Avago Technologies Ecbu IP (singapore) Pte. Ltd.

Cypress Semiconductor Corporation

Intellectual Discovery Co., Ltd.

Avago Technologies Ecbu IP Pte. Ltd.

Gin Ghee Tan

Kee Yean Ng

Yew Cheong Kuan

Cheng Why Tan

Kong Weng Lee

Weng Fei Wong

Siang Leong Foo

Chee Foo Lum

Keen Hun Leong

Lay Hong Lee

Lai Beng Teoh

Song Wah Ooi

Yik Foong Soo

Sai Hong Hung

A method for manufacturing a semiconductor device is disclosed. In one embodiment a semiconductor die is formed overlying a substrate. The semiconductor die is flip chip mounted to the substrate, wherein the substrate comprises a plurality of conductive traces. The semiconductor die and substrate are encapsulated with an encapsulating material. A top side of the encapsulating material is subjected to one of polishing, etching, and grinding to expose a top side of the semiconductor die. Finally, the bottom side of the substrate is subjected to one of polishing, etching, and grinding to remove the substrate and to reduce a thickness of the plurality of conductive traces.

High performance low profile QFN/LGA

A semiconductor device includes a light emitting semiconductor die mounted on at least one of first and second electrically conductive bonding pads, which are located on a first major surface of a substrate of the device. The light emitting semiconductor die has an anode and a cathode, which are electrically connected to the first and second electrically conductive bonding pads. The semiconductor device further includes first and second electrically conductive connecting pads, which are located on a second major surface of the substrate. The first and second electrically conductive bonding pads are electrically connected to the first and second electrically conductive connecting pads via first and second electrically conductive edge interconnecting elements.

Semiconductor device with a light emitting semiconductor die

A semiconductor device includes a light emitting semiconductor die mounted on at least one of first and second electrically conductive bonding pads, which are located on a first major surface of a substrate of the device. The light emitting semiconductor die has an anode and a cathode, which are electrically connected to the first and second electrically conductive bonding pads. The semiconductor device further includes first and second electrically conductive connecting pads, which are located on a second major surface of the substrate. The first and second electrically conductive bonding pads are electrically connected to the first and second electrically conductive connecting pads via first and second electrically conductive interconnecting elements.

An optical encoder includes an optical encoder pattern of alternating light elements and dark elements, and an optical unit, including an optical emitter providing light to the encoder pattern, and an optical sensor including a photo-detector receiving the light from the optical encoder pattern and in response thereto outputting a sinusoidal signal indicating relative movement between the optical sensor and the encoder pattern. In one embodiment, the photo-detector has a diamond shape, a modified-diamond shape, or an hourglass shape. In another embodiment, at least one of the light elements and the dark elements of the optical encoder pattern has a diamond shape, a modified-diamond shape, or an hourglass shape.

Optical encoder with sinusoidal photodetector output signal

A substantially planar substrate having opposed major surfaces is provided. The substrate includes a through hole that extends between the major surfaces. The through hole is filled with a conductive interconnecting element. A conductive mounting pad and a conductive connecting pad are formed on different ones of the major surfaces in electrical contact with the conductive interconnecting element. The packaging device formed by the method has a volume that is only a few times that of the semiconductor die and can be fabricated from materials that can withstand high-temperature die attach processes. The packaging device can be configured as the only packaging device used in the semiconductor device or as a submount for a semiconductor die that requires a high-temperature die attach process.

Method for fabricating a packaging device for semiconductor die and semiconductor device incorporating same

The packaging device includes a substrate, a mounting pad, a connecting pad and an interconnecting element. The substrate is substantially planar and has opposed major surfaces. The mounting pad is conductive and is located on one of the major surfaces. The connecting pad is conductive and is located on the other of the major surfaces. The conductive interconnecting element extends through the substrate and electrically interconnects the mounting pad and the connecting pad. The packaging device has a volume that is only a few times that of the semiconductor die and can be fabricated from materials that can withstand high-temperature die attach processes. The packaging device can be configured as the only packaging device used in the semiconductor device or as a submount for a semiconductor die that requires a high-temperature die attach process.

Growing community of inventors

Penang, Malaysia

Gin Ghee Tan