Applied Materials, Inc.

Gino Gerardo Crispieri

Michael Johnson

Hemant P Mungekar

James Omer L'Heureux

Andreas Neuber

Maxime Cayer

Ryan T Downey

Tony H Tong

Joseph A Van Gompel

John L Koenig

Mike M Huang

The present disclosure relates to systems and methods for detecting anomalies in a semiconductor processing system. According to certain embodiments, one or more external sensors are mounted to a sub-fab component, communicating with the processing system via a communication channel different than a communication channel utilized by the sub-fab component and providing extrinsic sensor data that the sub-fab component is not configured to provide. The extrinsic sensor data may be combined with sensor data from a processing tool of the system and/or intrinsic sensor data of the sub-fab component to form virtual sensor data. In the event the virtual data exceeds or falls below a threshold, an intervention or a maintenance signal is dispatched, and in certain embodiments, an intervention or maintenance action is taken by the system.

Method and system for detecting anomalies in a semiconductor processing system

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Austin, TX, United States of America

Gino Gerardo Crispieri