Intel Corporation

Glenn E Stewart

Kristopher J Frutschy

Farzaneh Yahyaei-moayyed

Hong Xie

Brent S Stone

Kris Frutschy

Geoffery L Reid

Geoffrey L Reid

Embodiments of the invention provide a compact, seal-less, centrifugal liquid pump with a perimeter magnetic drive that is substantially smaller than a conventional centrifugal liquid pump having magnets attached directly to the impeller shaft. Because rotational force is applied at the perimeter of the impeller, rather than at the shaft, embodiments of the invention have lower torque requirements and rotational speed, increasing the life of the pump bearings. Additionally, embodiments of the invention may suspend the pump bearings by using a redirected flow of liquid coolant, further increasing the bearing life.

Centrifugal liquid pump with perimeter magnetic drive

An electronic assembly includes one or more conductive clamps (, FIG.), which are used to supply current to an integrated circuit (IC) package (). The conductive clamps are attached to a printed circuit (PC) board (), which supplies the current to the IC package over one clamp, and receives returned current from the IC package over another clamp. Each clamp contacts a contact pad () on the surface of the PC board, and contacts another contact pad () on the top surface of the IC package. Vias () and conductive planes () within the package then carry current to and from an IC (e.g., IC) connected to the package. In another embodiment, the clamp (, FIG.) holds a conductive structure () in place between the PC board contact pad () and the IC package contact pad (), and current is carried primarily over the conductive structure, rather than over the clamp.

Printed circuit board housing clamp

The present invention relates to apparatus and methods for providing a low resistance power supply to a microelectronic package through the use of dual conductive paths. A first conductive path contained within the substrate and supplies current, primarily in responding to transient current demands to the microelectronic package. A lower resistance second conductive path supplies primarily steady state current to the microelectronic package through an electrical connection to an edge of the microelectronic package. Resistance in the second conductive path is reduced by using a power clamp to connect the second power supply to the microelectronic package.

Dual power supply method and apparatus

An electronic package that includes an interposer, a die and laminated conductor. The die and laminated conductor are secured to the interposer such that the laminated conductor mechanically supports the interposer and supplies current to the die.

Current supply and support system for a thin package

An electronic assembly includes one or more conductive clamps ( FIG. 3), which are used to supply current to an integrated circuit (IC) package ( ). The conductive clamps are attached to a printed circuit (PC) board ( ), which supplies the current to the IC package over one clamp, and receives returned current from the IC package over another clamp. Each clamp contacts a contact pad ( ) on the surface of the PC board, and contacts another contact pad ( ) on the top surface of the IC package. Vias ( ) and conductive planes ( ) within the package then carry current to and from an IC (e.g., IC ) connected to the package. In another embodiment, the clamp ( FIG. 9) holds a conductive structure ( ) in place between the PC board contact pad ( ) and the IC package contact pad ( ), and current is carried primarily over the conductive structure, rather than over the clamp.

Growing community of inventors

Mesa, AZ, United States of America

Glenn E Stewart