Dell USA L P

Dell Computer Corporation

Gita P Khadem

James S Bell

Jerry D Gandre

R Steven Mills

Joseph A Vivio

George Thomas Holt

Darrell J Slupek

Thad McMillan

Steve L Sands

A printed circuit board includes a plurality of dielectric substrates. Each of the dielectric substrates includes a first and a second surface and has a first conductive layer formed on the first surface of the respective dielectric substrate. A first pattern of lands is formed in the conductive layer of at least two of the dielectric substrates. The pattern of lands of each dielectric substrate is substantially the same. An opening is formed through each of the lands to expose the respective dielectric substrate. Each of the openings in a respective pattern of lands has a diameter different than at least a portion of the other openings in the same pattern. The plurality of dielectric substrates are laminated in stacked relationship.

Printed circuit board and method for evaluating the inner layer hole registration process capability of the printed circuit board manufacturing process

The present application describes a through-hole component insulator and assembly process which has the advantages of preventing solder from contacting the metal case of a through-hole component without an addition step or additional material from the standard fabrication process for a printed circuit board. The printed circuit board of the present invention includes a printed ink spacer disposed beneath the through-hole component wherein the printed ink spacer is included with a standard silk-screen artwork layer in the printed circuit board design stage. The printed ink spacer raises the through-hole component from the printed circuit board surface to prevent solder from contacting the metal case of the through-hole component during the printed circuit board soldering stage. Using a silk-screen artwork layer which includes at least one printed ink spacer in the artwork, the printed ink spacer is deposited during deposition of a standard printed design on the printed circuit board fabrication.

Printed circuit board manufacturing method for through hole components

A circuit board has mounted thereon a component package which is secured in place by a retaining device designed to maintain the component package in place and protect it from shock and vibration. The retaining device includes a shortened and strengthened retaining arm which in one position acts to snap on to the component package thereby holding it in place. In a second position the retaining device is removed and repositioned relative to the component package to be utilized in providing a leveraging action to detach the component package from the circuit board.

Circuit board component retainer and extractor

There is disclosed a technique for constructing a printed circuit board assembly to provide solder joints with a uniform height. A solder mask is provided on the external surfaces of the printed circuit board to minimize the mount of conductive pad area that is exposed to solder. The solder mask includes a plurality of relatively small openings with a predetermined pattern to minimize the build up of solder, while insuring sufficient solder height to connect to the grounding component located on the chassis to insure adequate EMI protection. Preferably a polka dot pattern is used for certain conductive pads, while a single narrow strip or the solder mask opening configuration is used for rectangular pad configurations. Other configurations and patterns are also available to provide an adequate electrical connection while insuring uniform solder height.

System and method for providing uniform solder jiunt height for printed

A printed circuit board ground clip is provided having upwardly extending retainers and downwardly extending legs. The legs are designed to insert within plated-through holes of a variable thickness printed circuit board. The upwardly extending retainers terminate as a spaced pair of flanges which frictionally receive and electrically couple with a hook. The hook extends from the chassis of an electronic device, through a slot within the printed circuit board and between the spaced flanges. Accordingly, the hook and ground clip form an electrical conduit between a ground supply connected to the electronic device chassis and a ground conductor formed within the printed circuit board. Chassis-to-ground conductor attachment is performed during assembly of the board to the chassis backplane. Attachment can be quickly and easily reversed to allow board re-work, without requiring placement of heat upon the board. The present attachment mechanism further avoids user-inserted fasteners and the reliability problems they present.

Growing community of inventors

Austin, TX, United States of America

Gita P Khadem