Delphi Technologies, Inc.

Delco Electronics Corporation

Glen W Devos

Mark Anthony Koors

A method and assembly ( ) for conducting heat from a semiconductor device, such as a power flip chip ( ). The assembly ( ) is generally constructed to dissipate heat from the chip ( ) when mounted to a flexible substrate ( ). Heat is conducted from the chip ( ) with a heat-conductive member ( ) brought into thermal contact with the surface of the chip ( ) opposite solder bump connections ( ) that attach the chip ( ) to the substrate ( ). A biasing member ( ) biases the substrate ( ) against the chip ( ) so as to maintain thermal contact between the chip ( ) and the heat-conductive member ( ). A thermally-conductive lubricant ( ) is preferably provided between the surface of the chip ( ) and the heat-conductive member ( ) in order to promote thermal contact while also decoupling any lateral mechanical strains that may arise as a result of different thermal expansions and movement between the chip ( ), substrate ( ) and heat-conductive member ( ). The substrate ( ) and chip ( ) are preferably enclosed within a housing ( ) that incorporates the heat-conductive member ( ). The housing ( ) may further include fins ( ) in order to promote heat dissipation from the housing ( ) to the environment.

Heat-dissipating assembly for removing heat from a flip chip semiconductor device

A method and assembly (,) for conducting heat from a semiconductor device, such as a power flip chip (,). The assembly (,) is generally constructed to dissipate heat from the chip (,) when mounted to a flexible substrate (,). Heat is conducted from the chip (,) with a heat-conductive member (,) brought into thermal contact with the surface of the chip (,) opposite solder bump connections (,) that attach the chip (,) to the substrate (,). A biasing member (,) biases the substrate (,) against the chip (,) so as to maintain thermal contact between the chip (,) and the heat-conductive member (,). A thermally-conductive lubricant (,) is preferably provided between the surface of the chip (,) and the heat-conductive member (,) in order to promote thermal contact while also decoupling any lateral mechanical strains that may arise as a result of different thermal expansions and movement between the chip (,), substrate (,) and heat-conductive member (,). The substrate (,) and chip (,) are preferably enclosed within a housing (,) that incorporates the heat-conductive member (,). The housing (,) may further include fins (,) in order to promote heat dissipation from the housing (,) to the environment.

Growing community of inventors

Fort Wayne, IN, United States of America

Glen W Devos