Micron Technology Incorporated

Qimonda Ag

Girolamo Gallo

Giulio Giuseppe Marotta

Tommaso Vali

Giovanni Naso

Detlev Richter

Giuliano Gennaro Imondi

Roberto Ravasio

Ramirez Xavier Veredas

Josef Willer

Andreas Kux

Gert Koebernik

Mirko Reissmann

In an embodiment, a method for transferring data in a memory device is provided. The method may include transferring data from a first memory cell arrangement including a plurality of memory cells to a second memory cell arrangement including a plurality of memory cells via a connecting circuit arrangement coupled to the plurality of memory cell arrangements and providing a plurality of controllable connections via a plurality of connecting circuit terminals, the memory cell arrangements being connected with at least one connecting circuit terminal of the plurality of connecting circuit terminals, wherein the connecting circuit is configured to provide arbitrarily controllable signal flow connections between the plurality of connecting circuit terminals. The data are transferred via a logic connection using the controllable connections. Simultaneously, a further logic connection may be provided to a memory cell arrangement of the memory cell arrangements using the controllable connections.

Memory device and method providing logic connections for data transfer

Embodiments of the invention relate generally to an integrated circuit having a memory cell arrangement and a method for reading a memory cell state using a plurality of partial readings. In an embodiment of the invention, an integrated circuit having a memory cell arrangement is provided. The memory cell arrangement may include at least one memory cell, the memory cell being capable of storing a plurality of memory cell states being distinguishable by a predefined number of memory cell threshold values, and a controller configured to read a memory cell state of the at least one memory cell using a number of reference levels that is higher than the predefined number of memory cell threshold values, wherein the reading includes a first partial reading using a first set of a plurality of reference levels and a second partial reading using a second set of a plurality of reference levels, wherein the second set of a plurality of reference levels includes at least one reference level which is different from the reference levels of the first set of a plurality of reference levels.

Integrated circuit having a memory cell arrangement and method for reading a memory cell state using a plurality of partial readings

A sense amplifier for multiple level flash memory cells is comprised of a voltage ramp generator that generates a ramp voltage signal. Reference sense amplifiers compare an input reference current to a ramp current generated from the ramp voltage signal. When the ramp voltage signal is greater than the reference current, an output latch signal is toggled. A sense amplifier compares an input bit line current to a threshold and outputs a logical low when the bit line current goes over the threshold. The sense amplifier output is latched into one of three digital latches at a time determined by the latch signals. An encoder encodes the data from the three digital latches into two bits of output data.

Low power multiple bit sense amplifier

Apparatus and methods for adjusting the buffer strength of an output buffer to match its capacitive load use selectively enabled stages of a multiple stage output buffer. A user can opt for a default capacitive load, or adjust the strength by enabling one or more stages of the multiple stage output buffer.

Output buffer strength trimming

An output buffer for a semiconductor memory device and other semiconductor devices includes a feedback circuit to dynamically control the output impedance of the output buffer in response to a variety of load conditions, thus reducing output ringing. The output buffer may also include circuitry to support selectively converting the device for operation at a variety of supply voltage ranges without the need for additional mask or process steps.

Variable impedance output buffer

Sensing circuits are adapted for faster sensing of a programmed state of a floating-gate memory cell. The sensing circuits include a first precharging path for applying a first precharge potential to the input node of a sensing device for precharging bit lines prior to sensing the programmed state of the floating-gate memory cell. The sensing circuits further include a second precharging path for applying a second precharge potential to a target global bit line for precharging bit lines prior to sensing the programmed state of the floating-gate memory cell. The second precharging path is activated during only a portion of the precharging phase of a sensing operation to bring the bit lines rapidly up toward an asymptotic potential level. The second precharging path is thus deactivated prior to deactivating the first precharging path.

Fast sensing scheme for floating-gate memory cells

Methods and apparatus for a memory device including a burst architecture employ a double bus architecture that is multiplexed onto an output bus. The resulting architecture effectively facilitates doubling throughput without increasing memory device latency.

Dual bus memory burst architecture

Variable impedence output buffer

A method and apparatus for a memory device including a burst architecture employs a double bus architecture that is multiplexed onto an output bus at clock rate that is doubled. The resulting architecture effectively doubles throughput without increasing memory device latency.

Growing community of inventors

Avezzano, Italy

Girolamo Gallo