Corning Incorporated

Glen Bennett Cook

Natesan Venkataraman

Prantik Mazumder

Victoria Ann Edwards

Christopher Scott Thomas

Balram Suman

Heather Debra Boek

Michael Thomas Gallagher

Josef C Lapp

Frank Thomas Coppola

Mark Owen Weller

Randy Lee Rhoads

Butchi Reddy Vaddi

Olus Naili Boratav

Irene Mona Peterson

David Alan Tammaro

Peter L Bocko

George Clinton Shay

Kamal Kishore Soni

Ralph Alfred Langensiepen

David Chen

Gunilla E Gillberg

Vitor Marino Schneider

Mallanagouda D Patil

Ann MeeJin Ferrie

John Forrest Wight, Jr

Joseph Michael Matusick

Patrick Joseph Cimo

Shawn Michael O'Malley

Laurent Joubaud

Lewis Kirk Klingensmith

Brian Paul Strines

Izhar Zahoor Ahmed

Richard Curwood Peterson

Srinivasa Rao Vaddiraju

David John McEnroe

Michael Thomas Murtagh

Antoine Gaston Denis Bisson

John Joseph Costello, Iii

John David Helfinstine

Christopher William Drewnowski

Lili Tian

Nicholas Ryan Wheeler

Paul Oakley Johnson

Hilary Tony Godard

Douglas Edmon Goforth

G Clinton Shay

Dennis I Butts

Paul D Albee

Mallanagouda Dyamanagouda Patil

Methods for machining glass structures may be performed on fusion-drawn glass laminates having a core layer interposed between a first cladding layer and a second cladding layer. The core layer may be formed from a core glass composition having a core photosensitivity, the first cladding layer may be formed from a glass composition having a photosensitivity different from the core photosensitivity, and the second cladding layer may be formed from a glass composition having a photosensitivity different from the core photosensitivity. At least one of the core layer, the first cladding layer, and the second cladding layer is a photomachinable layer. The methods may include exposing a selected region of a photomachinable layer in the fusion-drawn laminate to ultraviolet radiation; heating the glass structure until the selected region crystallizes; and removing the crystallized material selectively from the photomachinable layer.

Machining of fusion-drawn glass laminate structures containing a photomachinable layer

An apparatus for forming glass tubing is described. The apparatus for forming glass tubing comprises an endless former with an outer surface and an inner passage defining an inner surface. The apparatus for forming glass tubing further comprises two chambers from which molten glass may flow. One chamber flows molten glass to the outer surface of the endless former and another chamber flows molten glass to the inner surface of the endless former. The two flows of molten glass meet at the bottom of the former to form glass tubing.

Overflow downdraw glass tube forming apparatus

An apparatus () for forming the outer layers of a glass laminate sheet comprises a reservoir (), individual first () and second () distributors extending below and in fluid communication with the reservoir, and first () and second () slots positioned respectively at the bottom of the first and second distributors. The slots have a length, the distributors have sides and a middle, and the length of the slots on the sides of the distributors is desirably decreased relative to the length of the slots in the middle of the distributors. The apparatus is useful with a trough or isopipe () to provide clad glass streams to contact an overflowing core glass on respective sides of the trough or isopipe.

Apparatus and method for forming the outer layers of a glass laminate sheet

A crystallized layer can be formed on a substrate from a precursor layer deposited on a surface of the substrate. The precursor layer can be an oxide, a nitride, a carbide, or an oxynitride. The process for forming the crystallized layer includes melting the precursor layer formed on the surface of the substrate by localized topical heating of the precursor layer and then cooling the melted precursor layer so that it crystallized to form a scratch resistant crystallized layer. The scratch resistant crystallized layer can have a hardness of 15 GPa or greater.

Method for forming a scratch resistant crystallized layer on a substrate and article formed therefrom

In one embodiment, a pulling roll for drawing glass sheet in a down-draw process includes a shaft member and a compliant cover assembly positioned on the shaft member. The compliant cover assembly includes at least one traction disk positioned on the shaft member. The at least one traction disk includes an annular hub and a plurality of spring elements integrally formed with the annular hub. The spring elements project outward from the annular hub such that an end of each spring element is positioned radially outward from a base of each spring element and is circumferentially offset relative to the base of each spring element.

Pulling rolls with spring elements having increased angular length for use in glass manufacturing and processes incorporating the same

Pulling rolls for used in forming glass ribbons with reduced defects and cracking are disclosed. In one embodiment, the pulling roll may include a shaft member and a roll assembly. The roll assembly may be positioned on the shaft member for rotation with the shaft member. The roll assembly may include an axially compressed stack of ring elements formed from an inorganic material such as mica paper. The mica paper may include layers of overlapping mica platelets oriented substantially in parallel with one another. A contact surface of the roll assembly may have a Shore D hardness greater than or equal to about 10 and less than or equal to about 60.

Pull-rolls for use in glass manufacturing processes and methods for making the same

A method of treating a sheet of semiconducting material comprises forming a sinterable first layer over each major surface of a sheet of semiconducting material, forming a second layer over each of the first layers to form a particle-coated semiconductor sheet, placing the particle-coated sheet between end members, heating the particle-coated sheet to a temperature effective to at least partially sinter the first layer and at least partially melt the semiconducting material, and cooling the particle-coated sheet to solidify the semiconducting material and form a treated sheet of semiconducting material.

Technique to modify the microstructure of semiconducting materials

The invention relates to methods of making articles of semiconducting material and semiconducting material articles formed thereby, such as articles of semiconducting material that may be useful in making photovoltaic cells.

Methods of making an unsupported article of pure or doped semiconducting material

A method of making an article of a semiconducting material involves withdrawing from a melt of molten semiconducting material a solid mold having already formed on an external surface of the mold a solid layer of the semiconducting material. During the act of withdrawal, one or more of a temperature, a force, and a relative rate of withdrawal are controlled in order to achieve one or more desired attributes in a solid overlayer of semiconductor material that is formed over the solid layer during the withdrawal.

Method of making an article of semiconducting material

A method for treating semiconducting materials includes providing a semiconducting material having a crystalline structure, pre-heating a portion of the semiconducting material to a temperature less than the melting temperature of the semiconducting material, and then cooling the semiconducting material prior to exposing at least the portion of the semiconducting material to a heat source to create a melt pool, and cooling the semiconducting material.

Methods of treating semiconducting materials including melting and cooling

The invention relates to methods of making articles of semiconducting material on a mold comprising semiconducting material and semiconducting material articles formed thereby, such as articles of semiconducting material that may be useful in making photovoltaic cells.

Methods of making an article of semiconducting material on a mold comprising semiconducting material

Methods for making and/or treating articles of semiconducting material are disclosed. In various methods, a first article of semiconducting material is provided, the first article of semiconducting material is heated sufficiently to melt the semiconducting material, and the melted semiconducting material is solidified in a direction substantially parallel to a shortest dimension of the melted article of semiconducting material. Articles of semiconducting materials made by methods described herein are also disclosed.

High throughput recrystallization of semiconducting materials

A laminated sheet includes a surface layer having an optical surface that is of fire-polished quality and a core layer having a higher modulus than the surface layer to increase an overall stiffness or fracture toughness of the laminated sheet.

High-strength laminated sheet for optical applications

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Elmira, NY, United States of America

Glen Bennett Cook