International Business Machines Corporation

Glenn A Pomerantz

David Clifford Long

Krishna Gandhi Sachdev

Jon Alfred Casey

John Ulrich Knickerbocker

Mark J LaPlante

Daniel S Mackin

James N Humenik

Bruce E Tripp

Benjamin V Fasano

Richard Francis Indyk

James G Balz

Keith C O'Neil

Candace A Sullivan

Michael E Cropp

Donald W Diangelo

James C Utter

John F Harmuth

David E Speed

Thomas Anthony Wassick

Krystyna Waleria Semkow

Brian Richard Sundlof

Robert Anthony Rita

Donald Rene Wall

Brenda Lee Peterson

Kathleen M Wiley

Lori A Maiorino

Patrick E Spencer

Charles Leon Arvin

Thomas Weiss

Mario John Interrante

Chon Cheong Lei

Arthur Gilman Merryman

Michael Berger

Robert J Sullivan

Charles J Hendricks

Richard Philip Surprenant

John T Butler

Thomas P Moyer

Jerome D Cohen

Timothy Titus Popp

Raschid Jose Bezama

Charles Hampton Perry

Mark William Kapfhammer

Luc Gilbert Guerin

John Blake Pavelka

James Ralph Case

Bhupender Singh

Gregory Blair Martin

Richard A Shelleman

David H Gabriels

Cynthia J Calli

John E Kozol

Laszlo Kando

Rachel E Olson

An alignment carrier, assembly and methods that enable the precise alignment and assembly of two or more semiconductor die using an interconnect bridge. The alignment carrier includes a substrate composed of a material that has a coefficient of thermal expansion that substantially matches that of an interconnect bridge. The alignment carrier further includes a plurality of solder balls located on the substrate and configured for alignment of two or more semiconductor die.

Alignment carrier for interconnect bridge assembly

Methods and reworked intermediate and resultant electronic modules made thereby, whereby a component in need of rework is located and removed from the module to reveal encapsulated solder connections residing within an underfill matrix. Heights of both the solder connections and underfill matrix are reduced, followed by etching the solder out of the solder connections to form openings within the underfill matrix. The underfill material is then removed to expose metallurgy of the substrate. A blank having a release layer with an array of solder connections is aligned with the exposed metallurgy, and this solder array is transferred from the blank onto the metallurgy. The transferred solder connections are then flattened using heat and pressure, followed by attaching solder connections of a new component to the flattened solder connections and underfilling these reworked solder connections residing between the new chip and substrate.

Method to recover underfilled modules by selective removal of discrete components

A multilayer ceramic repair process which provides a new electrical repair path to connect top surface vias. The repair path is established between a defective net and a redundant repair net contained within the multilayer ceramic substrate. The defective net and the repair net each terminate at surface vias of the substrate. A laser is used to form post fired circuitry on and in the substrate. This is followed by the electrical isolation of the defective net from the electrical repair structure and passivation of the electrical repair line.

Electronic package repair process

Methods to create raised pedestal parts in ceramic substrates sintered under a load. The invention uses a patterned, buried, non-sintering layer that provides the needed transfer of load during the sintering process to the raised or pedestal portion of the substrate while maintaining dimensional control of the metallized features on the surface of the pedestal base. The methods involve cutting channels in the ceramic substrate corresponding in position to the perimeter of the opening in the patterned non-sintering contact sheet. The channels may be cut either before or after the sintering of the ceramic substrates.

Method to produce pedestal features in constrained sintered substrates

A method and structure to form surface plating metallization on a substrate. Two layers of tape are applied to the surface of the substrate. A first path is cut through both layers of tape exposing the substrate surface. The first path connects at least one conductive via on the top surface of the substrate. A second path is cut through the second layer of tape exposing the first layer of tape. The second path is routed from the first path to an edge of the substrate A seed layer is deposited over the surface of the second layer of tape thereby creating a seeded plating path in the first path and a sacrificial seeded conduction path in the second path. Connecting the sacrificial seeded conduction path to a plating potential at the edge of the substrate creates a plated path on the surface of the substrate. The sacrificial path is removed when the tape is removed.

Method of selective plating on a substrate

A process of cleaning of objects that relate to semiconductor fabrication processes, such as, for example, conductive paste screening in the production of multilayer ceramic substrates and composite solder paste by stencil printing in electronic circuit assembly. Specifically, the process removes a metal/polymer composite paste from screening masks and associated paste making and processing equipment used in printing conductive metal pattern onto ceramic green sheet in the fabrication of semiconductor packaging substrates. The process also cleans solder paste residue from stencil printing equipment used in electronic module assembly surface mount technology for SMT discretes, solder column attachment, and BGA (Ball Grid Array) attachment on ceramic chip carrier or for screening solder paste onto printed circuit board. More particularly, paste residue is cleaned from metal, ceramic, and plastic substrates by a non-alkaline semi-aqueous cleaning method employing high boiling propylene glycol alkyl ether or mixtures of propylene glycol alkyl ether and propylene glycol solvents.

Semi-aqueous solvent cleaning of paste processing residue from substrates

A method of forming an electrical connector including providing a metallic sheet having a multitude of connector blanks formed therein, each of the connector blanks having a base portion, a contact portion and a singulation arm; forming each of the connector blanks into a connector having a predetermined shape wherein each of the connectors remain connected to the metallic sheet by their respective singulation arms and wherein the singulation arms are nonplanar with respect to the metallic sheet; joining the base of each of the connectors to a first substrate; and severing the singulation arms to separate each of the connectors from the metallic sheet wherein the base of each of the connectors is joined to the first substrate. In a preferred embodiment, the contact portion contacts a second substrate.

Method of forming an electrical connector

An aqueous alkaline cleaning composition for efficient removal of Mo, Cu, W, or Cu/Ni-based conductive paste residue from screening masks, associated screening equipment and the like by using alkali metal salt and/or tetramethyl ammonium salt of polyacrylic acid, acrylic acid-methacrylic acid co-polymer, polyaspartic acid, polylactic acid, poly(acrylic acid-co-maleic anhydride), poly(maleic acid), with excess alkali for pH adjustment in the range of about 11.5-13.5, and a surfactant which may be a medium foam, low foam or no-foam surfactant, and is preferably an amphoteric and/or non-ionic and/or ionic surfactant.

Polycarboxylates-based aqueous compositions for cleaning of screening apparatus

A fixture for holding a workpiece in a machining apparatus comprises at least one opening having at least one flexible side for elastically holding the workpiece and a slot adjacent each of the at least one side for allowing the side to flex.

Lapping and polishing fixture having flexible sides

This invention relates to the cleaning of objects that relate to semiconductor printing, such as, for example, screening masks. This invention is basically directed to removing, for example, an organic polymer-metal composite paste from screening masks used in printing conductive metal patterns onto ceramic green sheets in the fabrication of semiconductor packaging substrates. More particularly, this invention is concerned with the automated in-line cleaning of paste screening masks with an aqueous alkaline solution of a quaternary ammonium hydroxide as a more environmentally friendly alternative to non-aqueous organic solvents-based cleaning in screening operations for the production multilayer ceramic (MLC) substrates.

Aqueous quaternary ammonium hydroxide as a screening mask cleaner

This invention relates to an aqueous cleaning method for removal of metal-organic composite paste residue from the surface of components, such as, screening masks, associated paste screening equipment, substrates, to name a few. The invention is particularly concerned with aqueous alkaline cleaning solutions comprising alkali metal salt and/or quaternary ammonium salt of an organic acid preferably &agr;-hydroxy carboxylic acid in the presence of excess alkali and optionally a surface active agent for use in cleaning components, such as, screening masks, associated screening equipment, substrates, etc., which are used in the production of electronic components.

Aqueous cleaning of paste residue

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Kerhonkson, NY, United States of America

Glenn A Pomerantz