applying variable pressure thereto during lapping to improve flatness characteristics of workpiece

A lapping process fixture has a base with a mounting surface and a membrane on the mounting surface for supporting a workpiece. The membrane is bonded to the mounting surface and has adhesive on its outer surface such that the workpiece adheres to it. The membrane extends across and seals an opening to a cavity inside the base. The cavity is filled with fluid that may be sealed or externally pressurized through ports in the base. The fixture restrains the workpiece to minimize distortion of its surface during processing. The workpiece is restrained from normal-directed movement by fluidic pressure such that the normal force is uniformly distributed across the surface area of the workpiece. The external adhesive on the membrane restrains the workpiece from tangential movement.

Complaint membrane for restraining a workpiece and applying uniform pressure during lapping to improve flatness control

A number of transducers are produced on a substrate, the transducers positioned on the substrate in non-linear rows. The substrate is then sliced into rows. Each row is then lapped with a curved lapping plate. Finally, each row is sliced into individual sliders, each slider now having an air bearing surface with non-zero camber.

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San Jose, CA, United States of America

Glenn Paul Gee