Rodel Holdings, Inc.

Glenn C Mandigo

Craig D Lack

Ross E Barker, Ii

Terence M Thomas

James Shen

Wesley D Costas

Wendy B Goldberg

Ian G Sullivan

Compositions for insulator and metal CMP and methods relating thereto

A method of polishing a wafer in a carrier by a polishing pad, controlling a ratio of platen speed to carrier speed (PS to CS) within a specific range, or controlling a first polishing step with a PS to CS ratio in the range of about 150:1 to about 1:150 followed by a second polishing step with a platen speed of about 0 to 20 rpm while maintaining the carrier speed used in the first polishing step, which maximizes clearing of residual material removed from a patterned wafer surface by polishing.

Chemical mechanical planarization of metal substrates

Growing community of inventors

Boothwyn, PA, United States of America

Glenn C Mandigo