Advanced Semiconductor Engineering, Inc.

Gin-Nan Yeh

Shin-Hua Chao

Shyh-Ing Wu

Kuan-Neng Liao

An improved method of integrally attaching a heat sink to an IC package for enhancing the thermal conductivity of the package. A heat sink matrix, which is dividable into a plurality of individual heat sinks, is attached to an IC package matrix, which is comprised of a plurality of individual IC packages abutting each other in a matrix arrangement. The IC package matrix and the heat sink matrix attached thereto are then simultaneously cut by means of a machine tool into a plurality of individually formed IC packages each with a heat sink attached; thereby, thermal conductivity of a conventional IC package is enhanced.

Growing community of inventors

Tainan, Taiwan

Gin-Nan Yeh