Integrated Silicon Solution, (Cayman) Inc.

Spin Memory, Inc.

Girish Jagtini

Mustafa Pinarbasi

Elizabeth Ann Dobisz

Thomas D Boone

Pradeep Manandhar

Yuan-Tung Chin

Embodiments of the present invention include multiple independent terminals for a plurality of devices in a stack configuration within a semiconductor. In one embodiment, a semiconductor comprises: a first device at a first semiconductor level within a multi terminal device stack; wherein the first device is coupled to a first terminal; a second device at a second semiconductor level within the multi terminal device stack, wherein the second device is coupled to a second terminal; a third terminal is coupled to the second device and a fourth terminal is coupled to the first device, wherein the first terminal and second terminal are independently coupled to the first device and second device respectively. The first terminal, the second terminal, the third terminal and the fourth terminal couple components included in the multi terminal stack to components not included in the multi terminal stack.

Multi terminal device stack systems and methods

Embodiments of the present invention include multiple independent terminals for a plurality of devices in a stack configuration within a semiconductor. In one embodiment, a multi terminal fabrication process comprises: performing an initial pillar layer formation process to create layers of a multi terminal stack; forming a first device in the layers of the multi terminal stack; forming a second device in the layers of the multi terminal stack; and constructing a set of terminals comprising: a first terminal coupled to the first device, a second terminal coupled to the second device; and a third terminal coupled to the first device; wherein at least two terminals in the set of terminals are independent. The third terminal can be coupled to the second device.

Multi terminal device stack formation methods

Embodiments of the present invention include multiple independent terminals for a plurality of devices in a stack configuration within a semiconductor. In one embodiment, a semiconductor comprises: a first device at a first semiconductor level within a multi terminal device stack; wherein the first device is coupled to a first terminal; a second device at a second semiconductor level within the multi terminal device stack, wherein the second device is coupled to a second terminal; and a third terminal is coupled to the first device, wherein the first terminal and second terminal are independently coupled to the first device and second device respectively. The third terminal can be coupled to the second device. The first terminal, the second terminal, and third terminal and couple components included in the multi terminal stack to components not included in the multi terminal stack.

Growing community of inventors

Fremont, CA, United States of America

Girish Jagtini