General Electric Company

Lockheed Martin Corporation

Glenn A Forman

Christopher James Kapusta

James Enrico Sabatini

Kelvin Ma

William P Kornrumpf

Robert John Filkins

Joseph Alfred Iannotti

Glenn Scott Claydon

Matthew Christian Nielsen

Harold Woodruff Tomlinson, Jr

Samhita Dasgupta

John Erik Hershey

Robert J Wojnarowski

Yung S Liu

Sharbel E Noujaim

John Andrew Mallick

Michael Joseph Mahony

Philippe L Jacob

William Eugene Powell, Iii

Rick C Stevens

Selaka Bandara Bulumulla

Kevin J Thorson

Thomas Baby Sebastian

Mauricio Castillo-Effen

Michael Richard Durling

Juntao Wu

Kung-Li Justin Deng

Scott Sheridan Smith

Charles John Kryzak

Chun Zhan

Brian Scott Leininger

Zhihong Roy Mao

Michael Shane Pilon

Maxine Marie Gibeau

Eric Patrick Davis

Olga B Spahn

Nikita Visnevski

Craig Hoover

Lubomir Hristov Sevov

Jeannine Jones

Steven Richard Hansen

Douglas Stuart Abernathy

William D Cowan

Daryl J Dagel

An electronic package includes a first layer having a first surface, the first layer includes a first device having a first electrical node, and a first contact pad in electrical communication with the first electrical node and positioned within the first surface. The package includes a second layer having a second surface and a third surface, the second layer includes a first conductor positioned within the second surface and a second contact pad positioned within the third surface and in electrical communication with the first conductor. A first anisotropic conducting paste (ACP) is positioned between the first contact pad and the first conductor to electrically connect the first contact pad to the first conductor such that an electrical signal may pass therebetween.

Stackable electronic package and method of fabricating same

Stackable electronics package and method of fabricating same

A non-intrusive physiological data measurement system and method, as well as an optically induced treatment system, are described. The measurement system includes a monitoring mechanism that includes light emitter modules capable of emitting light at at least two wavelengths. The light emitted from the light emitter modules is transmitted through a subject and to a light receiving mechanism, such as an optical sensor. Physiological data is taken from the received light. The system also can ascertain movement of the subject by obtaining an initial outline of the subject and comparing that outline with a subsequently obtained outline. A therapeutic optic system includes a non-adhering light emitting mechanism for providing light at therapeutic wavelengths.

Measurement and treatment system and method

An electronic package and a method of making the same in provided. The electronic package includes a dielectric layer and a conformal masking layer disposed on at least a portion of the dielectric layer. The electronic package further includes a routing layer disposed on at least a portion of the masking layer and a micro-via disposed at least in part in the conformal masking layer and the routing layer. Further, at least a portion of the routing layer forms a conformal electrically conductive layer in at least a portion of the micro-via. Also, the conformal masking layer is configured to define a size of the micro-via. The electronic package further includes a semiconductor die operatively coupled to the micro-via.

Electronic packages and methods of making and using the same

A trajectory-based sense-and-avoid system for use on an aircraft is provided that utilizes 4-D constructs, such as 4-D trajectories or 4-D polytopes, to maintain separation from other aircraft and/or to avoid collisions with other aircraft. In certain embodiments the trajectory-based sense-and-avoid system utilizes 4-D trajectories provided from an external source and/or 4-D trajectories estimated based on a variety of data sources during operation.

Trajectory based sense and avoid

A sensor includes a sensor head including an acoustic detector configured to receive light from a first light source and to reflect the light upon incidence of acoustic waves. The sensor also includes at least one optical fiber and at least one fluorescent material within at least one of the sensor head and the at least one optical fiber. The at least one fluorescent material is configured to receive light from a second light source external to the sensor and emit visible light in response to the light received from the second light source.

Methods, systems, and apparatus for detecting light and acoustic waves

The present disclosure includes apparatus, system, and method embodiments that provide micro electro mechanical system optical switching and methods of manufacturing switches. For example, one optical switch embodiment includes at least one micro electro mechanical system type pivot mirror structure disposed along a path of an optical signal, the structure having a mirror and an actuator, and the mirror having a pivot axis along a first edge and having a second edge rotatable with respect to the pivot axis, the mirror being capable of and arranged to be actuated to pivot between a position parallel to a plane of an optical signal and a position substantially normal to the plane of the optical signal.

Micro electro mechanical system optical switching

A flexible electronic circuit member formed of a plurality of dielectric layers includes a plurality of thinned semiconductor chips embedded within the circuit member for increased levels of integration and component density. The thinned semiconductor chips may include various integrated circuits thereon. They may be formed on various substrates and using various technologies and the embedded, thinned semiconductor chips are interconnected by a patterned interconnect that extends between and through the respective dielectric layers. A method for forming the flexible circuit member includes joining conventional semiconductor chips to a mounting apparatus then grinding the semiconductor chips to form thinned semiconductor chips that are joined to respective dielectric layers that combine to form the flexible electronic circuit member. A releasable bonding layer is used to join the semiconductor chip to a mounting assembly during the grinding operation and removed after the thinned semiconductor chips are joined to the respective dielectric layers used in combination to form the electronic circuit member.

Thin embedded active IC circuit integration techniques for flexible and rigid circuits

A flexible electronic circuit member formed of a plurality of dielectric layers includes a plurality of thinned semiconductor chips embedded within the circuit member for increased levels of integration and component density. The thinned semiconductor chips may include various integrated circuits thereon. They may be formed on various substrates and using various technologies and the embedded, thinned semiconductor chips are interconnected by a patterned interconnect that extends between and through the respective dielectric layers. A method for forming the flexible circuit member includes joining semiconductor chips to a mounting apparatus using a releasable bonding layer then forming thinned semiconductor chips that are joined to respective dielectric layers that combine to form the flexible electronic circuit member. The releasable bonding layer is removed after the thinned semiconductor chips are joined to the respective dielectric layers used in combination to form the electronic circuit member.

Stackable electronic package

A novel micro optical system as a platform technology for electrical and optical interconnections, thermal and mechanical assembly and integration of electronic, optoelectronic, passive and active components. This platform provides optical coupling and chip-to-chip interconnection by microwave electrical, optical guided and unguided waves, and power or bias electrical contacts or interfaces by a novel chip in flexible circuit, rigid or inflexible embodiments.

Assembly, contact and coupling interconnection for optoelectronics

Growing community of inventors

Schenectady, NY, United States of America

Glenn A Forman