Arm Limited

Atmel Corporation

Nantero, Inc.

Kilopass Technology, Inc.

Virtual Silicon Technology, Inc.

Stellar Kinetics, LLC

Glen Arnold Rosendale

Shidhartha Das

Saroj Pathak

Mudit Bhargava

James E Payne

Lucian Shifren

Nianglamching Hangzo

Bal S Sandhu

Akshay Kumar

Piyush Agarwal

Fernando Garcia Redondo

Claude Louis Bertin

Matthew Mattina

Jack Zezhong Peng

Kimberly Gay Reid

David Fong

Manuj Rathor

George McNeil Lattimore

Harry Luan

Paul Nicholas Whatmough

John M Callahan

Hemanshu T Vernenker

Gregory Munson Yeric

Michael David Fliesler

Jagdish Pathak

Greg Yeric

Zhongshang Liu

Young W Kim

A method and apparatus for performing refactored multiply-and-accumulate operations is provided. A summing array includes a plurality of non-volatile memory elements arranged in columns. Each non-volatile memory element in the summing array is programmed to a high resistance state or a low resistance state based on weights of a neural network. The summing array is configured to generate a summed signal for each column based, at least in part, on a plurality of input signals. A multiplying array is coupled to the summing array, and includes a plurality of non-volatile memory elements. Each non-volatile memory element in the multiplying array is programmed to a different conductance level based on the weights of the neural network. The multiplying array is configured to generate an output signal based, at least in part, on the summed signals from the summing array.

Refactoring mac operations

A non-volatile memory (NVM) crossbar for an artificial neural network (ANN) accelerator is provided. The NVM crossbar includes row signal lines configured to receive input analog voltage signals, multiply-and-accumulate (MAC) column signal lines, a correction column signal line, a MAC cell disposed at each row signal line and MAC column signal line intersection, and a correction cell disposed at each row signal line and correction column signal line intersection. Each MAC cell includes one or more programmable NVM elements programmed to an ANN unipolar weight, and each correction cell includes one or more programmable NVM elements. Each MAC column signal line generates a MAC signal based on the input analog voltage signals and the respective MAC cells, and the correction column signal line generates a correction signal based on the input analog voltage signals and the correction cells. Each MAC signal is corrected based on the correction signal.

Non-volatile memory accelerator for artificial neural networks

A multiply-accumulate method and architecture are disclosed. The architecture includes a plurality of networks of non-volatile memory elements arranged in tiled columns. Logic digitally modulates the equivalent conductance of individual networks among the plurality of networks to map the equivalent conductance of each individual network to a single weight within the neural network. A first partial selection of weights within the neural network is mapped into the equivalent conductances of the networks in the columns to enable the computation of multiply-and-accumulate operations by mixed-signal computation. The logic updates the mappings to select a second partial selection of weights to compute additional multiply-and-accumulate operations and repeats the mapping and computation operations until all computations for the neural network are completed.

Non-volatile memory-based compact mixed-signal multiply-accumulate engine

In a particular implementation, a method includes: providing a first voltage to a word-line coupled to a first transistor device; providing a second voltage to a bit-line coupled to the first transistor device; providing a third voltage to a source-line coupled between a programmable resistive device and a voltage control element. Also, the first transistor device is coupled to the programmable resistive device and the voltage control element, where the programmable resistive device is configured to replace a first data value by writing a second data value in the programmable resistive device. Moreover, in response to a voltage difference across the programmable resistive device exceeding a particular threshold, limiting the voltage difference by one of reducing the second voltage on the bit-line or increasing the third voltage on the source-line.

Devices and methods for controlling write operations

A circuit is provided for limiting an applied voltage applied between a power line and an electrical ground. The circuit includes a transistive element connected between the power line and the electrical ground to provide a channel, where current flow through the channel is controlled by a control voltage provided to a control terminal of the transistive element. A first Correlated Electron Material (CEM) device having an impedance state is coupled between the power line and a first node, and a sensing circuit coupled between the first node and the control terminal of the transistive element. The sensing circuit is configured to detect a voltage drop across the CEM device and to provide the control voltage. The channel of the transistive element is opened when the detected voltage drop across the CEM device exceeds a threshold. The CEM device may contain a transition metal oxide (TMO), for example.

Power clamp with correlated electron material device

Disclosed are methods, systems and devices for operation of correlated electron switch (CES) devices. In one aspect, a CES device may be placed in any one of multiple impedance states in a write operation by controlling a current and a voltage applied to terminals of the non-volatile memory device. In one implementation, a CES device may be placed in a high impedance or insulative state, or two more distinguishable low impedance or conductive states.

Method, system and device for testing correlated electron switch (CES) devices

Subject matter disclosed herein may relate to fabrication of correlated electron materials used, for example, to perform specified application performance parameters. In embodiments, CEM devices fabricated at a first stage of a wafer fabrication process, such as a front-end-of-line stage, may differ from CEM devices fabricated at a second stage of a wafer fabrication process, such as a middle-of-line stage or a back-end-of-line stage, for example.

Methods and processes for forming devices from correlated electron material (CEM)

Subject matter disclosed herein may relate to fabrication of correlated electron materials (CEMs) devices used, for example, to read from a resistive memory element or to write to a resistive memory element. In embodiments, by limiting current flow through a CEM device, the CEM device may operate in the absence of Mott and/or Mott-like transitions in a way that brings about symmetrical diode-like operation of the CEM device.

Forming and operating memory devices that utilize correlated electron material (CEM)

Disclosed are methods, systems and devices for operation of memory device. In one aspect, a bitcell may represent a binary value, symbol, parameter or condition based on complementary impedance states of first and second memory elements. In one aspect, a first bitline and a second bitline may be coupled to terminals of the first and second memory elements. A circuit may detect the complementary impedance states responsive to a difference in a rates of charging of the first and second bitlines.

Method, system and device for complementary impedance states in memory bitcells

Method, system and device for non-volatile memory device operation

Disclosed are methods, systems and devices for operation of non-volatile memory devices. In one aspect, a read operation or a particular write operation may be performed on a correlated electron switch (CES) device by coupling a terminal of the CES device to a particular node through any one of multiple different resistive paths.

Method, system and device for non-volatile memory device operation with low power, high speed and high density

Subject matter disclosed herein may relate to correlated electron switch elements and, more particularly, to controlling current through correlated electron switch elements during programming operations.

Controlling current through correlated electron switch elements during programming operations

Subject matter disclosed herein may relate to correlated electron switch devices, and may relate more particularly to voltage detection with correlated electron switch devices.

Voltage detection with correlated electron switch

Subject matter disclosed herein may relate to correlated electron switch devices, and may relate more particularly to digital to analog conversion using correlated electron switch devices ces.

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Palo Alto, CA, United States of America

Glen Arnold Rosendale