Micron Technology Incorporated

Giovanni Maria Paolucci

Augusto Benvenuti

Kishore Kumar Muchherla

James Fitzpatrick

Huai-Yuan Tseng

Paolo Tessariol

Akira Goda

Emilio Camerlenghi

Gianpietro Carnevale

Ramanathan Gandhi

Dave Scott Ebsen

Tomoharu Tanaka

Eric N Lee

Jeffrey S McNeil, Jr

Michele Incarnati

Walter Di Francesco

Dung Viet Nguyen

Daniel J Hubbard

Umberto Siciliani

Exemplary methods, apparatuses, and systems include an adaptive pre-read manager for controlling pre-reads of the memory device. The adaptive pre-read manager receives a first set of data bits for programming to memory. The adaptive pre-read manager performing a first pass of programming including a first subset of data bits from the set of data bits. The adaptive pre-read manager compares a set of threshold operating differences to a set of differences between multiple operating conditions during the first pass of programming and current operating conditions. The adaptive pre-read manager performs an internal pre-read of the programmed first subset of data bits. The adaptive pre-read manager performs a second pass of programming using the internal pre-read and a second subset of data bits from the first set of data bits.

Adaptive pre-read management in multi-pass programming

A method includes causing a first set of memory cells, associated with a first wordline of a memory array, to be programmed with a first set of threshold voltage distributions; causing a second set of memory cells, associated with a second wordline adjacent to the first wordline, to be programmed with a second set of threshold voltage distributions; after programming the second set of cells, causing the first set of memory cells to be coarse programmed with an intermediate third set of threshold voltage distributions that is at least twice in number compared to the first set; and causing the first set of memory cells to be fine programmed with a final third set of threshold voltage distributions. At least some threshold voltage distributions of the final third set of threshold voltage distributions have wider read window margins than those of the intermediate third set of threshold voltage distributions.

Memory programming using consecutive coarse-fine programming operations of threshold voltage distributions

A memory device includes a memory array and control logic to perform operations including identifying a target cell and a set of cells adjacent to the target cell. Each cell of the set of cells is associated with a respective adjacent cell state. The operations further include determining, for each adjacent cell state, a respective interference value, assigning, based on the respective interference value, each adjacent cell state to a respective bin of a set of state information bins, and in response to determining that each bin of the set of state information bins has at least one adjacent cell state assigned to it, and determining a set of read level offsets for reading the target cell. Each read level offset of the set of read level offsets is associated with a respective bin of the set of state information bins.

Balanced corrective read for addressing cell-to-cell interference

Methods of operating a memory, and memory configured to perform similar methods, might include applying a negative first voltage level to a control gate of a transistor connected between a first node and a string of series-connected memory cells, increasing a voltage level applied to the first node at a particular rate while increasing the voltage level applied to the control gate of the transistor at the particular rate, and in response to the voltage level applied to the first node reaching a particular voltage level, ceasing increasing the voltage level applied to the first node and ceasing increasing the voltage level applied to the control gate of the transistor.

Erasing memory

A transistor comprises a channel region having a frontside and a backside. A gate is adjacent the frontside of the channel region with a gate insulator being between the gate and the channel region. Insulating material having net negative charge is adjacent the backside of the channel region. The insulating material comprises at least one of AlF, HfAlF, AlON, and HfAlON, where 'x', “y”, and “z” are each greater than zero. Other embodiments and aspects are disclosed.

Transistors and arrays of elevationally-extending strings of memory cells

Exemplary methods, apparatuses, and systems including a programming manager for controlling writing data bits to a memory device. The programming manager receives a first set of data bits for programming to memory. The programming manager writes a first subset of data bits to a first wordline during a first pass of programming. The programming manager writes a second subset of data bits of the first set of data bits to a buffer. The programming manager receives a second set of data bits for programming. The programming manager writes the second subset of data bits of the first set of data bits to the first wordline during a second pass of programming to increase a bit density of memory cells in the first wordline in response to receiving the second set of data bits.

Two-pass corrective programming for memory cells that store multiple bits and power loss management for two-pass corrective programming

A transistor comprises a channel region having a frontside and a backside. A gate is adjacent the frontside of the channel region with a gate insulator being between the gate and the channel region. Insulating material having net negative charge is adjacent the backside of the channel region. The insulating material comprises at least one of AlF, HfAlF, AlON, and HfAlON, where 'x', 'y', and &#x201c;z&#x201d; are each greater than zero. Other embodiments and aspects are disclosed.

Methods of operating a memory, and memory configured to perform similar methods, might include applying a positive first voltage level to a first node selectively connected to a string of series-connected memory cells while applying a negative second voltage level to a control gate of a transistor connected between the first node and the string of series-connected memory cells, and increasing the voltage level applied to the first node to a third voltage level while increasing the voltage level applied to the control gate of the transistor to a fourth voltage level lower than the third voltage level and higher than the first voltage level.

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Milan, Italy

Giovanni Maria Paolucci