Advanced Micro Devices Corporation

Glen W Scheid

Qingsu Wang

Terrence J Riley

Michael Lee Miller

Si-Zhao J Qin

Kent F Knox

A method for identifying faulty wafers includes processing a set of wafers in a tool; collecting tool state information during the processing of the set of wafers; generating a tool state information baseline; comparing the tool state information for each wafer to the tool state information baseline to identify any wafers with outlying tool state information; and designating a particular wafer in the set as suspect in response to identifying outlying tool state information for the particular wafer. A processing line includes a tool adapted to process a set of wafers, and a process controller. The process controller is adapted to collect tool state information during the processing of the set of wafers, generate a tool state information baseline, compare the tool state information for each wafer to the baseline tool state information to identify any wafers with outlying tool state information, and designate a particular wafer in the set as suspect in response to identifying outlying tool state information for the particular wafer.

Method and apparatus for using tool state information to identify faulty wafers

Methods of optimizing a preheat recipe for rapid thermal processing workpieces are provided. In one aspect, a method of manufacturing is provided that includes preheating a rapid thermal processing chamber according to a preheating recipe and processing a first plurality of workpieces in the rapid thermal processing chamber. Parameter measurements are performed on a first workpiece and a second workpiece of the first plurality of workpieces. The parameter measurements are indicative of processing differences between the first and second workpieces. An output signal is formed corresponding to the parameter measurements and a control signal based on the output signal is used to adjust the preheating recipe for preheating the rapid thermal processing chamber for processing a second plurality of workpieces in the rapid thermal processing chamber to reduce processing differences between first and second workpieces of the second plurality of workpieces.

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Gresham, OR, United States of America

Glen W Scheid