Henkel Ag & Company, Kgaa

Henkel IP & Holding Gmbh and Henkel Ag & Co. Kgaa

Permabond Engineering Adhesives Ltd

Giorgio Zaffaroni

Sebastien Lanau

Christopher Verosky

Eleonora Salmoiraghi

Alessio Monesi

Luca Mario Marchese

Eugen Bilcai

Sebastiano Moscardin

Monica Noseda

Daniela Sicari

Antonio Grauso

Manuela Brusa

Alessio Faggianelli

Antonello Talamini

Marco Signorile

The present invention relates to a process for modifying the surface polarity of elastomeric rubber substrates to facilitate their cold bonding to other rubber substrates or non-elastomeric substrates of a different material, preferably metal, by chlorinating the elastomeric rubber substrate surface by treatment with a chloride-containing composition and a peroxymonosulfate-containing composition. Further aspects relate to the thus-obtained surface-modified rubber substrates, processes of bonding them to other substrates by use of an adhesive, as well as the thus-obtained bonded substrates.

Process for modifying the surface polarity of rubber substrates

Cyanoacrylic adhesive compositions of the type comprising at least one cyanoacrylic acid ester or one malonic acid ester having an allyl, acrylic or methacrylic group, wherein there is also present at least one radical initiator of the polymerization reaction of the allyl, acrylic or methacrylic ester of cyanoacrylic acid or malonic acid and at least one radical inhibitor of said polymerization reaction. In comparison with known cyanoacrylic adhesive compositions, those according to the invention offer the advantage of maintaining their bonding capability even at high temperatures, in particular up to 150&#xb0; C.

Cyanoacrylic adhesive compositions with improved resistance to high temperatures

The present invention relates to two-component (2K) silicone-based adhesive compositions comprising an adhesion promotor, as well as to the use of such compositions. Furthermore, the present invention is directed to the use of a &#x2014;Si(OR)terminated polyorganosiloxane prepolymer, as described herein, for improving the adhesive properties of silicone-based adhesive compositions.

Adhesion promoters for polyaddition silicone formulations

A two part curable composition comprising organosiloxane polymer; water; an organosilane such as hexamethyldisilazane (HMDS) or vinyltrimethoxysilane; crosslinker; adhesion promoter and catalyst; and optionally comprising plasticizer; colorant and filler. The first part can comprise organosiloxane polymer and water. The second part can comprise crosslinker; adhesion promoter and catalyst. Either or both parts can optionally further comprise an organosilane such as hexamethyldisilazane (HMDS) or vinyltrimethoxysilane; plasticizer; colorant and filler. Cured reaction products of the two part curable organosiloxane composition has good adhesion to metallic sealing surfaces and good resistance engine oil and other automotive fluids. Cured reaction products of the two part curable organosiloxane composition can surprisingly retain physical properties after long-term exposure to temperatures between 200&#xb0; C. and 250&#xb0; C. and can retain physical properties after exposure to temperatures between 250&#xb0; C. to 300&#xb0; C. for short periods.

High temperature resistant, two component, low viscosity silicone composition

A two part curable composition comprising organosiloxane polymer; water; an organosilane such as hexamethyldisilazane (HMDS) or vinyltrimethoxysilane; crosslinker; adhesion promoter and catalyst; and optionally comprising plasticizer; colorant and filler. The first part can comprise organosiloxane polymer and water. The second part can comprise crosslinker; adhesion promoter and catalyst. Either or both parts can optionally further comprise an organosilane such as hexamethyldisilazane (HMDS) or vinyltrimethoxysilane; plasticizer; colorant and filler. The mixed parts have a low viscosity allowing injection under low pressure. Cured reaction products of the two part curable organosiloxane composition has good adhesion to metallic sealing surfaces and good resistance engine oil and other automotive fluids. Cured reaction products of the two part curable organosiloxane composition can surprisingly retain physical properties after long-term exposure to temperatures between 200&#xb0; C. and 250&#xb0; C. and can retain physical properties after exposure to temperatures between 250&#xb0; C. to 300&#xb0; C. for short periods.

The present invention relates to a process for cold bonding elastomeric rubber substrates to non-elastomeric substrates of a different material, preferably metal, by use of a rubber treatment, preferably a primer composition and a 2k adhesive, preferably a 2k epoxy adhesive as well as the thus obtained bonded substrates.

Process for cold bonding rubber on metal substrates

A thermoplastic composition which comprises at least one polyamide, which preferably has a melting point of less than 185&#xb0; C., and at least one liquid polysiloxane compound which preferably has a viscosity of 750 to 100,000 mPas at 25&#xb0; C. and is OH terminated, wherein the thermoplastic composition is obtainable by a process comprising the steps: Use of this the thermoplastic composition according to the present invention in sealants, adhesives, or as rheological modifier or surface modifier. Furthermore, to a hot melt adhesive comprising the thermoplastic composition according to the present invention. And use of this hot melt in vehicle parts, constructions, windows, glazing, sanitary applications, fittings, roofing, plumbing, appliance application and bonding of panes.

Thermoplastic composition comprising a polyamide and a polysiloxane

The subject matter of the present application is a cold-curing two-component-epoxy adhesive, comprising

Indicator for cure of two-component-epoxy adhesives

The subject matter of the present application is a curable adhesive composition having PTC characteristics after curing, containing (i) a reactive binder system, based on an epoxy-resin-component and a curing agent-component, (ii) particles of a carbon modification in a range of 0.01 wt % to 15.0 wt %, based on the total weight of the curable adhesive composition, and (iii) copper powder in a range of 0.5 wt % to 5.0 wt %, based on the total weight of the curable adhesive composition, wherein the reactive binder system comprises&#x3e;70 wt % of all organic polymers of the adhesive composition.

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Suno, Italy

Giorgio Zaffaroni