Henkel IP Holding Gmbh

Henkel Ag & Company, Kgaa

Gina Hoang

Mieko Sano

YounSang Kim

Sugiura Yoko

Horiguchi Yusuke

Rose Guino

Tadashi Takano

Pukun Zhu

Junbo Gao

Shashi K Gupta

Andrew Laib

Jay Chao

Rong Zhang

Thermosetting resin compositions useful for liquid compression molding encapsulation of a reconfigured wafer are provided. The so-encapsulated molded wafer offers improved resistance to warpage, compared to reconfigured wafers encapsulated with known encapsulation materials.

Liquid compression molding or encapsulant compositions

Provided herein are multilayer structures having a reduced propensity to warp upon curing of certain components thereof. In one aspect, there are provided multilayer assemblies comprising a plurality of the above-described multilayer structures. In another aspect, there are provided methods for reducing wafer warpage upon cure of molding compositions applied thereto. In yet another aspect, there are provided methods for preparing wafers having substantially no warpage upon cure thereof.

Methods to control wafer warpage upon compression molding thereof and articles useful therefor

An adhesive composition for a pre-applied underfill sealant comprising: (a) a radical polymerizable monomer having one or more functional groups selected from the group consisting of vinyl group, maleimide group, acryloyl group, methacryloyl group and allyl group, (b) a polymer having a polar group, (c) a filler, and (d) a thermal radical initiator.

Adhesive for electronic component

Provided herein are conductive die attach films having advantageous properties for use in a variety of applications, e.g., for the preparation of large die semiconductor packages. Also provided are formulations useful for the preparation of such films, as well as methods for making such formulations. In additional aspects of the present invention, there are provided conductive networks prepared from compositions according to the present invention. In additional aspects, the invention further relates to articles comprising such conductive die attach films adhered to a suitable substrate therefor.

Conductive die attach film for large die semiconductor packages and compositions useful for the preparation thereof

A method for preparing a semiconductor with preapplied underfill comprises (a) providing a thinned silicon semiconductor wafer having a plurality of metallic bumps on its active face and, optionally, through-silica-vias vertically through the silicon semiconductor wafer; (b) providing an underfill material on a dicing support tape, in which the underfill material is precut to the shape of the semiconductor wafer; (c) aligning the underfill material on the dicing support tape with the semiconductor wafer and laminating the underfill material to the semiconductor wafer.

Pre-cut wafer applied underfill film on dicing tape

A method for preparing a semiconductor with preapplied underfill comprises providing a semiconductor wafer with a plurality of metallic bumps on its top side and, optionally, through-silica-vias vertically through the silicon wafer; laminating a back grinding tape to the top of the wafer covering the metallic bumps and through silicon vias; thinning the back side of the wafer; mounting a dicing tape to the back side of the thinned wafer and mounting the silicon wafer and dicing tape to a dicing frame; removing the back grinding tape; providing an underfill material precut into the shape of the wafer; aligning the underfill on with the wafer and laminating the underfill to the wafer.

Pre-cut wafer applied underfill film

A conductive adhesive film is prepared from components comprising a thermosetting resin, a film-forming resin, a conductive filler, and further comprising a chain extended epoxy resin prepared from the reaction of a poly-functional phenol with a combination of a poly-functional aromatic epoxy and a poly-functional aliphatic epoxy (poly-functional includes di-functional). The addition of the chain extended epoxy preserves the adhesiveness of the conductive adhesive film at silver loadings of 80 weight percent or greater.

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Garden Grove, CA, United States of America

Gina Hoang