Avago Technologies General IP (singapore) Pte. Ltd.

Cselt-centro Studi E Laboratori Telecomunicazioni S.p.a.

Giuliana Morello

Alessandro Stano

Roberto Paoletti

Ruiyu Fang

Giammarco Rossi

Giancarlo Meneghini

Guido Alberto Roggero

Rui Yu Fang

Pietro Della Casa

Fernando Genova

Paola-Ida Gotta

An edge-emitting optical semiconductor structure has a substrate, an active multiple quantum well (MQW) region formed on the substrate, and a ridge waveguide extending between first and second etched end facets. The first etched end facet is disposed in a first window, while the second etched end facet is disposed in a second window. The first etched end facet extends between a pair of alcoves in the first window, and the second etched end facet extends between a pair of alcoves in the second window. An integrated device in which two such structures are provided has an H-shaped window where the two structures adjoin each other. The structure can be fabricated using a process that involves a first mask to form the ridge waveguide and then a second mask and an etching process to form the windows.

Semiconductor lasers and etched-facet integrated devices having H-shaped windows

An edge-emitting etched-facet optical semiconductor structure has a substrate, an active multiple quantum well (MQW) region formed on the substrate, and a ridge waveguide formed over the MQW region extending in substantially a longitudinal direction between a waveguide first etched end facet and a waveguide second etched end facet. A mask layer used to form windows in which the etched end facets are disposed consists of a single dielectric material disposed directly on the ridge waveguide. An optical coating consisting of no more than one layer of the same dielectric material of which the second mask is made is disposed directly on the second mask and disposed directly on the windows to coat the etched end facets.

Etched-facet lasers having windows with single-layer optical coatings

A surface-emitting semiconductor laser device that includes an edge-emitting laser formed in layers of semiconductor material disposed on a semiconductor substrate, a polymer material disposed on the substrate laterally adjacent the layers in which the edge-emitting laser is formed, a diffractive or refractive lens formed on an upper surface of the polymer material, a side reflector formed on an angled side reflector facet of the polymer material generally facing an exit end facet of the laser, and a lower reflector disposed on the substrate beneath the polymer material. Laser light passes out of the exit end facet and propagates through the polymer material before being reflected by the side reflector toward the lower reflector. The laser light is then re-reflected by the lower reflector towards the lens, which directs the laser light out the device in a direction that is generally normal to the upper surface of the substrate.

Surface-emitting semiconductor laser device in which an edge-emitting laser is integrated with a diffractive or refractive lens on the semiconductor laser device

An effusion source for epitaxial deposition plants wherein molecular vapor beams are directed towards a substrate to be grown in ultrahigh vacuum environment, which has a first tube, which is airtightly closed at one end by flanges allowing the passage of vapor inlet tubes and is equipped at the the other end with baffle plates and a nozzle for mixing vapors and shaping the molecular beam. A second tube, coaxially joined to the first tube, allows an interstice at ambient pressure and temperature to be obtained in the zone of the vapor mixing and molecular beam shaping, wherein a heating can be located.

Vapor effusion source for epitaxial deposition plants

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Turin, Italy

Giuliana Morello