Applied Materials, Inc.

Applied Materials Italia S.r.l.

Giorgio Cellere

Steven Verhaverbeke

Han-Wen Chen

Kyuil Cho

Giback Park

Vincent Dicaprio

Diego Tonini

Guan Huei See

Marco Galiazzo

Hou Tee Ng

Nag B Patibandla

Daihua Zhang

Kurtis Leschkies

Andrea Baccini

Jeffrey L Franklin

Luigi De Santi

Tommaso Vercesi

Daniele Andreola

Gaudenzio Meneghesso

Diego Barbisan

Enrico Zanoni

Gianfranco Pasqualin

Matteo Meneghini

Alessandro Voltan

Alvise Fecchio

Valentina Furin

Enrico Pasqualetto

Alessio Zanchettin

Park Giback

Andrea Bigolin

Andrea Maccari

Giordano Rocco

The present disclosure relates to thin-form-factor reconstituted substrates and methods for forming the same. The reconstituted substrates described herein may be utilized to fabricate homogeneous or heterogeneous high-density 3D integrated devices. In one embodiment, a silicon substrate is structured by direct laser patterning to include one or more cavities and one or more vias. One or more semiconductor dies of the same or different types may be placed within the cavities and thereafter embedded in the substrate upon formation of an insulating layer thereon. One or more conductive interconnections are formed in the vias and may have contact points redistributed to desired surfaces of the reconstituted substrate. The reconstituted substrate may thereafter be integrated into a stacked 3D device.

Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration

A support device includes a substrate receiving region. The support device includes a support body shaped as a pattern having an array of openings. The support body is a sparse structure wherein a joint area of the openings of the array of openings is 40% or more of the area of the substrate receiving region. The support body includes one or more suction openings configured to be in fluid communication with a vacuum source arrangement.

Support device for supporting a substrate, method of processing a substrate and semiconductor substrate

A method of fabricating a multi-color display includes forming a host matrix over a display having an array of light emitting diodes. The host matrix is sensitive to ultraviolet light. A first plurality of light emitting diodes in a first plurality of wells are activated to illuminate a portion of the host matrix to cause the portion of the host matrix to develop internal porous structures. A first photo-curable fluid including a first color conversion agent is dispensed. The first plurality of light emitting diodes in the first plurality of wells are activated to illuminate and cure the first photo-curable fluid to form a first color conversion layer over each of the first plurality of light emitting diodes, and an uncured remainder of the first photo-curable fluid is removed.

Print process for color conversion layer using porous host or positive photoresist

The present disclosure relates to methods and apparatus for forming a thin-form-factor semiconductor package. In one embodiment, a glass or silicon substrate is structured by micro-blasting or laser ablation to form structures for formation of interconnections therethrough. The substrate is thereafter utilized as a frame for forming a semiconductor package with embedded dies therein.

Package structure and fabrication methods

The present invention generally relates to an apparatus used for simulating spectrum of solar radiation and testing a photovoltaic device using the simulated spectrum of solar radiation. In one embodiment, the apparatus includes a light-source device configured to reproducing spectrum of solar radiation, the light-source device comprising a radiation plate divided into a plurality of cells, and each of the cells comprises a plurality of light-emitting diodes emitting at least two different wavelengths, and a substrate support disposed opposite to the light-source device. In one example, the plurality of light-emitting diodes emit a wavelength that is selected from the group consisting of colors blue, green, yellow, red, a first and a second color in infrared having different wavelengths with respect to each other.

Method and apparatus for testing photovoltaic devices

Embodiments of the invention may provide a method of printing one or more print tracks on a print support, or substrate, comprising two or more printing steps in each of which a layer of material is deposited on the print support according to a predetermined print profile. In each printing step, subsequent to the first step, each layer of material is deposited at least partially on top of the layer of material printed in the preceding printing step, so that each layer of printed material has an identical or different print profile with respect to at least a layer of material underneath. The method may further comprise depositing material in each printing step that is equivalent to or different from the material deposited in at least one of other the print layers.

Printing method for printing electronic devices and relative control apparatus

Growing community of inventors

Torri di Quartesolo, Italy

Giorgio Cellere