International Business Machines Corporation

Giorgio Viero

Stefano Sergio Oggioni

Mauro Spreafico

Gianluca Rogiani

Bruno Michel

Patrick Ruch

Stephan Paredes

Emanuel Loertscher

Michele Castriotta

The present invention is notably directed to a photovoltaic module, or PV module, comprising an array of photovoltaic cells, or PV cells, and electrical interconnects. The array of PV cells comprises N portions, N&#x2265;2, where the portions comprise, each, disjoint sets of PV cells of the array. The electrical interconnects connect the PV cells and the N portions of the array so as for PV cells within each of said portions to be electrically connected in parallel and the N portions to be connected in series. The PV cells and the portions are connected, via said interconnects, so to output an electrical current, in operation. The electrical interconnects are otherwise configured to provide electrical signals from each of the N portions. The invention is further directed to related systems and methods of fabrication and operation.

Photovoltaic module

A method and apparatus for handling and positioning half plated balls for socket application in ball grid array packages. The half plated balls, comprising a first side adapted to be soldered and a second side adapted to establish reliable solderless electrical contact, are embedded in a soft foil, with a common orientation. The soft foil is positioned on a clam-receiving tool and a vacuumed caved cover clam is fitted on the balls and then pushed to cut and separate the polymer sheet from the copper ball surface. The vacuumed caved cover clam is then lifted with the oriented copper balls entrapped inside and the vacuumed caved cover clam places the entrapped balls on the laminate pads, with a deposit of low melt alloy. The air vacuum is deactivated and the cover is lifted, leaving the balls positioned on the pads while the soldering process is initiated and solder joints are formed to fix the balls.

Handling and positioning of metallic plated balls for socket application in ball grid array packages

A coaxial via structure is adapted to transmit high speed signals or high intensity current through conductive layers of an electronic device carrier. The coaxial via structure comprises a central conductive track and an external conductive track separated by a dielectric material and is positioned in a core of the electronic device carrier or in the full thickness of the electronic device. The coaxial via structure can be combined with a stacked via structure so as allow efficient transmission of high speed signals across the electronic device carrier when a manufacturing process limits the creation of a full coaxial via structure across the entire electronic device carrier.

Coaxial via structure for optimizing signal transmission in multiple layer electronic device carriers

A stacked via structure () adapted to transmit high frequency signals or high intensity current through conductive layers of an electronic device carrier is disclosed. The stacked via structure comprises at least three conductive tracks () belonging to three adjacent conductive layers () separated by dielectric layers (), aligned according to z axis. Connections between these conductive tracks are done with at least two vias () between each conductive layer. Vias connected to one side of a conductive track are disposed such that they are not aligned with the ones connected to the other side according to z axis.

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Stezzano, Italy

Giorgio Viero