Sgs-thomson Microelectronics S.r.l.

Stmicroelectronics S.r.l.

Sgs Microelettronica Spa

Giuseppe Paolo Crisenza

Giovanni Campardo

Marco Dallabora

Cesare Clementi

Giorgio De Santi

Orio Bellezza

Gabriella Fontana

Gianfranco Cerofolini

Luca Zanotti

Leonardo Ravazzi

Aldo Losavio

Carlo Bergonzoni

Tiziana Cavioni

Pierangelo Pansana

Daniele Cantarelli

Gabriella Ghidini

A planarization method is disclosed to provide improved protection against cracking of the final passivation layer of integrated circuit devices. In one embodiment, such method includes final passivation of an integrated circuit device including at least one integrated circuit chip. Such final passivation includes the step of forming a layer of protective material over a top surface of the integrated circuit chip, and a subsequent step of planarizing such layer of protective material to obtain a protection layer having a substantially flat top surface.

Method for final passivation of integrated circuit

An insulating film between stacked electrically conducting layers through which interconnections of integrated circuits are realized, is formed of an aerogel of an inorganic oxide on which organic monomers have been grafted under inert ion bombardment and successively further incorporated in the aerogel to fill at least partially the porosities of the inorganic aerogel. The composite dielectric material is thermally stable and has a satisfactory thermal budget. The method of forming an aerogel film includes the spinning of a precursor compound solution onto the wafer followed by supercritical solvent extraction carried out in the spinning chamber.

Low dielectric constant composite film for integrated circuits of an

Method for localizing point defects causing column leakage currents in a non-volatile memory device, said device including a plurality of memory cells arranged in rows and columns in a matrix structure, the columns being connected to drain regions by first contacts, source diffusions, and metal lines which connect the source diffusions to each other by second contacts. The method includes the steps of modifying the memory device in order to eliminate a part of the first contacts and all the second contacts, and to form third contacts, which connect the metal lines to drain regions in rows wherein the first contacts have been eliminated, making the source diffusions independent of each other and halving the initial number of the memory cells; sequentially biasing the single columns of the matrix; sequentially biasing the single rows of the matrix, keeping biased one column; localizing a memory cell which presents the point defects, when the leakage current flow occurs.

Method and apparatus for localizing point defects causing leakage

A non-volatile integrated device having first and second dimensionally different polysilicon gate layers separated by an oxide layer for hot-carrier reliability. More specifically, the oxide and second polysilicon gate layer are selectively etched to form a second gate region over the first polysilicon gate layer that electrically contacts the first polysilicon gate in one direction and is isolated by the oxide in the other direction. Insulating sidewalls are formed over the first polysilicon gate layer regions that are not electrically contacted by the second gate layer to help isolate the second polysilicon gate and form an LDD structure within the substrate for the device.

Non-volatile integrated low-doped drain device with partially

A method comprising the steps of depositing a first and second polysilicon layer, separated by an oxide layer; selectively etching the second polysilicon layer to form first gate regions; forming first substrate regions in the substrate and laterally in relation to the first gate regions; selectively etching the first polysilicon layer to form second gate regions of a length greater than the first gate regions; and forming in the substrate, laterally in relation to the second gate regions and partially overlapping the first substrate regions, second substrate regions of a higher doping level than the first substrate regions.

Method of fabricating non-volatile memories with overlapping layers

An improved fabrication process employing relatively non-critical masks permits the fabrication of high density electrically programmable and erasable EEPROM or FLASH-EPROM devices. In practice the novel process permits the fabrication of a contactless, cross-point array providing for a more comfortable 'pitch' of bitline metal-definition while realizing a cell layout with a gate structure which extends laterally over adjacent portions of field oxide, thus establishing an appropriate capacitive coupling between control and floating gates. Two alternative embodiments are described.

Process for fabricating a contactless electrical erasable EPROM memory

In a flash-EEPROM array, the cells in each row are grouped into pairs connected to the same diffused source line and to two different diffused bit lines, and the adjacent pairs of cells are spaced so that, in each row, only one cell is connected to a respective diffused bit line. The array presents global bit lines in the form of metal lines, and each connected to a plurality of diffused local bit lines, at least one for each sector. For each sector and each global bit line, there are provided two diffused local bit lines connected to the same respective global bit line by selection transistors so that only one local bit line is biased each time.

EEPROM memory with contactless memory cells

A method for writing cells in a memory which reduces errors caused by depleted memory array cells being turned on even when not selected. In the method, nonselected bit lines and nonselected word lines are biased so that the threshold voltage of the nonselected cells increases. In particular, the nonselected bit lines are left floating and the nonselected word lines are set to a zero voltage. Appropriate potentials are applied to the selected word line, selected bit line, and selected source line in order to program the selected cell.

Method of programming a nonvolatile flash-EEPROM memory array using

To reduce read and write errors caused by depleted memory array cells being turned on even when not selected, the nonselected memory cells are so biased as to present a floating terminal and a terminal at a positive voltage with respect to the substrate region. The threshold voltage of nonselected cells (i.e., the minimum voltage between the gate and source terminals for the cell to be turned on) increases due to a 'body effect', whereby the threshold voltage depends on the voltage drop between the source terminal and the substrate. The source line of a selected cell is biased to a positive value greater than that of the bit line of the selected cell. Methods for reading, writing and erasing cells using certain voltage levels are disclosed.

Method of reading, erasing and programming a nonvolatile flash-EEPROM

Non-volatile memory in an integrated circuit

A method for measuring the degree of planarity in an integrated circuit includes depositing, onto a dielectric layer to be measured for planarity, a predetermined measure path of a conductive film and measuring the electric resistance of said measure path. The resistance of such a measure path is minimal where the surface on which it has been deposited is perfectly planar, and increases with the surface deviation from perfect planarity. An integrated circuit containing a measurement portion of conductive film and a reference portion of conductive film is described.

Process and structure for measuring the planarity degree of a dielectric

To reduce the number of depleted cells and the errors caused thereby, the memory array includes groups of control transistors corresponding to groups of memory cells. The control transistors of each group are NMOS transistors having the drain terminal connected to a control line. Each of the control transistors corresponds to a row portion of the memory array. Each control transistor has a control gate connected to a respective word line and a source region connected by a respective source line to the source regions of the memory cells in the same row and group.

Nonvolatile flash-EEPROM memory array with source control transistors

Method of fabricating integrated devices

A process for fabricating CMOS integrated devices includes forming an n-type deep well diffusion region in a surface of a p-type monocrystalline silicon substrate. Transistor devices having a p-type channel region are formed within the deep well diffusion regions, and transistor devices having an n-type channel region are formed external the deep well diffusion regions. The improvement of the present invention includes the step of performing an unmasked ion implantation of boron over the entire surface of the monocrystalline silicon substrate after having formed the deep well diffusion regions in order to effect simultaneously a partial compensation of a superficial doping level of the deep well diffusion region and an enrichment of a superficial doping level of the monocrystalline silicon substrate external the deep well diffusion region.

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Trezzo sull'Adda, Italy

Giuseppe Paolo Crisenza