Freescale Semiconductor,inc.

Nxp Usa, Inc.

Nxp B.v.

Glenn Charles Abeln

Mark Douglas Hall

James David Burnett

Alexander Hoefler

Nihaar N Mahatme

Jack M Higman

Hubert Martin Bode

Jehoda Refaeli

John M Grant

Brad John Garni

Lawrence N Herr

Chong-Cheng Fu

Sayeed Ahmed Badrudduza

Jurgen Geerlings

Jorge Arturo Corso Sarmiento

A memory includes a supply voltage generation circuit for providing a supply voltage to a plurality of SRAM cells of the memory during at least one mode of memory operation. The supply voltage generation circuit includes a first reference generation circuit that includes at least one SRAM cell with a replica SRAM latch. The first reference generation circuit provides a first voltage during an at least one mode of memory operation. The supply voltage generation circuit includes a second reference generation circuit that includes at least one SRAM cell with a replica SRAM latch. The second reference generation circuit provides a second voltage during the at least one mode of memory operation. The voltage generation circuit includes an output for providing a supply voltage to the plurality of cells during the at least one mode of memory operation.

Voltage generation circuit for SRAM

A data processing system includes a memory configured to receive memory access requests. Each memory access request having a corresponding access address and having a corresponding parity bit for an address value of the corresponding access address. The corresponding access address is received over a plurality of address lines and the parity bit is received over a parity line. The memory includes a memory array having a plurality of memory cells arranged in rows, each row having a corresponding word line of a plurality of word lines, and a row decoder coupled to the plurality of address lines, the parity line, and the plurality of word lines. The row decoder is configured to selectively activate a selected word line of the plurality of word lines based on the corresponding access address and the corresponding parity bit of a received memory access request. The concept can also be used with parity bits on columns of the memory cells and a column decoder that selects bit lines associated with column address lines.

Devices and methods for preventing errors and detecting faults within a memory device

An integrated circuit (IC) includes a plurality of volatile memory (VM) blocks, and a power gate control circuit configured to control power gating for each VM block of a plurality of VM blocks. The IC includes a power mode controller circuit configured to select a power mode, and in response to selecting a retention mode as the power mode, the power mode controller circuit gates a supply voltage from each block of a selected subset of the plurality of VM blocks and allows a retention voltage to power each VM block of a remaining subset of the plurality of VM blocks outside the selected subset. The IC includes a voltage controller circuit configured to determine a voltage level of the retention voltage based on a minimum retention voltage required for each VM block of the remaining subset.

Devices and methods for adaptive retention voltage in volatile memory

A plurality of memory cells, in which each memory cell includes two corresponding supply terminal inputs, is powered up while applying a voltage differential between the corresponding supply terminal inputs for each of the plurality of memory cells. After powering up, the plurality of memory cells is read and a physically unclonable function (PUF) response is generated from data of the reading.

SRAM based physically unclonable function and method for generating a PUF response

A physically unclonable function (PUF) includes an array of differential PUF bits arranged in rows and columns, wherein each differential bit is located at an intersection of a row and a column, and includes a first PUF cell coupled to a corresponding first bit line and first source line and a second PUF cell coupled to a corresponding second bit line and second source line. The PUF includes a source bias transistor coupled between each corresponding first source line and a first power supply terminal and between each corresponding second source line and the first power supply terminal, wherein a gate electrode of each of the source bias transistors is coupled to a second power supply terminal, and a corresponding set of margin transistors coupled in parallel with each source bias transistor, wherein a gate electrode of each margin transistor is coupled to receive a corresponding margin setting control signal.

Physically unclonable function having source bias transistors

A memory including an array of memory cells, word lines, and voltage supply lines. Each voltage supply line of the plurality of voltage supply lines is coupled to a first voltage supply terminal of a subset of memory cells of subsets of memory cells of the array. Each memory cell of the array is coupled to a word line. The memory includes a row decoder that controls a voltage on each of the word lines and controls a voltage on each of the voltage supply lines. The row decoder provides a low voltage state voltage on one of the voltage supply lines during a write operation to a subset of memory cells coupled to the voltage supply line and the row decoder provides a high voltage state voltage to the voltage supply line during a read operation of the subset of the memory cells.

SRAM with improved write operation

A method of making a semiconductor device is achieved in and over a semiconductor layer. A trench is formed adjacent to a first active area. The trench is filled with insulating material. A masking feature is formed over a center portion of the trench to expose a first side of the trench between a first side of the masking feature and the first active area. A step of etching into the first side of the trench leaves a first recess in the trench. A first epitaxial region is grown in the first recess to extend the first active area to include the first recess and thereby form an extended first active region.

Semiconductor devices with extended active regions

A semiconductor device is formed on a semiconductor layer. A gate dielectric layer is formed over the semiconductor layer. A layer of gate material is formed over the gate dielectric layer. The layer of gate material is patterned to form a gate structure. Using the gate structure as a mask, an implant into the semiconductor layer is performed. To form a first patterned gate structure and a trench in the semiconductor layer surrounding a first portion and a second portion of the semiconductor layer and the gate, an etch through the gate structure and the semiconductor layer is performed. The trench is filled with insulating material.

Trench formation in a semiconductor material

A memory cell including an access transistor coupled to a first storage node and a read port coupled to one of the first storage node or a second storage node is provided. The memory cell further includes a first inverter having an input terminal coupled to the first storage node, an output terminal, and a first power supply voltage terminal for receiving a first power supply voltage. The memory cell further includes a second inverter having an input terminal coupled to the output terminal of the first inverter, an output terminal coupled to the input terminal of the first inverter at the first storage node, and a second power supply voltage terminal for receiving a second power supply voltage, wherein the second power supply voltage is varied relative to the first power supply voltage during a write operation to the memory cell.

Memory cells with lower power consumption during a write operation

A two-port SRAM memory cell includes a pair of cross-coupled inverters coupled to storage nodes. An access transistor is coupled between each storage node and a write bit line and controlled by a write word line. The write word line is also coupled to a power supply terminal of the pair of cross-coupled inverters. During a write operation, the write word line is asserted. A voltage at the power supply terminal of the cross-coupled inverters follows the write word line voltage, thus making it easier for the stored logic state at the storage nodes to change, if necessary. At the end of the write operation, the write word line is de-asserted, allowing the cross-coupled inverters to function normally and hold the logic state of the storage node. Coupling the power supply node of the cross-coupled inverters allows faster write operations without harming cell stability.

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Buda, TX, United States of America

Glenn Charles Abeln