Hitachi Energy Switzerland Ag

Abb Power Grids Switzerland Ag

Giovanni Alfieri

Vinoth Sundaramoorthy

A method for forming a semiconductor device includes implanting first ions and second ions into a p-type silicon carbide layer from a first main side to form an implantation layer at the first main side. The implanting is performed by plasma immersion ion implantation in which the p-type silicon carbide layer is immersed in a plasma comprising the first ions and the second ions. The first ions can be ionized aluminum atoms and the second ions are different from the first ions.

Method of making a silicon carbide electronic device

A method for p-type doping of a silicon carbide layer includes first implantation step of implanting aluminum dopants into a preselected region of the silicon carbide layer by ion implantation, an annealing step of annealing the silicon carbide layer after performing the first implantation step, a second implantation step of implanting beryllium dopants into the preselected region by ion implantation before the annealing step. A ratio of the total aluminum dose in the first implantation step to the total beryllium dose in the second implantation step is in a range between 0.1 and 10.

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Baden, Switzerland

Giovanni Alfieri